摘要:
A method and apparatus for underfilling a gap between a multi-sided die and a substrate with an encapsulant material. The die and/or the substrate is heated non-uniformly by a heat source to generate a temperature gradient therein. The heated one of the die and the substrate transfers heat energy in proportion to the temperature gradient to the encapsulant material moving in the gap. The differential heat transfer steers, guides or otherwise directs the movement of the encapsulant material in the gap. The temperature gradient may be established with heat transferred from the heat source to the die and/or the substrate by conduction, convection, or radiation. The temperature gradient may be dynamically varied as the encapsulant material moves into the gap.
摘要:
A jetting dispenser has a dispenser body with a fluid channel and a fluid channel outlet within the fluid channel. A valve member is movable within the fluid channel for selective contact with a valve seat near the fluid channel outlet. A jetting nozzle is adapted to be coupled to the dispenser body, adjacent the channel outlet, and has a nozzle body with a plurality of nozzle outlets in fluid communication with the channel outlet via a plurality of fluid passages through the nozzle body. The valve member is moved by a valve driver to contact the valve seat and impart momentum to liquid material supplied to the dispenser such that a plurality of droplets of liquid material are simultaneously jetted from the plurality of nozzle outlets.
摘要:
A method of noncontact dispensing is provided for conformal coating applications by jetting a viscous material onto a substrate. Dispensing by a jetting process results in small wetted areas thus providing highly discrete and selective conformal coating capabilities. Enhanced selectivity permits the coating of small areas and geometries and provides excellent edge definition between coated and uncoated areas.
摘要:
A method is provided for forming at least one continuous line of viscous material between two components of an electronic assembly forming two substrates. The method includes the steps of depositing a plurality of spaced apart dots of the viscous material onto a surface of a first one of the substrates and bringing a second one of the substrates into contact with the dots causing the dots to merge together to form at least one continuous line of the viscous material between the two substrates.
摘要:
A method and apparatus for underfilling a gap between a multi-sided die and a substrate with an encapsulant material. The die and/or the substrate is heated non-uniformly by a heat source to generate a temperature gradient therein. The heated one of the die and the substrate transfers heat energy in proportion to the temperature gradient to the encapsulant material moving in the gap. The differential heat transfer steers, guides or otherwise directs the movement of the encapsulant material in the gap. The temperature gradient may be established with heat transferred from the heat source to the die and/or the substrate by conduction, convection, or radiation. The temperature gradient may be dynamically varied as the encapsulant material moves into the gap.
摘要:
Systems and methods for dispensing or jetting a viscous material. The systems include an electronic controller and a jetting dispenser operatively coupled with the electronic controller. The systems further include at least one sensor that senses a system dispensing parameter and communicates an output signal representing the sensed parameter to the electronic controller for controlling system operation. In pneumatically-actuated jetting dispensers, a sensor may sense the fluid pressure in the air cavity of the pneumatic actuator. In jetting dispensers with a movable needle valve, a sensor may sense the displacement of the needle shaft. In other jetting dispensers, a sensor may sense the vibration of the jetting dispenser.
摘要:
Apparatus and methods for preapplying discrete amounts of underfill material of a component on a component substrate before the solder bumps of the component are joined by reflow with a packaging substrate to create a microelectronics package. The underfill material is preferably applied by a noncontact dispensing technique as discrete amounts at interstitial areas on an active surface of the component substrate defined between nearest-neighbor solder bumps. The underfill material forms a continuous meniscus of underfill material across the interstitial areas not occupied by the solder bumps and forms a collar encircling each of the solder bumps. The cured underfill material strengthens and improves the reliability of the solder joints formed by the bump reflow.
摘要:
A method of noncontact dispensing a viscous material onto a surface of a substrate, which uses a jetting valve having a nozzle directing the viscous material flow in a jetting direction nonperpendicular to the surface of the substrate. The nonperpendicular jetting direction results in the droplet producing a reduced wetted area on the substrate.
摘要:
A system for fluid dispensing control includes a fluid dispensing control device, a fluid dispenser, and a fluid flow meter, such that an intelligent parameterization of the dispensing system includes process variables, which characterize system behavior. The parameterization is used in convergence schemes for attaining defined fluid dispensing targets. Further, the parameterization is used to attain a consistent volumetric fluid dispensing by utilizing feedback controls. A fluid dispensing device includes a processor, a non-transitory memory, an input/output, a dispensing controller, a flow monitor, a parameterization manager, and a data bus. Also disclosed is a method for fluid dispensing control, including: a parameter sweep, logging system response data, processing response data, calculating system response function, calculating dispensing parameters, assessing intrinsic variation, determining variation band, controlling fluid dispense process response, and normalizing mass/volume fluid flow.
摘要:
An automated system (10) and methods (11) for priming a fluid chamber (12) of a fluid dispensing valve (14) with fluid (16) from fluid material source that includes a vacuum source (46), a valve priming station (32), a vacuum switch (54), and a controller (62). The valve priming station (32) has a boot (40), a vacuum chamber (36), and a vacuum channel (42) in the boot (40). The vacuum channel (42) connects with the vacuum source (46) via the vacuum chamber (36). The boot (40) sealingly engages a valve nozzle (28) of the fluid dispensing valve (14) so that the vacuum chamber (36) connects the vacuum source (46) with the fluid chamber (12). The vacuum switch (54) couples with the vacuum channel (42) via the vacuum chamber (36) and has an opened and closed position based upon a vacuum level in the vacuum chamber (36). The controller (62) is electrically connected with the vacuum source (46) and vacuum switch (54) and controls priming of the fluid dispensing valve (14) based upon whether the vacuum switch (54) is opened or closed.