公开(公告)号：US20200051813A1

公开(公告)日：2020-02-13

申请号：US16550695

申请日：2019-08-26

Applicant: JSR CORPORATION

Inventor： Hitoshi OSAKI ,  Hiroyuki KOMATSU

IPC: H01L21/02

Abstract: A selective modification method of a base material surface includes subjecting at least a part of a surface of a base material to at least one surface treatment selected from the group consisting of an oxidization treatment and a hydrophilization treatment. The base material includes a surface layer and includes an oxide, a nitride or an oxynitride of silicon, or a combination thereof in a first region of the surface layer. A nonphotosensitive composition is applied directly or indirectly on the surface of the base material after the surface treatment. The nonphotosensitive composition includes: a first polymer containing a nitrogen atom; and a solvent. It is preferred that the base material contains a metal in a second region which is other than the first region of the surface layer. In the surface treatment step, an O2 plasma treatment is preferably conducted.

公开(公告)号：US20180192524A1

公开(公告)日：2018-07-05

申请号：US15396067

申请日：2016-12-30

Applicant: JSR CORPORATION

Inventor： Hitoshi OSAKI

IPC: H05K3/42 ,  B05D1/00 ,  B05D3/02 ,  G03F7/00 ,  B05D3/10

CPC classification number: H01L21/477 ,  B81C2201/0149 ,  G03F7/0002 ,  H01L21/027 ,  H01L21/76205 ,  H05K3/061 ,  Y10S438/942

Abstract: A contact hole pattern-forming method includes forming a hole pattern on a front face side of a substrate, directly or via other layer. A first composition including a first polymer is applied circularly in a planar view so as to coat lateral faces of holes of the hole pattern. A resin layer is provided on the front face side of the substrate and inside the lateral faces of the holes from a second composition including a second polymer. The resin layer is heated. A part of the resin layer heated is removed. The substrate is etched using a resist pattern formed. The first polymer includes a group being bound to at least one end of a main chain of the first polymer, and being capable of interacting with a third polymer constituting the hole pattern. The second polymer is a homopolymer or a random copolymer.

公开(公告)号：US20210318614A9

公开(公告)日：2021-10-14

申请号：US16905946

申请日：2020-06-19

Applicant: JSR CORPORATION

Inventor： Hitoshi OSAKI

IPC: G03F7/039 ,  G03F7/038 ,  G03F7/004 ,  C08F212/08 ,  C09D125/14

Abstract: A pattern-forming method includes: applying a radiation-sensitive composition containing a polymer and a radiation-sensitive acid generating agent on a surface of a substrate to form a coating film on the surface of the substrate; exposing the coating film; and developing the coating film exposed. The polymer has a first structural unit represented by formula (1). In the formula (1), R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group; and A represents a monovalent organic group having a nitrogen atom.

公开(公告)号：US20190107777A1

公开(公告)日：2019-04-11

申请号：US16199767

申请日：2018-11-26

Applicant: JSR Corporation

Inventor： Hitoshi OSAKI

IPC: G03F7/00 ,  H01L21/027 ,  G03F7/039 ,  C09D133/04 ,  G03F7/40 ,  H01L21/311 ,  G03F7/038 ,  H01L21/3213 ,  H01L21/308 ,  C09D133/06

CPC classification number: G03F7/0035 ,  C09D133/04 ,  C09D133/062 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/40 ,  G03F7/405 ,  H01L21/0271 ,  H01L21/0273 ,  H01L21/3086 ,  H01L21/31144 ,  H01L21/32139

Abstract: A composition includes two types of polymers each having a different weight average molecular weight. The two types of polymers are each a styrene polymer having a group which bonds to at least one end of a main chain and which includes at least one of a hydroxy group, a carboxy group, a sulfanyl group, an epoxy group, a cyano group, a vinyl group or a carbonyl group. A difference in weight average molecular weight between the two types of polymers is no less than 2,000 and no greater than 30,000.

公开(公告)号：US20170351174A1

公开(公告)日：2017-12-07

申请号：US15170108

申请日：2016-06-01

Applicant: JSR Corporation

Inventor： Hitoshi OSAKI

IPC: G03F7/00 ,  H01L21/311 ,  H01L21/027 ,  G03F7/40 ,  G03F7/038 ,  C09D133/06 ,  H01L21/3213 ,  H01L21/308

CPC classification number: G03F7/0035 ,  C09D133/04 ,  C09D133/062 ,  G03F7/038 ,  G03F7/0397 ,  G03F7/40 ,  G03F7/405 ,  H01L21/0271 ,  H01L21/0273 ,  H01L21/3086 ,  H01L21/31144 ,  H01L21/32139

Abstract: A pattern-forming method includes forming a base pattern including a first polymer on a front face side. A composition is applied on at least a lateral face of the base pattern. The composition includes at least one polymer that is capable of interacting with the first polymer. The composition is heated such that a portion of the at least one polymer interacts with the first polymer and that a coating film is formed on the lateral face of the base pattern. Another portion of the at least one polymer not having interacted with the first polymer is removed to form a resist pattern. The base pattern in a planar view has a shape with a long axis and a short axis, and a ratio of lengths of the long axis to the short axis is no less than 1.5 and no greater than 10.

公开(公告)号：US20200379348A1

公开(公告)日：2020-12-03

申请号：US16905946

申请日：2020-06-19

Applicant: JSR CORPORATION

Inventor： Hitoshi OSAKI

IPC: G03F7/039 ,  G03F7/038 ,  G03F7/004 ,  C08F212/08 ,  C09D125/14

Abstract: A pattern-forming method includes: applying a radiation-sensitive composition containing a polymer and a radiation-sensitive acid generating agent on a surface of a substrate to form a coating film on the surface of the substrate; exposing the coating film; and developing the coating film exposed. The polymer has a first structural unit represented by formula (1). In the formula (1), R1 represents a hydrogen atom, a methyl group, a fluorine atom, or a trifluoromethyl group; and A represents a monovalent organic group having a nitrogen atom.

公开(公告)号：US20200148845A1

公开(公告)日：2020-05-14

申请号：US16718579

申请日：2019-12-18

Applicant: JSR CORPORATION

Inventor： Hitoshi OSAKI

IPC: C08J5/18 ,  C08F297/02 ,  H01L21/02

Abstract: A method for forming a cover film includes applying a composition including a first polymer and a solvent on a surface of a base material to form a coating film. The base material includes a surface layer which includes a first region and a second region having a surface condition that differs from a surface condition of the first region. The coating film is heated. A portion of the coating film is desorbed with a rinse agent after the heating. The portion is formed on the second region of the coating film. The first polymer includes a first structural unit represented by formula (1), or includes a monovalent organic group which bonds to at least one end of a main chain of the first polymer and which includes a nitrogen atom.

公开(公告)号：US20200087530A1

公开(公告)日：2020-03-19

申请号：US16528151

申请日：2019-07-31

Applicant: JSR CORPORATION

Inventor： Hiroyuki KOMATSU ,  Miki TAMADA ,  Hitoshi OSAKI ,  Tomoki NAGAI

IPC: C09D125/04 ,  C09D7/20 ,  C09D7/40

Abstract: A modification method of a surface of a substrate includes: applying a composition on a surface of a metal substrate, and heating a coating film formed by the applying, wherein the composition contains: a polymer having a first structural unit that includes an aromatic ring, and a second structural unit that includes an ethylenic double bond; a thermal acid generating agent; and a solvent, wherein the polymer has a functional group capable of bonding to a metal atom in the metal substrate.

公开(公告)号：US20190198316A1

公开(公告)日：2019-06-27

申请号：US16288354

申请日：2019-02-28

Applicant: JSR CORPORATION

Inventor： Hiroyuki KOMATSU ,  Tomohiro ODA ,  Hitoshi OSAKI ,  Masafumi HORI ,  Takehiko NARUOKA

IPC: H01L21/027 ,  H01L21/02 ,  H01L21/311

CPC classification number: H01L21/0271 ,  C08L25/06 ,  C08L33/10 ,  C08L2203/206 ,  C08L2312/02 ,  H01L21/02118 ,  H01L21/02282 ,  H01L21/02334 ,  H01L21/02359 ,  H01L21/28 ,  H01L21/285 ,  H01L21/31133

Abstract: A method for selectively modifying a base material surface, includes applying a composition on a surface of a base material to form a coating film. The coating film is heated. The base material includes a surface layer which includes a first region including a metal. The composition includes a first polymer and a solvent. The first polymer includes at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with the metal. It is preferred that the base material further includes a second region comprising substantially only a non-metal, and the method further includes, after the heating, removing with a rinse agent a portion formed on the second region, of the coating film. The metal is preferably a constituent of a metal substance, an alloy, an oxide, an electrically conductive nitride or a silicide.

公开(公告)号：US20210166935A1

公开(公告)日：2021-06-03

申请号：US17148729

申请日：2021-01-14

Applicant: JSR CORPORATION

Inventor： Hiroyuki KOMATSU ,  Tomohiro ODA ,  Hitoshi OSAKI ,  Masafumi HORI ,  Takehiko NARUOKA

IPC: H01L21/027 ,  C08F112/08 ,  C09D125/06 ,  H01L21/28 ,  H01L21/321 ,  H01L21/285 ,  C08F8/00 ,  H01L21/02 ,  H01L21/311

Abstract: A composition for use in selective modification of a base material surface includes a polymer having, at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with a metal, and a solvent.