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公开(公告)号：US10514391B2
公开(公告)日：2019-12-24
申请号：US15665730
申请日：2017-08-01
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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公开(公告)号：US10663279B2
公开(公告)日：2020-05-26
申请号：US15441805
申请日：2017-02-24
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US11249110B2
公开(公告)日：2022-02-15
申请号：US16679223
申请日：2019-11-10
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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Patent Agency Ranking
公开(公告)号：US20180052189A1
公开(公告)日：2018-02-22
申请号：US15665730
申请日：2017-08-01
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
CPC classification number: G01R1/06761 , G01R1/06722 , G01R1/07307 , G01R1/07314 , G01R31/2831 , G01R31/2886
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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公开(公告)号：US20170227347A1
公开(公告)日：2017-08-10
申请号：US15421695
申请日：2017-02-01
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US20200072869A1
公开(公告)日：2020-03-05
申请号：US16679223
申请日：2019-11-10
Applicant: KLA-Tencor Corporation
Inventor： Walter H. Johnson, III , Nanchang Zhu , Xianghua Liu , Jianli Cui , Zhu-bin Shi , Zhuoxian Zhang , Haiyang You , Lu Yu , Jianou Shi , Fan Zhang
Abstract: Resistivity probes can be used to test integrated circuits. In one example, a resistivity probe has a substrate with multiple vias and multiple metal pins. Each of the metal pins is disposed in one of the vias. The metal pins extend out of the substrate. Interconnects provide an electrical connection to the metal pins. In another example, a resistivity probe has a substrate with a top surface and multiple elements extending from the substrate. Each of the elements curves from the substrate to a tip of the element such that each of the elements is non-parallel to the top surface of the substrate.
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公开(公告)号：US10598477B2
公开(公告)日：2020-03-24
申请号：US15421695
申请日：2017-02-01
Applicant: KLA—TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US20170227348A1
公开(公告)日：2017-08-10
申请号：US15441805
申请日：2017-02-24
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
IPC: G01B7/06
CPC classification number: G01B7/06
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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