公开(公告)号：US20160375652A1

公开(公告)日：2016-12-29

申请号：US15038738

申请日：2014-10-30

申请人： JSR CORPORATION

发明人： TORAHIKO YAMAGUCHI ,  HIROYUKI ISHII ,  KATSUMI INOMATA

IPC分类号： B32B7/06 ,  B32B37/12 ,  H01L21/683 ,  B32B38/10 ,  C09J165/00 ,  B32B7/12 ,  B32B43/00

CPC分类号： B32B7/06 ,  B32B7/12 ,  B32B27/08 ,  B32B27/18 ,  B32B27/308 ,  B32B27/36 ,  B32B37/1284 ,  B32B38/10 ,  B32B43/006 ,  B32B2037/268 ,  B32B2307/748 ,  B32B2457/14 ,  C08G2261/3324 ,  C08G2261/418 ,  C08L53/02 ,  C08L83/04 ,  C09J165/00 ,  H01L21/6835 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2221/68386

摘要： There is shown a stack including a substrate material temporarily fixed on a support via a temporary fixing material, wherein the temporary fixing material includes a temporary fixing material layer (I) in contact with the support-facing surface of the substrate material, and a temporary fixing material layer (II) formed on the support-facing surface of the layer (I), wherein the temporary fixing material layer (I) is formed of a temporary fixing composition containing a polymer (A) and a release agent (B) which contains a functional group capable of reacting with the polymer (A) to form a chemical bond.

摘要翻译： 示出了包括通过临时固定材料临时固定在支撑件上的基板材料的堆叠，其中临时固定材料包括与基板材料的面向支撑表面接触的临时固定材料层（I）和临时固定材料层 固定材料层（II）形成在层（I）的面向支撑体的表面上，其中临时固定材料层（I）由含有聚合物（A）和脱模剂（B）的临时固定组合物形成， 含有能够与聚合物（A）反应形成化学键的官能团。

公开(公告)号：US20170127533A1

公开(公告)日：2017-05-04

申请号：US15375176

申请日：2016-12-12

申请人： JSR CORPORATION

发明人： JUN MUKAWA ,  SEIICHIROU TAKAHASHI ,  KOUICHI HASEGAWA ,  KATSUMI INOMATA

IPC分类号： H05K3/40 ,  H05K3/34 ,  H05K3/06 ,  G03F7/30 ,  B23K35/02 ,  G03F7/16 ,  G03F7/20 ,  H05K1/11 ,  H05K3/36

CPC分类号： H05K3/4007 ,  B23K35/0244 ,  B23K2101/42 ,  G03F7/162 ,  G03F7/20 ,  G03F7/30 ,  H01L2224/11 ,  H05K1/111 ,  H05K3/064 ,  H05K3/3431 ,  H05K3/3468 ,  H05K3/368 ,  H05K2203/0577

摘要： A production process for a solder electrode, including: a step (I) of forming an opening in a portion of a film provided on a substrate having an electrode pad, the portion corresponding to the electrode pad on the substrate, and thereby forming a resist from the film on the substrate, and a step (II) of filling the opening of the resist with molten solder, wherein the resist is composed of at least two layers each containing a resin as a constituent, and a layer (1) of the resist, the layer (1) being closest to the substrate, does not substantially contain a component that thermally crosslinks the resin contained as a constituent in the layer (1) and a component that undergoes thermal self-crosslinking.