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公开(公告)号：US20210010560A1
公开(公告)日：2021-01-14
申请号：US16978089
申请日：2018-10-16
摘要： A damper device that suppresses arc discharge between electrodes generated by bubbles in an electro-rheological fluid, includes an inner tube housed in an outer tube forming an outer shell of a damper device. An electrode tube is arranged between the outer tube and the inner tube. An electro-rheological fluid is sealed in the outer tube. The inner tube and the electrode tube constitute a cathode and an anode, respectively, and apply a voltage to the electro-rheological fluid located between the inner tube and the electrode tube. An insulating layer is provided on a surface of the electrode tube on a side facing the inner tube or on a surface of the inner tube on a side facing the electrode tube. When a maximum voltage applied to the electro-rheological fluid is Vmax (V), a thickness t (m) of the insulating layer is set to satisfy Formula (1).
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公开(公告)号：US20180218963A1
公开(公告)日：2018-08-02
申请号：US15747365
申请日：2016-07-11
IPC分类号： H01L23/373 , H01L25/18 , H01L23/367
CPC分类号： H01L23/3733 , H01L23/36 , H01L23/3675 , H01L23/3677 , H01L24/73 , H01L25/07 , H01L25/18 , H01L2224/33 , H01L2224/37599 , H01L2224/40 , H01L2224/48091 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H01L2924/00012 , H01L2224/37099
摘要： An object of the present invention is to provide a power module capable of realizing a superior heat radiation property while satisfying a high insulation property. A power module according to the present invention includes: a conductor plate to which a switching element is connected; a heat radiation plate which is disposed to face the conductor plate; an insulating member which is disposed between the conductor plate and the heat radiation plate; and a conductive intermediate conductor which is disposed in the insulating member in a state of being electrically insulated from the conductor plate and the heat radiation plate, wherein the intermediate conductor has a communication region which communicates between the insulating member disposed on the side of the conductor plate with respect to the intermediate conductor and the insulating member disposed on the side of the heat radiation plate with respect to the intermediate conductor.
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公开(公告)号：US20210366810A1
公开(公告)日：2021-11-25
申请号：US16648611
申请日：2018-07-17
发明人： Junpei KUSUKAWA , Tadahiko CHIDA
IPC分类号： H01L23/492 , H01L23/367 , H01L23/49
摘要： An object is to suppress a decrease in reliability due to peeling of an insulating layer and another member of a power semiconductor device. A power semiconductor device according to the present invention includes: a power semiconductor element; a conductor portion that transmits a current to the power semiconductor element; an insulating layer in contact with a surface of the conductor portion on a side opposite to a side on which the power semiconductor element is arranged; a metallic heat dissipating portion that opposes the conductor portion while sandwiching the insulating layer; and an output terminal that is connected to the conductor layer and outputs a different signal depending on a contact state of the insulating portion, the insulating layer having an insulating portion and a conductor layer sandwiched between the conductor portion and the metallic heat dissipating portion via the insulating portion.
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公开(公告)号：US20180211938A1
公开(公告)日：2018-07-26
申请号：US15500138
申请日：2015-06-08
IPC分类号： H01L25/07 , H01L23/367 , H01L23/373 , H01L23/495 , H02M7/00 , H02M7/537
CPC分类号： H01L25/072 , H01L23/367 , H01L23/3677 , H01L23/3735 , H01L23/49575 , H01L23/5385 , H01L24/37 , H01L24/40 , H01L25/18 , H01L2224/04034 , H01L2224/04042 , H01L2224/05554 , H01L2224/32225 , H01L2224/33 , H01L2224/37599 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/4911 , H01L2224/49171 , H01L2224/49175 , H01L2224/73265 , H01L2924/00014 , H01L2924/1203 , H01L2924/13055 , H01L2924/181 , H01L2924/19107 , H02M7/003 , H02M7/537 , H01L2924/00012 , H01L2924/00 , H01L2224/37099 , H01L2224/45099
摘要： It is an object of the present invention to provide a power module which can withstand a high voltage with a thin insulating layer. A power module of the present invention is provided with a first power semiconductor element 328 of an upper arm side constituting an inverter circuit, a second power semiconductor element 330 of a lower arm side, a first conductor part 320 which transmits an alternating current, a second conductor part 315 which transmits a direct current, an electrically-conductive heat dissipating part 307, a first intermediate conductor layer 910 disposed between the first conductor part 320 and the heat dissipating part 307 via an insulating layer 900, and a second intermediate conductor layer 911 disposed between the second conductor part 315 and the heat dissipating part 307 via the insulating layer 900, wherein, the second intermediate conductor layer 911 is formed to be separated from the first intermediate conductor layer 910, and the first intermediate conductor layer 910 forms a capacity circuit which shares the voltage between the first conductor part 320 and the heat dissipating part 307.
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