INTERPOSER SOLUTION FOR HIGH CORE COUNT COMPUTE PLATFORMS
摘要:
Embodiments disclosed herein include a multi-die module. In an embodiment, the multi-die module comprises an interposer, where the interposer comprises a first region and a second region. In an embodiment, the first region is spaced apart from the second region by a saw street. In an embodiment, a first die is over the interposer, where the first die is positioned over the saw street. In an embodiment, a second die is adjacent to a first end of the first die, and a third die is adjacent to a second end of the first die opposite from the first end.
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