公开(公告)号：US20170127533A1

公开(公告)日：2017-05-04

申请号：US15375176

申请日：2016-12-12

申请人： JSR CORPORATION

发明人： JUN MUKAWA ,  SEIICHIROU TAKAHASHI ,  KOUICHI HASEGAWA ,  KATSUMI INOMATA

IPC分类号： H05K3/40 ,  H05K3/34 ,  H05K3/06 ,  G03F7/30 ,  B23K35/02 ,  G03F7/16 ,  G03F7/20 ,  H05K1/11 ,  H05K3/36

CPC分类号： H05K3/4007 ,  B23K35/0244 ,  B23K2101/42 ,  G03F7/162 ,  G03F7/20 ,  G03F7/30 ,  H01L2224/11 ,  H05K1/111 ,  H05K3/064 ,  H05K3/3431 ,  H05K3/3468 ,  H05K3/368 ,  H05K2203/0577

摘要： A production process for a solder electrode, including: a step (I) of forming an opening in a portion of a film provided on a substrate having an electrode pad, the portion corresponding to the electrode pad on the substrate, and thereby forming a resist from the film on the substrate, and a step (II) of filling the opening of the resist with molten solder, wherein the resist is composed of at least two layers each containing a resin as a constituent, and a layer (1) of the resist, the layer (1) being closest to the substrate, does not substantially contain a component that thermally crosslinks the resin contained as a constituent in the layer (1) and a component that undergoes thermal self-crosslinking.

公开(公告)号：US20180174989A1

公开(公告)日：2018-06-21

申请号：US15565904

申请日：2016-03-01

申请人： JSR CORPORATION

发明人： JUN MUKAWA ,  SEIICHIROU TAKAHASHI ,  KOUICHI HASEGAWA ,  SHIROU KUSUMOTO

IPC分类号： H01L23/00

CPC分类号： H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/11 ,  H01L2224/1131 ,  H01L2224/11312 ,  H01L2224/1147 ,  H01L2224/11618 ,  H01L2224/11622 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/81002 ,  H01L2224/81203 ,  H01L2924/01047 ,  H01L2924/01029

摘要： The present disclosure relates to a production process for a solder electrode, including a step (1) of forming a coating film of a photosensitive resin composition on a substrate having an electrode pad; a step (2) of forming resist having an opening in a region corresponding to the electrode pad by selectively exposing the coating film to light and further developing the film; a step (3) of heating and/or exposing the resist to light; and a step (4) of filling the opening with molten solder while heating the solder. According to the production process for the solder electrode of the present disclosure, development of cracks on a resist surface can be prevented, and solder filling capability can be improved, even when the resist receives high heat during solder filling as in an IMS method, and therefore the solder electrode adapted for the purpose can be appropriately produced.