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公开(公告)号：US09583406B2
公开(公告)日：2017-02-28
申请号：US14660753
申请日：2015-03-17
发明人： Andrew Christopher Graeme Wood , Gernot Fasching , Marius Aurel Bodea , Thomas Krotscheck Ostermann , Erwin Bacher
IPC分类号： H01L21/00 , H01L21/66 , H01L21/78 , G06F17/50 , H01L23/528 , H01L23/532 , H01L23/00
CPC分类号： H01L22/34 , G06F17/5072 , H01L21/78 , H01L22/14 , H01L22/32 , H01L23/4827 , H01L23/485 , H01L23/528 , H01L23/53271 , H01L23/58 , H01L23/585 , H01L24/05 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05172 , H01L2224/0518 , H01L2224/05184 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/146
摘要： A method for semiconductor fabrication includes forming a first array of semiconductor circuitry and a second array of semiconductor circuitry separated by a singulation region and a contact region. The method also includes forming a first array of process control monitoring structures within the singulation region of a substrate. The method also includes forming a first array of contact pads disposed in the contact region. The method also includes forming electrical connections between the first array of process control monitoring structures and the first array of contact pads, wherein all external electrical connections to the first array of process control monitoring structures are made through the first array of contact pads.
摘要翻译： 一种用于半导体制造的方法包括形成半导体电路的第一阵列和由分割区域和接触区域分开的半导体电路的第二阵列。 该方法还包括在衬底的分割区域内形成第一阵列的工艺控制监测结构。 该方法还包括形成布置在接触区域中的接触焊盘的第一阵列。 该方法还包括在第一阵列的过程控制监视结构和第一接触焊盘阵列之间形成电连接，其中通过第一接触焊盘阵列进行到第一阵列过程控制监视结构的所有外部电连接。
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公开(公告)号：US20170125315A1
公开(公告)日：2017-05-04
申请号：US15403673
申请日：2017-01-11
发明人： Andrew Christopher Graeme Wood , Gernot Fasching , Marius Aurel Bodea , Thomas Krotscheck Ostermann , Erwin Bacher
IPC分类号： H01L21/66 , G06F17/50 , H01L23/58 , H01L21/78 , H01L23/482 , H01L23/485
CPC分类号： H01L22/34 , G06F17/5072 , H01L21/78 , H01L22/14 , H01L22/32 , H01L23/4827 , H01L23/485 , H01L23/528 , H01L23/53271 , H01L23/58 , H01L23/585 , H01L24/05 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05172 , H01L2224/0518 , H01L2224/05184 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/146
摘要： A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the semiconductor circuit. A floating electrical path ends at a singulated edge of the die. The electrical path is electrically coupled to the conductive contact pad.
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公开(公告)号：US20160276233A1
公开(公告)日：2016-09-22
申请号：US14660753
申请日：2015-03-17
发明人： Andrew Christopher Graeme Wood , Gernot Fasching , Marius Aurel Bodea , Thomas Krotscheck Ostermann , Erwin Bacher
IPC分类号： H01L21/66 , H01L23/00 , H01L23/528 , H01L23/532 , H01L21/78 , G06F17/50
CPC分类号： H01L22/34 , G06F17/5072 , H01L21/78 , H01L22/14 , H01L22/32 , H01L23/4827 , H01L23/485 , H01L23/528 , H01L23/53271 , H01L23/58 , H01L23/585 , H01L24/05 , H01L2224/05124 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05157 , H01L2224/05164 , H01L2224/05166 , H01L2224/05169 , H01L2224/05172 , H01L2224/0518 , H01L2224/05184 , H01L2924/1203 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/146
摘要： A method for semiconductor fabrication includes forming a first array of semiconductor circuitry and a second array of semiconductor circuitry separated by a singulation region and a contact region. The method also includes forming a first array of process control monitoring structures within the singulation region of a substrate. The method also includes forming a first array of contact pads disposed in the contact region. The method also includes forming electrical connections between the first array of process control monitoring structures and the first array of contact pads, wherein all external electrical connections to the first array of process control monitoring structures are made through the first array of contact pads.
摘要翻译： 一种用于半导体制造的方法包括形成半导体电路的第一阵列和由分割区域和接触区域分开的半导体电路的第二阵列。 该方法还包括在衬底的分割区域内形成第一阵列的工艺控制监测结构。 该方法还包括形成布置在接触区域中的接触焊盘的第一阵列。 该方法还包括在第一阵列的过程控制监视结构和第一接触焊盘阵列之间形成电连接，其中通过第一接触焊盘阵列进行到第一阵列过程控制监视结构的所有外部电连接。
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公开(公告)号：US10090215B2
公开(公告)日：2018-10-02
申请号：US15403673
申请日：2017-01-11
发明人： Andrew Christopher Graeme Wood , Gernot Fasching , Marius Aurel Bodea , Thomas Krotscheck Ostermann , Erwin Bacher
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/66 , H01L21/78 , H01L23/485 , H01L23/482 , H01L23/528 , H01L23/532 , H01L23/58 , H01L23/00 , G06F17/50
摘要： A semiconductor die includes a semiconductor circuit disposed within or over a substrate. A conductive contact pad is disposed over the substrate outside the semiconductor circuit. A floating electrical path ends at a singulated edge of the die. The electrical path is electrically coupled to the conductive contact pad.
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