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公开(公告)号：US11664185B2
公开(公告)日：2023-05-30
申请号：US17536223
申请日：2021-11-29
发明人： Jun Etoh , Hironori Ogawa , Shuichi Nakagawa , Terunobu Funatsu
CPC分类号： H01J37/023 , B06B1/0253 , B06B2201/30 , H01J2237/0216 , H03G3/20
摘要： A vibration damping system for a charged particle beam apparatus according to the present invention includes a column through which a charged particle beam passes, a vibration detection unit that detects vibration of the column, a damping mechanism that applies vibration to the column to suppress the vibration of the column, and a control device that controls the damping mechanism. The control device includes a damping gain control unit that amplifies a detection signal of the vibration detection unit with a set amplification factor and outputs an amplified detection signal as a control signal to the damping mechanism, and a saturation suppression unit that adjusts a feedback gain value of the damping gain control unit according to a detection signal of the vibration detection unit, a signal of the damping mechanism, and a maximum output value and a minimum output value of the damping mechanism.
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2.发明授权公开(公告)号：US11342156B2
公开(公告)日：2022-05-24
申请号：US17152287
申请日：2021-01-19
摘要： A charged particle beam apparatus includes a sample stage on which a sample is mounted, a control device that controls to drive the sample stage, a linear scale that detects a position of the sample stage, laser position detection means for detecting the position of the sample stage, an optical microscope that observes the sample mounted on the sample stage, and a barrel that irradiates the sample mounted on the sample stage with an electron beam, and generates a secondary electron. Image data of a first correction sample mounted on the sample stage is acquired by the optical microscope, and position data of the sample stage is detected by the laser position detection means. The sample stage is positioned with respect to the barrel based on the image data acquired by the optical microscope and the position data of the sample stage detected by the laser position detection means.
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公开(公告)号：US11342211B2
公开(公告)日：2022-05-24
申请号：US16981769
申请日：2018-05-30
发明人： Akira Doi , Minoru Sasaki , Masaki Hasegawa , Hironori Ogawa , Tomohiko Ogata , Yuko Okada
摘要： The present disclosure provides a wafer inspection technology that involves less degradation of the image quality even when an object to be observed has a variation in height due to warpage, etc. of a wafer. This wafer inspection apparatus obtains an image with less degradation by: adjusting the focal point of an observation optical system to a height measured by a height sensor for measuring wafer surface heights; and further, correcting a switching signal for a CCD line sensor on the basis of stage position data and optical magnification data corresponding to the height so as to make a correction corresponding to the wafer surface height.
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