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公开(公告)号：US09659737B2
公开(公告)日：2017-05-23
申请号：US13183255
申请日：2011-07-14
Applicant: J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
CPC classification number: H01J29/20 , H01J9/222 , H01J61/44 , Y10T428/24421
Abstract: Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.
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2.发明申请公开(公告)号：US20110181169A1
公开(公告)日：2011-07-28
申请号：US12991237
申请日：2009-05-14
Applicant: J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
CPC classification number: H05H1/24 , H01J11/36 , H01J61/86 , H05H1/2406 , H05H2001/2418
Abstract: An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and embedded metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.
Abstract translation: 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片和由微腔或微通道中的氧化物隔离的嵌入的金属驱动电极中，并且被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。
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3.发明授权Microcavity and microchannel plasma device arrays in a single, unitary sheet 有权微腔和微通道等离子体器件阵列在单一的单一片材中公开(公告)号：US08890409B2
公开(公告)日：2014-11-18
申请号：US12991237
申请日：2009-05-14
Applicant: J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Taek-Lim Kim , Kwang-Soo Kim
CPC classification number: H05H1/24 , H01J11/36 , H01J61/86 , H05H1/2406 , H05H2001/2418
Abstract: An array of microcavity plasma devices is formed in a unitary sheet of oxide with embedded microcavities or microchannels and encapsulated metal driving electrodes isolated by oxide from the microcavities or microchannels and arranged so as to generate sustain a plasma in the embedded microcavities or microchannels upon application of time-varying voltage when a plasma medium is contained in the microcavities or microchannels.
Abstract translation: 微腔等离子体装置的阵列形成在具有嵌入的微腔或微通道的一体的氧化物片材中，并且被封装的金属驱动电极由氧化物从微腔或微通道分离，并被布置成在施加了微腔或微通道时在嵌入的微腔或微通道中产生维持等离子体 当等离子体介质包含在微通道或微通道中时，具有时变电压。
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4.发明授权Method for making buried circumferential electrode microcavity plasma device arrays, and electrical interconnects 有权用于制造埋置的圆周电极微腔等离子体器件阵列和电互连的方法公开(公告)号：US08404558B2
公开(公告)日：2013-03-26
申请号：US13188712
申请日：2011-07-22
Applicant: J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Abstract: In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
Abstract translation: 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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5.发明申请PHOSPHOR COATING FOR IRREGULAR SURFACES AND METHOD FOR CREATING PHOSPHOR COATINGS 有权用于非正式表面的磷光涂料和创建磷酸盐涂层的方法公开(公告)号：US20120025696A1
公开(公告)日：2012-02-02
申请号：US13183255
申请日：2011-07-14
Applicant: J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , JeKwon Yoon , Kwang-Soo Kim
CPC classification number: H01J29/20 , H01J9/222 , H01J61/44 , Y10T428/24421
Abstract: Microstructured, irregular surfaces pose special challenges but coatings of the invention can uniformly coat irregular and microstructured surfaces with one or more thin layers of phosphor. Preferred embodiment coatings are used in microcavity plasma devices and the substrate is, for example, a device electrode with a patterned and microstructured dielectric surface. A method for forming a thin encapsulated phosphor coating of the invention applies a uniform paste of metal or polymer layer to the substrate. In another embodiment, a low temperature melting point metal is deposited on the substrate. Polymer particles are deposited on a metal layer, or a mixture of a phosphor particles and a solvent are deposited onto the uniform glass, metal or polymer layer. Sequential soft and hard baking with temperatures controlled to drive off the solvent will then soften or melt the lowest melting point constituents of the glass, metal or polymer layer, partially or fully embed the phosphor particles into glass, polymer, or metal layers, which partially or fully encapsulate the phosphor particles and/or serve to anchor the particles to a surface.
Abstract translation: 微结构化的不规则表面构成特殊挑战，但是本发明的涂层可以用一层或多层磷光体均匀地涂覆不规则和微结构化的表面。 优选的实施方案涂层用于微腔等离子体装置，并且衬底是例如具有图案化和微结构化电介质表面的器件电极。 用于形成本发明的薄封装磷光体涂层的方法将均匀的金属或聚合物层糊料施加到基底上。 在另一个实施方案中，低温熔点金属沉积在基底上。 聚合物颗粒沉积在金属层上，或者将荧光体颗粒和溶剂的混合物沉积在均匀的玻璃，金属或聚合物层上。 随后温度控制以驱除溶剂的顺序软和硬烘烤将使玻璃，金属或聚合物层的最低熔点成分软化或熔化，部分或完全将磷光体颗粒嵌入玻璃，聚合物或金属层中，部分 或完全包封荧光体颗粒和/或用于将颗粒锚定到表面。
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Patent Agency Ranking
6.发明申请公开(公告)号：US20110275272A1
公开(公告)日：2011-11-10
申请号：US13188712
申请日：2011-07-22
Applicant: J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
IPC: H01J9/02
Abstract: In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
Abstract translation: 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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7.发明申请Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method 有权埋置圆周电极微腔等离子体器件阵列，电气互连和形成方法公开(公告)号：US20080185579A1
公开(公告)日：2008-08-07
申请号：US11880698
申请日：2007-07-24
Applicant: J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Abstract: A preferred embodiment microcavity plasma device array of the invention includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis, while being protected from plasma in the microcavities by the metal oxide. In embodiments of the invention, the circumferential electrodes can be connected in patterns. A second electrode(s) is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode(s) is in a second layer, and in other embodiments the second electrode(s) is also within the first metal oxide layer. A containing layer, e.g., a thin layer of glass, quartz, or plastic, seals the discharge medium (plasma) into the microcavities. In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
Abstract translation: 本发明的优选实施例微腔等离子体器件阵列包括围绕器件中的微腔的多个第一金属周向金属电极。 第一圆周电极被埋在金属氧化物层中，并且在垂直于微腔轴线的平面中围绕微腔，同时通过金属氧化物保护微腔中的等离子体。 在本发明的实施例中，圆周电极可以以图案连接。 第二电极被布置成通过所述第一金属氧化物层与所述第一电极隔离。 在一些实施例中，第二电极处于第二层，在其它实施例中，第二电极也在第一金属氧化物层内。 含有层，例如玻璃，石英或塑料的薄层，将放电介质（等离子体）密封成微腔。 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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8.发明授权Buried circumferential electrode microcavity plasma device arrays, electrical interconnects, and formation method 有权埋置圆周电极微腔等离子体器件阵列，电气互连和形成方法公开(公告)号：US08004017B2
公开(公告)日：2011-08-23
申请号：US11880698
申请日：2007-07-24
Applicant: J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Inventor： J. Gary Eden , Sung-Jin Park , Kwang-Soo Kim
Abstract: A preferred embodiment microcavity plasma device array of the invention includes a plurality of first metal circumferential metal electrodes that surround microcavities in the device. The first circumferential electrodes are buried in a metal oxide layer and surround the microcavities in a plane transverse to the microcavity axis, while being protected from plasma in the microcavities by the metal oxide. In embodiments of the invention, the circumferential electrodes can be connected in patterns. A second electrode(s) is arranged so as to be isolated from said first electrodes by said first metal oxide layer. In some embodiments, the second electrode(s) is in a second layer, and in other embodiments the second electrode(s) is also within the first metal oxide layer. A containing layer, e.g., a thin layer of glass, quartz, or plastic, seals the discharge medium (plasma) into the microcavities. In a preferred method of formation embodiment, a metal foil or film is obtained or formed with micro-holes. The foil is anodized to form metal oxide. One or more self-patterned metal electrodes are automatically formed and buried in the metal oxide created by the anodization process. The electrodes form in a closed circumference around each microcavity in a plane(s) transverse to the microcavity axis, and can be electrically isolated or connected. Preferred embodiments provide inexpensive microplasma device electrode structures and a fabrication method for realizing microplasma arrays that are lightweight and scalable to large areas. Electrodes buried in metal oxide and complex patterns of electrodes can also be formed without reference to microplasma devices—that is, for general electrical circuitry.
Abstract translation: 本发明的优选实施例微腔等离子体器件阵列包括围绕器件中的微腔的多个第一金属周向金属电极。 第一圆周电极被埋在金属氧化物层中，并且在垂直于微腔轴线的平面中围绕微腔，同时通过金属氧化物保护微腔中的等离子体。 在本发明的实施例中，圆周电极可以以图案连接。 第二电极被布置成通过所述第一金属氧化物层与所述第一电极隔离。 在一些实施例中，第二电极处于第二层，在其它实施例中，第二电极也在第一金属氧化物层内。 含有层，例如玻璃，石英或塑料的薄层，将放电介质（等离子体）密封成微腔。 在优选的形成实施方案中，获得或形成有微孔的金属箔或膜。 箔被阳极化以形成金属氧化物。 自动形成一个或多个自图形金属电极并将其埋在通过阳极氧化处理产生的金属氧化物中。 电极在横截于微腔轴的平面中围绕每个微腔的封闭圆周形成，并且可以电隔离或连接。 优选实施例提供廉价的微型器件电极结构和用于实现轻量级并且可扩展到大面积的微等离子体阵列的制造方法。 掩埋在金属氧化物中的电极和电极的复杂图案也可以形成，而不参考微等离子体装置，即用于一般的电路。
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公开(公告)号：US20150008825A1
公开(公告)日：2015-01-08
申请号：US13532390
申请日：2012-06-25
Applicant: J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Jeffrey H. Ma
Inventor： J. Gary Eden , Sung-Jin Park , Jin Hoon Cho , Jeffrey H. Ma
CPC classification number: H01J37/32467 , H01J9/18 , H01J37/3244 , H01J37/32513 , H01J37/32568 , H05H1/2406 , H05H2001/2418 , H05H2001/2462
Abstract: Preferred embodiments of the present invention include microplasma jet devices and arrays in various materials, and low temperature microplasma jet devices and arrays. These include preferred embodiment single microplasma jet devices and arrays of devices formed in monolithic polymer blocks with elongated microcavities. The arrays can be densely packed, for example having 100 jets in an area of a few square centimeters. Additional embodiments include metal/metal oxide microplasma jet devices that have micronozzles defined in the metal oxide itself. Methods of fabrication of microplasma jet devices are also provided by the invention, and the methods have been demonstrated as being capable of producing tailored micronozzle contours that are unitary with the material insulating electrodes.
Abstract translation: 本发明的优选实施例包括各种材料中的微血管射流装置和阵列，以及低温微血浆喷射装置和阵列。 这些包括优选的实施方案，单个微血浆喷射装置和在具有细长微腔的整体式聚合物嵌段中形成的装置阵列。 阵列可以被密集地包装，例如在几平方厘米的区域中具有100个喷嘴。 另外的实施方案包括在金属氧化物本身中具有微喷嘴的金属/金属氧化物微量喷射装置。 本发明还提供了微型喷射装置的制造方法，并且已经证明这些方法能够产生与材料绝缘电极整体的定制的微型喷嘴轮廓。
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公开(公告)号：US08442091B2
公开(公告)日：2013-05-14
申请号：US12682977
申请日：2008-10-27
Applicant: Sung-Jin Park , J. Gary Eden , Paoyei Chen , Paul A. Tchertchian , Thomas M. Spinka
Inventor： Sung-Jin Park , J. Gary Eden , Paoyei Chen , Paul A. Tchertchian , Thomas M. Spinka
IPC: H01S3/091
CPC classification number: H01S3/05 , H01S3/03 , H01S3/063 , H01S3/09 , H01S3/0971
Abstract: The invention provides microchannel lasers having a microplasma gain medium. Lasers of the invention can be formed in semiconductor materials, and can also be formed in polymer materials. In a microlaser of the invention, high density plasmas are produced in microchannels. The microplasma acts as a gain medium with the electrodes sustaining the plasma in the microchannel. Reflectors are used with the microchannel for obtaining optical feedback to obtain lasing in the microplasma gain medium in devices of the invention for a wide range of atomic and molecular species. Several atomic and molecular gain media will produce sufficiently high gain coefficients that reflectors (mirrors) are not necessary. Microlasers of the invention are based on microplasma generation in channels of various geometries. Preferred embodiment microlaser designs can be fabricated in semiconductor materials, such as Si wafers, by standard photolithographic techniques, or in polymers by replica molding.
Abstract translation: 本发明提供了具有微质增益介质的微通道激光器。 本发明的激光器可以形成在半导体材料中，也可以形成在聚合物材料中。 在本发明的微型激光器中，在微通道中产生高密度等离子体。 微量体作为增益介质，其中电极在微通道中维持等离子体。 反射器与微通道一起使用以获得光学反馈，以在广泛的原子和分子物种的本发明装置中的微量级增益介质中获得激光。 几个原子和分子增益介质将产生足够高的增益系数，反射器（反射镜）不是必需的。 本发明的微型扫描器基于各种几何形状的通道中的微量生成。 优选实施例微激光器设计可以通过标准光刻技术在半导体材料（例如Si晶片）中或通过复制成型制成聚合物。
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