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    Rotary magnetron magnet bar and apparatus containing the same for high target utilization
    1.
    发明授权
    Rotary magnetron magnet bar and apparatus containing the same for high target utilization 有权
    旋转磁控管磁棒和含有相同目的的高磁导率仪器

    公开(公告)号：US09388490B2

    公开(公告)日：2016-07-12

    申请号：US13504366

    申请日：2010-10-26

    Applicant: John E. Madocks ,  Patrick Lawrence Morse ,  Phong Ngo

    Inventor： John E. Madocks ,  Patrick Lawrence Morse ,  Phong Ngo

    IPC: H01J37/34 ,  C23C14/35 ,  C23C14/34

    CPC classification number: C23C14/54 ,  C23C14/3407 ,  C23C14/35 ,  H01J37/3405 ,  H01J37/342 ,  H01J37/3452 ,  H01J37/3482 ,  H01J2237/24585 ,  H01J2237/332

    Abstract: An apparatus for coating a substrate is provided that includes a racetrack-shaped plasma source having two straight portions and at least one terminal turnaround portion connecting said straight portions. A tubular target formed of a target material that forms a component of the coating has an end. The target is in proximity to the plasma source for sputtering of the target material. The target is secured to a tubular backing cathode, with both being rotatable about a central axis. A set of magnets are arranged inside the cathode to move an erosion zone aligned with the terminal turnaround toward the end of the target as the target is utilized to deposit the coating on the substrate. Target utilization of up to 87 weight percent the initial target weight is achieved.

    Abstract translation: 提供了一种用于涂覆基板的设备，其包括具有两个直线部分的跑道形等离子体源和连接所述直线部分的至少一个终端周转部分。 由形成涂层组分的目标材料形成的管状目标具有一端。 目标在等离子体源附近用于目标材料的溅射。 目标被固定到管状背衬阴极，两者都可围绕中心轴线旋转。 一组磁体布置在阴极内部，以便当靶被用于将涂层沉积在基底上时，将与端子周转的侵蚀区域朝向靶的端部移动。 目标利用率达到初始目标重量的87％（重量）。

    Device for measuring the profile of a metal film sputter deposition target, and system and method employing same
    4.
    发明申请
    Device for measuring the profile of a metal film sputter deposition target, and system and method employing same 审中-公开
    用于测量金属膜溅射沉积靶的轮廓的装置，以及使用其的系统和方法

    公开(公告)号：US20050023132A1

    公开(公告)日：2005-02-03

    申请号：US10923233

    申请日：2004-08-19

    Applicant: Mark Jaso

    Inventor： Mark Jaso

    IPC: C23C14/34 ,  C23C14/54 ,  C23C14/32

    CPC classification number: H01J37/3482 ,  C23C14/3407 ,  C23C14/54 ,  C23C14/543 ,  C23C14/564

    Abstract: An apparatus and method for measuring the erosion profile of a metallic target in a sputtering device are provided by inserting a thin sensor into a gap between the target and a substrate pedestal. The sensor is configured to emit an energy beam toward the surface of the target and to detect a reflection of the energy beam. The sensor may comprise a source element configured to emit a collimated light beam and a plurality of detectors arranged in a linear array. The sensor may also comprise optical fibers configured to reduce the size of the sensor. The detectors are positioned relative to the source element so that one of the detectors in the array will be illuminated by a reflection of the collimated light beam. The distance from the sensor to the target may be derived from the position of the detector illuminated by the reflected beam.

    Abstract translation: 通过将薄传感器插入到靶和基板基座之间的间隙中来提供用于测量溅射装置中的金属靶的侵蚀曲线的装置和方法。 传感器被配置为向目标表面发射能量束并检测能量束的反射。 传感器可以包括被配置为发射准直光束的源元件和布置成线性阵列的多个检测器。 传感器还可以包括配置成减小传感器尺寸的光纤。 检测器相对于源元件定位，使得阵列中的一个检测器将被准直光束的反射照亮。 从传感器到目标的距离可以从由反射光束照射的检测器的位置导出。

    Target and method of optimizing target profile
    5.
    发明申请
    Target and method of optimizing target profile 失效
    目标和优化目标轮廓的方法

    公开(公告)号：US20030183506A1

    公开(公告)日：2003-10-02

    申请号：US10312050

    申请日：2003-04-29

    Inventor： Eugene Y Ivanov ,  David A Smathers ,  Charles E Wickersham ,  Lin Zhu

    IPC: C23C014/32

    CPC classification number: H01J37/3482 ,  C23C14/3407 ,  C23C14/35

    Abstract: A method of constructing increased life sputter targets and targets made by the method are disclosed. The method comprises starting with a precursor target design or profile and making magnetic field strength measurements along the radial surface of same and at a plurality of vertical dimensions above the surface. An optimal magnetic field strength ratio is provided between the erosion tracks of the target. The vertical dimension of the material to be added to one of the erosion tracks is determined and then the height of the other erosion track is calculated by utilizing this optimal magnetic field strength ratio.

    Abstract translation: 公开了一种通过该方法制造增加寿命的溅射靶和靶的方法。 该方法包括从前体靶设计或轮廓开始，并沿着相同的表面的径向表面和在表面上方的多个垂直尺寸进行磁场强度测量。 在目标的侵蚀轨迹之间提供最佳磁场强度比。 确定要添加到一个侵蚀轨迹中的材料的垂直尺寸，然后通过利用该最佳磁场强度比来计算另一个侵蚀轨迹的高度。

    SPUTTERING APPARATUS
    6.
    发明申请
    SPUTTERING APPARATUS 有权
    溅射装置

    公开(公告)号：US20120175251A1

    公开(公告)日：2012-07-12

    申请号：US13344871

    申请日：2012-01-06

    Applicant: Daniel Theodore Crowley ,  William A. Meredith

    Inventor： Daniel Theodore Crowley ,  William A. Meredith

    IPC: C23C14/35

    CPC classification number: C23C14/35 ,  C23C14/354 ,  H01J37/3405 ,  H01J37/342 ,  H01J37/345 ,  H01J37/3452 ,  H01J37/347 ,  H01J37/3482

    Abstract: In one embodiment, a magnetron assembly comprises a plurality of magnets and a yoke configured to hold the plurality of magnets in at least four independent linear arrays. The plurality of magnets is arranged in the yoke so as to form a pattern comprising an outer portion and an inner portion. The outer portion substantially surrounds the perimeter of the inner portion. The magnets used to form the outer portion have a first polarity and the magnets used to form the inner portion having a second polarity. The outer portion of the pattern comprises a pair of elongated sections that are substantially parallel to one another. The outer portion of the pattern comprises a pair of turnaround sections, wherein each turnaround section substantially spans respective ends of the pair of elongated sections and wherein each turnaround section comprises a plurality of magnets having the first polarity. Other embodiments are described.

    Abstract translation: 在一个实施例中，磁控管组件包括多个磁体和配置成将多个磁体保持在至少四个独立的线性阵列中的磁轭。 多个磁铁布置在磁轭中，以形成包括外部部分和内部部分的图案。 外部部分基本上围绕内部的周边。 用于形成外部部分的磁体具有第一极性，并且用于形成具有第二极性的内部部分的磁体。 图案的外部部分包括基本上彼此平行的一对细长部分。 图案的外部部分包括一对转向部分，其中每个折回部分基本跨过该对细长部分的相应端部，并且其中每个周转部分包括具有第一极性的多个磁体。 描述其他实施例。

    PREDICTION AND COMPENSATION OF EROSION IN A MAGNETRON SPUTTERING TARGET
    7.
    发明申请
    PREDICTION AND COMPENSATION OF EROSION IN A MAGNETRON SPUTTERING TARGET 失效
    磁控溅射目标中的腐蚀预测和补偿

    公开(公告)号：US20090159428A1

    公开(公告)日：2009-06-25

    申请号：US11961921

    申请日：2007-12-20

    Applicant: KEITH A. MILLER ,  Daniel C. Lubben

    Inventor： KEITH A. MILLER ,  Daniel C. Lubben

    IPC: C23C14/35 ,  C23C14/54

    CPC classification number: C23C14/35 ,  H01J37/3408 ,  H01J37/3482

    Abstract: When a magnetron is scanned about the back of a target in a selected complex path having radial components, the erosion profile has a form depending upon the selection of paths. A radial erosion rate profile for a given magnetron is measured. Periodically during scanning, an erosion profile is calculated from the measured erosion rate profile, the time the magnetron spends at different radii, and the target power. The calculated erosion profile may be used to indicate when erosion has become excessive at any location prompting target replacement or to adjust the height of the magnetron above the target for repeated scans. In another aspect of the invention, the magnetron height is dynamically adjusted during a scan to compensate for erosion. The compensation may be based on the calculated erosion profile or on feedback control of the present value of the target voltage for a constant-power target supply.

    Abstract translation: 当在选定的具有径向分量的复合路径中围绕目标的背面扫描磁控管时，侵蚀曲线具有取决于路径选择的形式。 测量给定磁控管的径向侵蚀速率曲线。 在扫描期间，从测量的侵蚀速率曲线，磁控管在不同半径处花费的时间和目标功率计算出侵蚀曲线。 计算的侵蚀曲线可用于指示在任何位置的侵蚀已经变得过大，促使目标更换，或者调整靶上方磁控管的高度以重复扫描。 在本发明的另一方面，在扫描期间磁控管高度被动态地调节以补偿侵蚀。 补偿可以基于所计算的侵蚀曲线或对于恒定功率目标电源的目标电压的当前值的反馈控制。

    High purity sputter targets with target end-of-life indication and method of manufacture
    9.
    发明授权
    High purity sputter targets with target end-of-life indication and method of manufacture 有权
    具有目标寿命终止指示和制造方法的高纯度溅射靶

    公开(公告)号：US07063773B2

    公开(公告)日：2006-06-20

    申请号：US10344783

    申请日：2001-08-17

    Applicant: Eugene Y. Ivanov ,  David B. Smathers ,  Charles E. Wickersham, Jr. ,  John E. Poole

    Inventor： Eugene Y. Ivanov ,  David B. Smathers ,  Charles E. Wickersham, Jr. ,  John E. Poole

    IPC: C23C14/34

    CPC classification number: H01J37/3435 ,  C23C14/3407 ,  C23C14/3414 ,  H01J37/3426 ,  H01J37/3482 ,  H01J37/3491

    Abstract: A preferred sputter target assembly (10, 10′) comprises a target (12, 12′), a backing plate (14, 14′) bonded to the target (12, 12′) along an interface (22, 22′) and dielectric particles (20, 20′) between the target (12, 12′) and the backing plate (14, 14′). A preferred method for manufacturing the sputter target assembly (10, 10′) comprises the steps of providing the target (12, 12′) and the backing plate (14, 14′); distributing the dielectric particles (20, 20′) between mating surfaces (24, 26) of the target (12, 12′) and the backing plate (14, 14′), most preferably along a sputtering track pattern on one of the mating surfaces; and bonding the target (12, 12′) to the backing plate (14, 14′) along the mating surfaces (24, 26). A preferred method for sputtering in accordance with the invention comprises the steps of applying electrical power to the sputter target (50, 160); causing the sputter target assembly (50, 160) to produce an electromagnetic signal (not shown) when a target end-of-life condition exists; and monitoring the sputter target assembly (50, 160) to detect the electromagnetic signal.

    Abstract translation: 优选的溅射靶组件（10,10'）包括靶（12,12'），沿着界面（22,22'）结合到靶（12,12'）的背板（14,14'）和 在目标（12,12'）和背板（14,14'）之间的介电颗粒（20,20'）。 用于制造溅射靶组件（10,10'）的优选方法包括提供靶（12,12'）和背板（14,14'）的步骤。 在所述靶（12,12'）的配合表面（24,26）和所述背板（14,14'）之间分布所述电介质颗粒（20,20'），最优选地沿着所述匹配中的一个上的溅射轨迹图案 表面 以及沿所述配合表面（24,26）将所述目标（12,12'）结合到所述背板（14,14'）。 根据本发明的优选溅射方法包括以下步骤：向溅射靶（50,160）施加电力; 当存在目标寿命终止状态时，使溅射靶组件（50,160）产生电磁信号（未示出）; 以及监测溅射靶组件（50,160）以检测电磁信号。

    Apparatus, method and system for monitoring chamber parameters associated with a deposition process
    10.
    发明授权
    Apparatus, method and system for monitoring chamber parameters associated with a deposition process 失效
    用于监测与沉积过程相关的室参数的装置，方法和系统

    公开(公告)号：US06974524B1

    公开(公告)日：2005-12-13

    申请号：US10609297

    申请日：2003-06-27

    Applicant: Mark A. Jaso ,  Terry L. Gilton

    Inventor： Mark A. Jaso ,  Terry L. Gilton

    IPC: C23C14/34 ,  C23C14/54 ,  G01N17/00

    CPC classification number: H01J37/3482 ,  C23C14/3407 ,  C23C14/54 ,  C23C14/543 ,  C23C14/564

    Abstract: Apparatus and methods for measuring characteristics of a metallic target as well as other interior surfaces of a sputtering chamber. The apparatus includes a sensor configured to emit an energy beam toward a surface of interest and to detect an energy beam therefrom, the detected energy beam being indicative of parameters of a characteristic of interest of the surface of interest. Quantitative and qualitative characteristics of interest may be determined. A sputtering system including the apparatus and operable according to the methods of the invention is also disclosed.

    Abstract translation: 用于测量金属靶以及溅射室的其它内表面的特性的装置和方法。 该装置包括传感器，该传感器被配置为朝着感兴趣的表面发射能量束并且从其中检测能量束，所检测的能量束指示感兴趣的表面的感兴趣特征的参数。 可以确定感兴趣的定量和定性特征。 还公开了包括该装置并且可根据本发明的方法操作的溅射系统。

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