公开(公告)号：US20240312919A1

公开(公告)日：2024-09-19

申请号：US18120910

申请日：2023-03-13

申请人： Intel Corporation

发明人： Pezhman MONADGEMI

IPC分类号： H01L23/538 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L23/5386 ,  H01L25/0655 ,  H01L25/50 ,  H01L23/5381 ,  H01L24/13 ,  H01L24/16 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2924/1432 ,  H01L2924/1434

摘要： Embodiments disclosed herein include a multi-die module. In an embodiment, the multi-die module comprises an interposer, where the interposer comprises a first region and a second region. In an embodiment, the first region is spaced apart from the second region by a saw street. In an embodiment, a first die is over the interposer, where the first die is positioned over the saw street. In an embodiment, a second die is adjacent to a first end of the first die, and a third die is adjacent to a second end of the first die opposite from the first end.