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    Laser ablatable material and its use
    2.
    发明申请
    Laser ablatable material and its use 失效
    激光可烧蚀材料及其用途

    公开(公告)号：US20020094491A1

    公开(公告)日：2002-07-18

    申请号：US10073558

    申请日：2002-02-11

    Applicant: International Business Machines Corporation

    Inventor： John S. Kresge ,  John M. Lauffer ,  David J. Russell

    IPC: G03C001/73

    CPC classification number: H05K3/0032 ,  B23K2103/42 ,  B23K2103/50 ,  B41M5/24 ,  H05K1/0326 ,  H05K1/0373 ,  H05K2201/0112 ,  Y10S430/146

    Abstract: An epoxy based resin which exhibits good laser ablation and good adherence to a substrate such a copper is provided by adding to the resin a dye or dyes having substantial energy absorption at the emission wave lengths of lasers used to laser ablate the resin. The resin with the dye or dyes included is coated onto a substrate and cured, or laminated onto a substrate in the cured condition. The required openings are formed in the cured film by laser ablation. This allows for the use of optimum techniques to be used to form micro vias.

    Abstract translation: 通过向树脂中添加染料或染料，在用于激光烧蚀树脂的激光器的发射波长处具有显着的能量吸收，提供了表现出良好的激光烧蚀和对衬底的良好粘附性的环氧树脂。 将包含染料或染料的树脂涂覆在基材上并固化，或在固化条件下层压到基材上。 通过激光烧蚀在所述固化膜中形成所需的开口。 这允许使用最佳技术来形成微通孔。

    Formation of a metallic interlocking structure
    3.
    发明申请
    Formation of a metallic interlocking structure 失效

    公开(公告)号：US20020056890A1

    公开(公告)日：2002-05-16

    申请号：US10039710

    申请日：2002-01-04

    Applicant: International Business Machines Corporation

    Inventor： Gerald G. Advocate JR. ,  Francis J. Downes JR. ,  Luis J. Matienzo ,  Ronald A. Kaschak ,  John S. Kresge ,  Daniel C. Van Hart

    IPC: H01L029/93

    CPC classification number: H01L23/5226 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/0035 ,  H05K3/027 ,  H05K3/06 ,  H05K3/383 ,  H05K3/421 ,  H05K3/4644 ,  H05K2201/0248 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0353 ,  H01L2924/00

    Abstract: An electronic structure including a metallic interlocking structure for bonding a conductive plated layer to metal surface, and a method of forming the electronic structure. The method provides a substrate having a metallic sheet within a dielectric layer. The metallic sheet includes a metal such as copper. An opening in the substrate, such as a blind via, is formed by laser drilling through the dielectric layer and partially through the metallic sheet. If the opening is a blind via, then the laser drilling is within an outer ring of the blind via cross section using a laser beam having a target diameter between about 20% and about 150% of a radius of the blind via cross section. A surface at the bottom of the opening, called a nullblind surface,null includes a metallic protrusion formed by the laser drilling, such that the metallic protrusion is integral with a portion of the blind surface. The metallic protrusion includes the metal of the metallic sheet and at least one constituent element from the dielectric layer. The metallic protrusion is then etched to form a metallic interlocking structure that is integral with the portion of the blind surface. The metallic interlocking structure includes discrete metallic fibers, with each metallic fiber having a curved (or curled) geometry. Each metallic fiber has its own unique composition that includes the metal, at least one constituent element of the dielectric layer, or both.

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