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    CMP system with temperature-controlled polishing head
    1.
    发明授权
    CMP system with temperature-controlled polishing head 有权
    CMP系统带有温度控制的抛光头

    公开(公告)号：US07335088B1

    公开(公告)日：2008-02-26

    申请号：US11653615

    申请日：2007-01-16

    Applicant: Jerry Hwang ,  Cheng Hsun Chan

    Inventor： Jerry Hwang ,  Cheng Hsun Chan

    IPC: B24B51/00 ,  B24B1/00 ,  B24B5/00

    CPC classification number: B24B37/30 ,  B24B41/061 ,  B24B49/14

    Abstract: A chemical mechanical polish system for polishing a wafer includes a polishing head; an inner tube connected to the polishing head, wherein the inner tube is filled with a heat media; a media heater connected to the inner tube; and a pressure controller connected to the inner tube.

    Abstract translation: 用于抛光晶片的化学机械抛光系统包括抛光头; 连接到抛光头的内管，其中内管填充有热介质; 连接到内管的介质加热器; 以及连接到内管的压力控制器。

    Systems and methods for temperature control of semiconductor wafers
    4.
    发明申请
    Systems and methods for temperature control of semiconductor wafers 审中-公开
    半导体晶圆温度控制系统和方法

    公开(公告)号：US20060023395A1

    公开(公告)日：2006-02-02

    申请号：US11085354

    申请日：2005-03-21

    Applicant: Yi-Li Hsiao ,  Tse-Yi Chen ,  Jerry Hwang ,  Chin-Hsin Peng ,  Jean Wang ,  Chen-Hua Yu

    Inventor： Yi-Li Hsiao ,  Tse-Yi Chen ,  Jerry Hwang ,  Chin-Hsin Peng ,  Jean Wang ,  Chen-Hua Yu

    IPC: H01T23/00

    CPC classification number: H01L21/6831 ,  H01L21/67109

    Abstract: Systems and methods for temperature control of semiconductor wafers are provided. An exemplary embodiment of semiconductor wafer is held by an electrostatic chuck. An exemplary embodiment of system includes a cooling apparatus connecting the electrostatic chuck. The cooling apparatus comprises an inlet, an outlet, a porous flow layer, a porous contact layer contacting the electrostatic chuck, and a porous heat exchange layer disposed between the flow layer and the contact layer. The inlet communicates with the flow layer, and the outlet communicates with the contact layer. The fluid medium is introduced into the flow layer from the inlet and sequentially flows through the heat exchange layer and the contact layer. The fluid medium is discharged from the contact layer through the outlet, thereby exchanging heat from the semiconductor wafer.

    Abstract translation: 提供了用于半导体晶片温度控制的系统和方法。 半导体晶片的示例性实施例由静电卡盘保持。 系统的示例性实施例包括连接静电卡盘的冷却装置。 冷却装置包括入口，出口，多孔流动层，与静电卡盘接触的多孔接触层和设置在流动层和接触层之间的多孔热交换层。 入口与流动层连通，出口与接触层连通。 流体介质从入口引入流层，并依次流过热交换层和接触层。 流体介质通过出口从接触层排出，从而交换来自半导体晶片的热量。

    Managing and evaluating procurement risk
    5.
    发明授权
    Managing and evaluating procurement risk 有权
    管理和评估采购风险

    公开(公告)号：US07747500B2

    公开(公告)日：2010-06-29

    申请号：US10978895

    申请日：2004-11-01

    Applicant: Jerry Hwang ,  Venu Nagali

    Inventor： Jerry Hwang ,  Venu Nagali

    IPC: G06Q40/00

    CPC classification number: G06Q40/08 ,  G06Q40/04 ,  G06Q40/06

    Abstract: Methods, systems, and computer programs that enable procurement risk to be efficiently and effectively managed and evaluated are described. In one aspect, inputs specifying one or more forward contracts in a sourcing portfolio for procuring a resource from one or more suppliers are received. Inputs specifying one or more aspects of a target sourcing strategy for procuring the resource also are received. A procurement risk evaluation report comparing the sourcing portfolio and the target sourcing strategy is presented.

    Abstract translation: 描述了使采购风险得到有效和有效管理和评估的方法，系统和计算机程序。 在一方面，接收指定来自一个或多个供应商的资源的采购组合中的一个或多个远期合约的输入。 指定用于采购资源的目标采购策略的一个或多个方面的输入也被接收。 介绍采购风险评估报告，比较采购组合和目标采购策略。

    Graphical user interface for procurement risk management system
    6.
    发明授权
    Graphical user interface for procurement risk management system 有权
    用于采购风险管理系统的图形用户界面

    公开(公告)号：US07590937B2

    公开(公告)日：2009-09-15

    申请号：US10264975

    申请日：2002-10-03

    Applicant: Greg C. Jacobus ,  Thomas D. Olavson ,  Jerry Hwang ,  Venu Nagali

    Inventor： Greg C. Jacobus ,  Thomas D. Olavson ,  Jerry Hwang ,  Venu Nagali

    IPC: G06F3/00 ,  G06F17/30

    CPC classification number: G06Q10/087 ,  G06Q10/06315 ,  G06Q10/0635 ,  G06Q30/0202 ,  G06Q40/06

    Abstract: Systems and methods for managing procurement risk are described. In accordance with a procurement risk management method, a resource sourcing mix is computed from a sourcing portfolio of one or more forward contracts, spot market purchases, and inventory depletion for each period of a planning horizon based on forecast scenarios for resource demand, resource price, and resource availability and a specified inventory carrying policy for the resource. Based upon the computed resource sourcing mix, one or more metrics for evaluating the sourcing portfolio are computed. A system and a computer program implementing the above-described procurement risk management method also are described.

    Abstract translation: 描述了管理采购风险的系统和方法。 根据采购风险管理方法，根据资源需求，资源价格的预测情景，从规划期的每个时期的一个或多个远期合约，现货市场采购和库存消耗的采购组合计算资源采购组合 ，资源可用性和资源的指定库存携带政策。 基于计算的资源采购组合，计算用于评估采购组合的一个或多个度量。 还描述了实现上述采购风险管理方法的系统和计算机程序。

    Managing and evaluating procurement risk
    7.
    发明申请
    Managing and evaluating procurement risk 有权
    管理和评估采购风险

    公开(公告)号：US20060095362A1

    公开(公告)日：2006-05-04

    申请号：US10978895

    申请日：2004-11-01

    Applicant: Jerry Hwang ,  Venu Nagali

    Inventor： Jerry Hwang ,  Venu Nagali

    IPC: G06Q40/00

    CPC classification number: G06Q40/08 ,  G06Q40/04 ,  G06Q40/06

    Abstract: Methods, systems, and computer programs that enable procurement risk to be efficiently and effectively managed and evaluated are described. In one aspect, inputs specifying one or more forward contracts in a sourcing portfolio for procuring a resource from one or more suppliers are received. Inputs specifying one or more aspects of a target sourcing strategy for procuring the resource also are received. A procurement risk evaluation report comparing the sourcing portfolio and the target sourcing strategy is presented.

    Abstract translation: 描述了使采购风险得到有效和有效管理和评估的方法，系统和计算机程序。 在一方面，接收指定来自一个或多个供应商的资源的采购组合中的一个或多个远期合约的输入。 指定用于采购资源的目标采购策略的一个或多个方面的输入也被接收。 介绍采购风险评估报告，比较采购组合和目标采购策略。

    Chemical mechanical polish system having multiple slurry-dispensing systems
    8.
    发明申请
    Chemical mechanical polish system having multiple slurry-dispensing systems 审中-公开
    具有多个浆料分配系统的化学机械抛光系统

    公开(公告)号：US20080305725A1

    公开(公告)日：2008-12-11

    申请号：US11493144

    申请日：2006-07-26

    Applicant: Chen-Hua Yu ,  Jerry Hwang

    Inventor： Chen-Hua Yu ,  Jerry Hwang

    IPC: B24B29/00

    CPC classification number: B24B37/04 ,  B24B57/02 ,  H01L21/3212

    Abstract: A chemical mechanical polish system includes a polishing pad, a platen supporting and rotating the polishing pad, a top slurry dispenser placed over a polishing pad, a bottom slurry dispenser placed through an opening in the polishing pad, and a duct connected to the bottom slurry dispenser, the duct extending toward the bottom of the polishing pad.

    Abstract translation: 化学机械抛光系统包括抛光垫，支撑和旋转抛光垫的压板，放置在抛光垫上的顶部浆料分配器，通过抛光垫中的开口放置的底部浆液分配器，以及连接到底部浆料 分配器，导管朝向抛光垫的底部延伸。

    Polishing apparatus
    9.
    发明授权
    Polishing apparatus 有权
    抛光设备

    公开(公告)号：US07267600B1

    公开(公告)日：2007-09-11

    申请号：US11423553

    申请日：2006-06-12

    Applicant: Yu-Liang Lin ,  Jerry Hwang

    Inventor： Yu-Liang Lin ,  Jerry Hwang

    IPC: B24B49/00

    CPC classification number: B24B37/30 ,  B24B49/003 ,  B24B49/16 ,  Y10S451/91

    Abstract: Apparatus for polishing are provided. An apparatus comprises a fluid controller, a polishing apparatus and a fluid interface membrane. The fluid controller is fluidly coupled to the polishing apparatus by way of at least one conduit. The fluid interface membrane is disposed within at least one of the fluid controller, the conduit and the polishing apparatus to separate a first fluid and a second fluid and to transfer pressure from the first fluid to the second fluid.

    Abstract translation: 提供用于抛光的装置。 一种装置包括流体控制器，抛光装置和流体界面膜。 流体控制器通过至少一个管道流体地联接到抛光装置。 流体界面膜设置在至少一个流体控制器，管道和抛光装置内，以分离第一流体和第二流体，并将压力从第一流体转移到第二流体。

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