Overlay mark design for electron beam overlay

    公开(公告)号:US12055859B2

    公开(公告)日:2024-08-06

    申请号:US18204662

    申请日:2023-06-01

    CPC classification number: G03F7/70633 G03F7/70683

    Abstract: Electron beam overlay targets and method of performing overlay measurements on a target using a semiconductor metrology tool are provided. One target includes a plurality of electron beam overlay elements and a plurality of two-dimensional elements that provide at least one two-dimensional imaging. The plurality of two dimensional elements are an array of evenly-spaced polygonal gratings across at least three rows and at least three columns. Another target includes a plurality of electron beam overlay elements and a plurality of AIMid elements. Each of the electron beam overlay elements includes at least two gratings that are overlaid at a perpendicular orientation to each other. The plurality of AIMid elements includes at least two gratings that are overlaid at a perpendicular orientation to each other.

    Target design process for overlay targets intended for multi-signal measurements

    公开(公告)号:US11487929B2

    公开(公告)日:2022-11-01

    申请号:US16890689

    申请日:2020-06-02

    Inventor: Ira Naot

    Abstract: A method, system and computer program product for determination of a metrology target design, comprising generating a first candidate target design for a selected design type compatible with one or more metrology tools or and a set of boundaries for a simulation range Measurement of the first target design with the one or more metrology tools within the boundaries of the simulation range is simulated for two or more measurement settings to generate one or more performance metrics. Simulating the measurement takes into account layer properties of one or more layers in a stack profile. The optimal design is determined from at least the performance metrics based on one or more selection criteria and then sent or stored.

    OVERLAY MARK DESIGN FOR ELECTRON BEAM OVERLAY

    公开(公告)号:US20220413395A1

    公开(公告)日:2022-12-29

    申请号:US17487784

    申请日:2021-09-28

    Abstract: Electron beam overlay targets and method of performing overlay measurements on a target using a semiconductor metrology tool are provided. One target includes a plurality of electron beam overlay elements and a plurality of two-dimensional elements that provide at least one two-dimensional imaging. The plurality of two dimensional elements are an array of evenly-spaced polygonal gratings across at least three rows and at least three columns. Another target includes a plurality of electron beam overlay elements and a plurality of AIMid elements. Each of the electron beam overlay elements includes at least two gratings that are overlaid at a perpendicular orientation to each other. The plurality of AIMid elements includes at least two gratings that are overlaid at a perpendicular orientation to each other.

    TARGET DESIGN PROCESS FOR OVERLAY TARGETS INTENDED FOR MULTI-SIGNAL MEASUREMENTS

    公开(公告)号:US20210334448A1

    公开(公告)日:2021-10-28

    申请号:US16890689

    申请日:2020-06-02

    Inventor: Ira Naot

    Abstract: A method, system and computer program product for determination of a metrology target design, comprising generating a first candidate target design for a selected design type compatible with one or more metrology tools or and a set of boundaries for a simulation range Measurement of the first target design with the one or more metrology tools within the boundaries of the simulation range is simulated for two or more measurement settings to generate one or more performance metrics. Simulating the measurement takes into account layer properties of one or more layers in a stack profile. The optimal design is determined from at least the performance metrics based on one or more selection criteria and then sent or stored.

    OVERLAY MARK DESIGN FOR ELECTRON BEAM OVERLAY

    公开(公告)号:US20230324810A1

    公开(公告)日:2023-10-12

    申请号:US18204662

    申请日:2023-06-01

    CPC classification number: G03F7/70633 G03F7/70683

    Abstract: Electron beam overlay targets and method of performing overlay measurements on a target using a semiconductor metrology tool are provided. One target includes a plurality of electron beam overlay elements and a plurality of two-dimensional elements that provide at least one two-dimensional imaging. The plurality of two dimensional elements are an array of evenly-spaced polygonal gratings across at least three rows and at least three columns. Another target includes a plurality of electron beam overlay elements and a plurality of AIMid elements. Each of the electron beam overlay elements includes at least two gratings that are overlaid at a perpendicular orientation to each other. The plurality of AIMid elements includes at least two gratings that are overlaid at a perpendicular orientation to each other.

    Overlay mark design for electron beam overlay

    公开(公告)号:US11703767B2

    公开(公告)日:2023-07-18

    申请号:US17487784

    申请日:2021-09-28

    CPC classification number: G03F7/70633 G03F7/70683

    Abstract: Electron beam overlay targets and method of performing overlay measurements on a target using a semiconductor metrology tool are provided. One target includes a plurality of electron beam overlay elements and a plurality of two-dimensional elements that provide at least one two-dimensional imaging. The plurality of two dimensional elements are an array of evenly-spaced polygonal gratings across at least three rows and at least three columns. Another target includes a plurality of electron beam overlay elements and a plurality of AIMid elements. Each of the electron beam overlay elements includes at least two gratings that are overlaid at a perpendicular orientation to each other. The plurality of AIMid elements includes at least two gratings that are overlaid at a perpendicular orientation to each other.

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