- 专利标题: INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS
-
申请号: US18120910申请日: 2023-03-13
-
公开(公告)号: US20240312919A1公开(公告)日: 2024-09-19
- 发明人: Pezhman MONADGEMI
- 申请人: Intel Corporation
- 申请人地址: US CA Santa Clara
- 专利权人: Intel Corporation
- 当前专利权人: Intel Corporation
- 当前专利权人地址: US CA Santa Clara
- 主分类号: H01L23/538
- IPC分类号: H01L23/538 ; H01L25/00 ; H01L25/065
摘要:
Embodiments disclosed herein include a multi-die module. In an embodiment, the multi-die module comprises an interposer, where the interposer comprises a first region and a second region. In an embodiment, the first region is spaced apart from the second region by a saw street. In an embodiment, a first die is over the interposer, where the first die is positioned over the saw street. In an embodiment, a second die is adjacent to a first end of the first die, and a third die is adjacent to a second end of the first die opposite from the first end.
信息查询
IPC分类: