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公开(公告)号：US20170227347A1
公开(公告)日：2017-08-10
申请号：US15421695
申请日：2017-02-01
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US10663279B2
公开(公告)日：2020-05-26
申请号：US15441805
申请日：2017-02-24
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US10598477B2
公开(公告)日：2020-03-24
申请号：US15421695
申请日：2017-02-01
Applicant: KLA—TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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公开(公告)号：US20170227348A1
公开(公告)日：2017-08-10
申请号：US15441805
申请日：2017-02-24
Applicant: KLA-TENCOR CORPORATION
Inventor： Xianghua Liu , Walter Johnson , Jianli Cui , Lu Yu , Nanchang Zhu , Juli Cheng , Huanglin Li , Liming Liu
IPC: G01B7/06
CPC classification number: G01B7/06
Abstract: Metal film thickness can be determined using the sheet resistance, resistivity, and temperature coefficient of resistivity for the metal film. Variation in film thickness measurements caused by resistivity can be reduced or eliminated. A probe head may be used for some of the measurements of the metal film. The probe head can include a temperature sensor used during sheet resistance measurements. A wafer on a chuck is heated, such as using the chuck or the probe head, for the measurements.
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