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公开(公告)号：USD771750S1
公开(公告)日：2016-11-15
申请号：US29505929
申请日：2016-04-14
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公开(公告)号：USD801439S1
公开(公告)日：2017-10-31
申请号：US29505807
申请日：2016-02-16
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公开(公告)号：USD801438S1
公开(公告)日：2017-10-31
申请号：US29505803
申请日：2016-02-13
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公开(公告)号：US20110315302A1
公开(公告)日：2011-12-29
申请号：US13228826
申请日：2011-09-09
CPC分类号： H05K1/189 , B32B37/12 , B32B37/153 , B32B2307/202 , B32B2457/08 , B32B2519/02 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/93 , H01L25/0655 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/2929 , H01L2224/29299 , H01L2224/48465 , H01L2224/83001 , H01L2224/83191 , H01L2224/83385 , H01L2224/838 , H01L2924/00013 , H01L2924/01013 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/15165 , H01L2924/3025 , H05K3/007 , H05K3/284 , H05K2201/066 , H05K2201/10719 , H05K2203/0156 , H05K2203/0173 , H05K2203/1469 , H01L2924/00 , H01L2924/00014 , H01L2224/29099 , H01L2224/29199
摘要： An Occam process (solderless manufacturing) that employs a component support fixture that provides permanent or temporary support for components during subsequent processing in a solderless process for electrically connecting the components to circuits. The component support fixture provides oversized compartments for housing the components which may have varying sizes. The compartments are provided with vent holes or apertures for venting air or excess glue as the component support is pressed against the components during manufacture.
摘要翻译： 采用组件支撑固定装置的奥卡姆工艺（无焊制造），可在后续处理中为组件提供永久或临时支持，以便将组件电连接到电路。 部件支撑夹具提供超大的隔间以容纳可能具有不同尺寸的部件。 隔间设置有用于排出空气或多余胶水的通气孔或孔，因为在制造过程中部件支撑件被压在部件上。
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公开(公告)号：US10517174B1
公开(公告)日：2019-12-24
申请号：US16400695
申请日：2019-05-01
摘要： A rigid flex circuit comprised of high thermal conductivity sections, said sections having components disposed so as to have their contacts substantially planar with the surface of the thermally conductive section and wherein the contacts are interconnected directly to the traces without the use of solder and further having the thermally conductive sections interconnected to one another by means of flexible circuit sections.
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6.发明申请公开(公告)号：US20170333782A1
公开(公告)日：2017-11-23
申请号：US15419927
申请日：2017-01-30
CPC分类号： A63F9/0415 , A63F9/0468 , A63F2007/4012 , A63F2009/0422 , A63F2009/0431 , A63F2009/0437 , A63F2009/0446 , A63F2250/063
摘要： The current document is directed to gaming dice, including physical dice and virtual dice represented on an electronic display or viewing screen. Certain of the currently disclosed gaming dice have approximately ovoid, prolate spheroid, or ellipsoid shapes that are modified to include planar surfaces. Other of the disclosed gaming dice have angular shapes, including cubes, tetrahedrons, octahedrons, and other regular shapes that are modified to provide nonuniform probabilities of position landings.
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公开(公告)号：US07981703B2
公开(公告)日：2011-07-19
申请号：US12191544
申请日：2008-08-14
IPC分类号： H01L21/00
CPC分类号： H05K1/144 , H01L24/73 , H01L2224/32225 , H01L2224/32245 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/3025 , H05K1/185 , H05K1/186 , H05K3/284 , H05K3/4046 , H05K2201/041 , H05K2201/10318 , H05K2203/065 , H05K2203/1316 , H05K2203/1327 , Y10T29/49117 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.
摘要翻译： 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。
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公开(公告)号：USD828453S1
公开(公告)日：2018-09-11
申请号：US29651293
申请日：2018-03-30
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公开(公告)号：USD806175S1
公开(公告)日：2017-12-26
申请号：US29505809
申请日：2016-02-16
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公开(公告)号：USD774144S1
公开(公告)日：2016-12-13
申请号：US29620049
申请日：2016-06-02
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