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公开(公告)号：US20210195758A1
公开(公告)日：2021-06-24
申请号：US17057322
申请日：2019-06-11
发明人： Kazuhiro SUZUKI , Yoshio KAWAI , Toshiaki ISHII , Shota EZAKI
摘要： A resin-sealed in-vehicle electronic control device in the present disclosure is a resin-sealed in-vehicle electronic control device including a circuit board on which an electronic component is mounted, a connector housing that electrically connects the circuit board to an external terminal, and a sealing resin fixing the connector housing to the circuit board. The connector housing has a through hole allowing communication between a second end surface located opposite to a first end surface on which the external terminal is mounted and a side surface of the connector housing adjoining the second end surface, and the sealing resin is continuous to fill at least the inside of the through hole and cover a part of an outer periphery of the connector housing and at least a part of an outer periphery of the circuit board.
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公开(公告)号：US20170309540A1
公开(公告)日：2017-10-26
申请号：US15520167
申请日：2015-10-15
发明人： Hiroyuki TEMMEI , Mina AMO , Nobutake TSUYUNO , Takeshi TOKUYAMA , Toshiaki ISHII , Toshiya SATOH
IPC分类号： H01L23/367 , H01L21/48 , H01L23/00 , H01L21/56 , H01L23/495 , H01L23/31 , H01L23/62
CPC分类号： H01L23/367 , H01L21/4825 , H01L21/4882 , H01L21/56 , H01L23/3107 , H01L23/3142 , H01L23/49517 , H01L23/49541 , H01L23/49562 , H01L23/49568 , H01L23/49582 , H01L23/62 , H01L24/27 , H01L24/32 , H01L25/07 , H01L25/18 , H01L2224/27462 , H01L2224/27464 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00012 , H01L2924/00014
摘要： An electronic component has a semiconductor element and a thermally conductive support member. A heat sink is disposed on one surface of the circuit body, and a thermally conductive insulating member is interposed between the heat sink and the support member. Input and output terminals and a ground terminal are also provided. A sealing resin is formed to expose a part of each of the input and output terminals and the ground terminal and one surface of the heat sink, and to cover a periphery of the electronic component structure. A main body conductor layer is formed to be insulated from the input and output terminals and cover an immersion region of the sealing resin and one surface of the heat sink immersed in a cooling medium. A ground conductor layer covers at least a part of the ground terminal and is electrically connected with the main body conductor layer.
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公开(公告)号：US20200227333A1
公开(公告)日：2020-07-16
申请号：US16627081
申请日：2018-05-22
发明人： Nobutake TSUYUNO , Hiromi SHIMAZU , Akihiro NAMBA , Akira MATSUSHITA , Hiroshi HOUZOUJI , Atsuo NISHIHARA , Toshiaki ISHII , Takashi HIRAO
摘要： An object of the present invention is to provide a power semiconductor device enabling maintenance in reliability and improvement in productivity. According to the present invention, provided are: a circuit body including a semiconductor element and a conductive portion; a first insulation and a second insulation opposed to each other, the circuit body being interposed between the first insulation and the second insulation; a first base and a second base opposed to each other, the circuit body, the first insulation, and the second insulation being interposed between the first base and the second base; a case having a first opening portion covered with the first base and a second opening portion covered with the second base; and a distance regulation portion provided in space between the first base and the second base, the distance regulation portion regulating a distance between the first base and the second base in contact with the first base and the second base.
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公开(公告)号：US20160309600A1
公开(公告)日：2016-10-20
申请号：US15100852
申请日：2014-11-17
CPC分类号： H05K5/0069 , B23K1/0016 , B23K1/08 , B23K35/0222 , B23K35/0244 , B23K35/226 , B23K35/26 , B23K35/262 , H05K1/117 , H05K3/282 , H05K3/3405 , H05K3/3463 , H05K5/003 , H05K5/0034 , H05K2201/015 , H05K2201/10189 , H05K2201/2045 , H05K2203/122
摘要： There is a problem that contact resistance increases due to formation of an oxide film on a contact interface or biting of abrasion powder caused by micro-sliding when a contact connecting portion of a connection terminal including non-noble metal members is exposed to high temperature environment or a repetitious temperature cycle. An object of the present invention is to provide an in-vehicle electronic module that has connection reliability equivalent to that of the conventional in-vehicle electronic module even when being placed in the environment of an engine compartment and can achieve cost reduction by reducing the number of parts and assembly steps. The electronic module includes a mounting board having a circuit board on which an electronic component is mounted, and a case member for accommodating and protecting the mounting board from surrounding environment, The electronic module has a connection structure in which a portion of the circuit board is protruded to the outside through an opening of the case and inserts a board terminal into an external female connector to obtain electrical continuity, and a portion of the case member forms a connector housing that receives the female connector and isolates a space in which the board terminal is present from surrounding environment and an insulating resin member for fixing the circuit board in the case is integrally molded or joined with the circuit board.
摘要翻译： 存在如下问题：当包括非贵金属构件的连接端子的接触连接部分暴露于高温环境时，由于在接触界面上形成氧化膜或由微滑动引起的磨损粉末咬合，接触电阻增加 或重复的温度循环。 本发明的目的是提供一种车载电子模块，其具有与常规车载电子模块相当的连接可靠性，即使被放置在发动机舱的环境中并且可以通过减少数量来实现成本降低 零件和装配步骤。 该电子模块包括具有安装有电子部件的电路基板的安装板以及用于将安装基板与周围环境进行容纳保护的壳体部件。电子模块具有连接结构，电路基板的一部分为 通过壳体的开口突出到外部，并将板端子插入到外部阴连接器中以获得电连续性，并且壳体部分的一部分形成连接器壳体，该连接器壳体接收阴连接器并隔离其中板端子 存在于周围环境中，并且用于将电路板固定在壳体中的绝缘树脂构件与电路板一体地模制或接合。
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公开(公告)号：US20160106010A1
公开(公告)日：2016-04-14
申请号：US14893774
申请日：2014-05-12
发明人： Maki ITO , Toshiaki ISHII , Masaru KAMOSHIDA , Hideto YOSHINARI , Masato SAITO , Akitoyo KONNO
摘要： Provided is a box-type vehicle-mounted control device that effectively increases the amount of heat transfer from electronic components and a circuit board to a casing (base and cover) and that accordingly has achieved excellent heat dissipation property.The box-type vehicle-mounted control device includes a circuit board 12, a base 13, and a cover 14. In addition, a first heat radiating coating layer 31 is formed on at least one surface of the circuit board 12, and a second heat radiating coating layer 32 is formed on an inner surface of one or both of the base 13 and the cover 14 facing the first heat radiating coating layer 31.
摘要翻译： 提供一种盒式车载控制装置，其有效地增加从电子部件和电路板到壳体（基座和盖）的热传递量，并且因此具有优异的散热性能。 盒式车载控制装置包括电路板12，基座13和盖14.此外，第一散热涂层31形成在电路板12的至少一个表面上，第二散热涂层 散热涂层32形成在底座13和盖14的面向第一散热涂层31的一个或两个的内表面上。
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公开(公告)号：US20150366086A1
公开(公告)日：2015-12-17
申请号：US14764001
申请日：2014-01-17
CPC分类号： H05K5/0069 , B60R16/0239 , H01R12/721 , H01R13/504 , H01R13/5202 , H01R13/5216 , H01R2201/26 , H05K1/181 , H05K5/0034 , H05K5/0056 , H05K5/006 , H05K7/20454 , H05K7/20854
摘要： There is provided an on-vehicle electronic module that includes an external connecting function and environment resistant reliability similar to a previous on-vehicle electronic module and that simultaneously achieves downsizing without a male connector housing component and cost reduction due to reduction of the number of components and assembly man-hours. There are included a circuit board 1 including a mounting region 2 and a terminal forming region 3, and a case housing the mounting region 2 of the circuit board 1. Electronic components 9 and 10 are mounted on the mounting region 2. A board terminal is formed in the terminal forming region 3. The case includes a case member 13 integrally formed with a wall surface and a male connector housing 13a. The wall surface forms a case internal space 21 that houses the mounting region 2. A female connector is mounted to the male connector housing 13a. The circuit board 1 penetrates the case member 13 such that the terminal forming region 3 is exposed to a housing space 22 side of the male connector housing 13a
摘要翻译： 提供了一种车载电子模块，其包括与先前的车载电子模块类似的外部连接功能和耐环境可靠性，并且同时实现了没有公连接器壳体部件的小型化并且由于部件数量的减少而降低了成本 和装配工时。 包括安装区域2和端子形成区域3的电路板1和容纳电路板1的安装区域2的壳体。电子部件9和10安装在安装区域2上。基板端子 形成在端子形成区域3中。壳体包括与壁面一体形成的壳体部件13和阳连接器壳体13a。 壁面形成容纳安装区域2的壳体内部空间21.阴连接器安装到阳连接器壳体13a。 电路板1穿过壳体构件13，使得端子形成区域3暴露于阳连接器壳体13a的容纳空间22侧
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7.发明申请公开(公告)号：US20180255658A1
公开(公告)日：2018-09-06
申请号：US15759996
申请日：2016-08-05
发明人： Yujiro KANEKO , Yoshio KAWAI , Toshiaki ISHII
CPC分类号： H05K5/065 , B29C65/70 , B29L2031/3481 , B60R16/02 , H01L23/29 , H05K1/181 , H05K3/28 , H05K5/00 , H05K5/0017 , H05K5/0034 , H05K5/0082 , H05K5/02 , H05K5/0204 , H05K7/20409 , H05K7/209 , H05K9/0049 , H05K2201/10522
摘要： Providing a highly reliable electronic control device capable of achieving both low cost and productivity. An electronic control device including an electronic component, a control substrate on which the electronic component is mounted, and a sealing resin that seals the control substrate, the electronic control device being installed outside the vehicle cabin or in the engine compartment, the electronic control device further including a housing case that fixes the control substrate, and an outer periphery of the housing case being covered with a sealing resin.
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公开(公告)号：US20180218963A1
公开(公告)日：2018-08-02
申请号：US15747365
申请日：2016-07-11
IPC分类号： H01L23/373 , H01L25/18 , H01L23/367
CPC分类号： H01L23/3733 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L24/73 , H01L25/07 , H01L25/18 , H01L2224/33 , H01L2224/37599 , H01L2224/40 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2224/37099
摘要： An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
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公开(公告)号：US20180007778A1
公开(公告)日：2018-01-04
申请号：US15544206
申请日：2016-01-12
发明人： Maki ITO , Toshiaki ISHII , Yoshio KAWAI
IPC分类号： H05K1/02 , B60R16/023
CPC分类号： H05K1/0203 , B60R16/02 , B60R16/0231 , C09D5/00 , C09D7/40 , C09D201/00 , H05K1/0209 , H05K7/20 , H05K2201/09872 , H05K2203/0759
摘要： Provided is an onboard control apparatus (ECU) having a thermal radiating coating film capable of efficiently radiating heat generated from an electronic component to the outside of the casing. An onboard control apparatus includes: a circuit board stored in a housing; an electronic component mounted on the circuit board; and a thermal radiating coating film which is disposed on the electronic component to radiate heat generated from the electronic components, wherein the thermal radiating coating includes a resin and thermal radiating particles which radiate heat, and the thermal radiating particles and the resin have substantially same specific gravity.
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公开(公告)号：US20170215271A1
公开(公告)日：2017-07-27
申请号：US15514914
申请日：2015-08-21
发明人： Maki ITO , Yuusuke YASUDA , Toshiaki ISHII , Yoshio KAWAI , Masahiko ASANO
CPC分类号： H05K1/0206 , B60R16/02 , C09D5/00 , C09D7/40 , C09D201/00 , H05K3/28 , H05K5/0017 , H05K5/0047 , H05K5/0069 , H05K5/0073 , H05K7/20481 , H05K7/20854
摘要： The invention provides an in-vehicle controller equipped with a heat radiation coating film which can efficiently radiate heat from a high temperature portion such as a heat generating body to a casing. An in-vehicle controller includes a heat radiation coating film, wherein the heat radiation coating film includes a first region that has a first boundary surface abutting on a base material, and a second region that has a second boundary surface where the heat radiation coating film abuts on air, wherein a thermal conductivity of the first region is higher than that of the second region, and wherein a thermal emissivity of the second region is higher than that of the first region.
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