-
公开(公告)号：US20120152600A1
公开(公告)日：2012-06-21
申请号：US13307499
申请日：2011-11-30
CPC分类号： H05K3/4007 , H05K3/3452 , H05K3/3484 , H05K2201/099 , H05K2203/0594
摘要： A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.
摘要翻译： 一种印刷电路板，包括层间树脂绝缘层，形成在层间树脂绝缘层上并用于安装电子部件的焊盘，形成在层间树脂绝缘层和焊盘上的阻焊层，并且在焊盘上具有开口部分 以及形成在焊盘上并通过阻焊层的开口部露出的涂层。 阻焊层具有在开口部的底部朝向开口部的内侧突出的突出部，并且阻焊层的突出部在突出部的端部具有平坦的表面。
-
公开(公告)号：US08901431B2
公开(公告)日：2014-12-02
申请号：US13307499
申请日：2011-11-30
CPC分类号： H05K3/4007 , H05K3/3452 , H05K3/3484 , H05K2201/099 , H05K2203/0594
摘要： A printed wiring board including an interlayer resin insulation layer, a pad formed on the interlayer resin insulation layer and for mounting an electronic component, a solder-resist layer formed on the interlayer resin insulation layer and the pad and having an opening portion over the pad, and a coating layer formed on the pad and exposed through the opening portion of the solder-resist layer. The solder-resist layer has a protruding portion protruding toward the inside of the opening portion in a bottom portion of the opening portion, and the protruding portion of the solder-resist layer has a flat surface in an end portion of the protruding portion.
摘要翻译： 一种印刷电路板，包括层间树脂绝缘层，形成在层间树脂绝缘层上并用于安装电子部件的焊盘，形成在层间树脂绝缘层和焊盘上的阻焊层，并且在焊盘上具有开口部分 以及形成在焊盘上并通过阻焊层的开口部露出的涂层。 阻焊层具有在开口部的底部朝向开口部的内侧突出的突出部，并且阻焊层的突出部在突出部的端部具有平坦的表面。
-
公开(公告)号：US08541695B2
公开(公告)日：2013-09-24
申请号：US12956826
申请日：2010-11-30
申请人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K1/0271 , H05K1/115 , H05K3/427 , H05K3/4602 , H05K2201/0347 , H05K2201/09563 , H05K2201/0959 , H05K2201/096 , H05K2201/09827
摘要： A wiring board includes a substrate having first and second surfaces, a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second hole, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, a first conductive portion on one end of the second hole, and a second conductive portion on the opposite end of the second penetrating hole. The first conductor is connecting the first circuit and the second circuit. The second conductor is made of a conductive material filled in the second hole and is connecting the first conductive portion and the second conductive portion.
摘要翻译： 布线基板包括具有第一表面和第二表面的基底，穿过基底的第一穿透孔，形成在第一孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二穿透孔 以及形成在所述第二孔中的第二通孔导体，在所述基板的第一表面上的第一导电电路，所述基板的第二表面上的第二导电电路，所述第二孔的一端上的第一导电部， 以及在所述第二穿透孔的相对端上的第二导电部分。 第一导体连接第一电路和第二电路。 第二导体由填充在第二孔中的导电材料制成，并且连接第一导电部分和第二导电部分。
-
公开(公告)号：US20110209905A1
公开(公告)日：2011-09-01
申请号：US12956753
申请日：2010-11-30
CPC分类号： H05K1/0222 , H05K1/185 , H05K3/4602 , H05K2201/10015
摘要： A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.
摘要翻译： 布线基板包括具有贯穿基板的第一穿透孔的基板，形成在第一贯通孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二贯通孔的填充物， 形成在第二穿透孔中的通孔导体，形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部，以及形成在所述第二贯通孔的相对端的第二导电部。 第一个导体连接第一和第二个电路。 第二导体连接第一和第二导电部分。 第一电路的厚度被设定为大于第一导电部分的厚度。
-
公开(公告)号：US08586875B2
公开(公告)日：2013-11-19
申请号：US12956753
申请日：2010-11-30
IPC分类号： H05K1/11
CPC分类号： H05K1/0222 , H05K1/185 , H05K3/4602 , H05K2201/10015
摘要： A wiring board includes a substrate having a first penetrating hole penetrating through the substrate, a first through-hole conductor formed on the inner wall of the first penetrating hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor formed in the second penetrating hole, a first conductive circuit formed on a first surface of the substrate; a second conductive circuit formed on a second surface of the substrate; a first conductive portion formed on one end of the second penetrating hole, and a second conductive portion formed on the opposite end of the second penetrating hole. The first conductor is connecting the first and second circuits. The second conductor is connecting the first and second conductive portions. The first circuit has the thickness which is set greater than the thickness of the first conductive portion.
摘要翻译： 布线基板包括具有贯穿基板的第一穿透孔的基板，形成在第一贯通孔的内壁上的第一通孔导体，填充在第一导体内部并形成第二贯通孔的填充物， 形成在第二穿透孔中的通孔导体，形成在基板的第一表面上的第一导电电路; 形成在所述基板的第二表面上的第二导电电路; 形成在所述第二贯通孔的一端的第一导电部，以及形成在所述第二贯通孔的相对端的第二导电部。 第一个导体连接第一和第二个电路。 第二导体连接第一和第二导电部分。 第一电路的厚度被设定为大于第一导电部分的厚度。
-
公开(公告)号：US20110284282A1
公开(公告)日：2011-11-24
申请号：US13053644
申请日：2011-03-22
CPC分类号： H05K1/0251 , H05K3/429 , H05K3/4602 , H05K2201/09809 , Y10T29/49165
摘要： A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.
摘要翻译： 一种印刷线路板布线板，包括：具有形成在第一贯通孔周围的第一贯通孔和多个第二贯通孔的基板，形成在基板的一个面上的第一导电部和第二导电部，第三导电部和第四导电部 形成在所述基板的相对表面上的导电部分，形成在所述第一贯通孔中并连接所述第一导电部和所述第三导电部的第一通孔导体，以及形成在所述第二贯通孔中的多个第二通孔导体， 第二导电部分和第四导电部分。 第一通孔导体和第二通孔导体由填充在第一贯通孔或第二贯通孔中的导电材料构成。
-
公开(公告)号：US20100243311A1
公开(公告)日：2010-09-30
申请号：US12607666
申请日：2009-10-28
申请人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao NIKI , Atsushi Ishida , Ryojiro Tominaga
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/387 , H05K3/422 , H05K3/4682 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/09581 , H05K2201/09827 , H05K2203/1168
摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.
摘要翻译： 一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层， 第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和 聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。 第一绝缘层的第一表面面向第二绝缘层的第二表面。
-
公开(公告)号：US09117730B2
公开(公告)日：2015-08-25
申请号：US13665473
申请日：2012-10-31
申请人： Ryojiro Tominaga , Kenji Sakai , Naoaki Fujii
发明人： Ryojiro Tominaga , Kenji Sakai , Naoaki Fujii
IPC分类号： H05K1/16 , H01L23/15 , H01L23/498 , H05K3/46
CPC分类号： H01L23/15 , H01L23/49827 , H01L2224/16 , H05K3/4602 , H05K3/4673 , H05K2201/0195 , H05K2201/0209 , H05K2201/029 , Y10T29/49155
摘要： A printed wiring board includes a core substrate, a first conductive pattern formed on the substrate, an insulation structure having a first insulation layer and formed on the substrate such that the first insulation layer covers the first pattern, a second conductive pattern formed on the structure, and a second insulation layer formed on the structure such that the second insulation layer covers the second pattern. The structure has a via conductor connecting the first and second patterns through the first insulation layer, the first insulation layer includes a first layer containing a reinforcing fiber material and a second layer formed on the first layer such that the first layer is on the substrate side and a second layer is on the second insulation layer side, and the second layer is made of an insulating material which is the same material as an insulating material forming the second insulation layer.
摘要翻译： 印刷布线板包括芯基板，形成在基板上的第一导电图案，具有第一绝缘层并形成在基板上的绝缘结构，使得第一绝缘层覆盖第一图案，形成在该结构上的第二导电图案 以及形成在所述结构上的第二绝缘层，使得所述第二绝缘层覆盖所述第二图案。 该结构具有通过第一绝缘层连接第一和第二图案的通孔导体，第一绝缘层包括含有增强纤维材料的第一层和形成在第一层上的第二层，使得第一层位于衬底侧 并且第二层位于第二绝缘层侧，第二层由与形成第二绝缘层的绝缘材料相同的材料的绝缘材料制成。
-
公开(公告)号：US08729405B2
公开(公告)日：2014-05-20
申请号：US13053644
申请日：2011-03-22
IPC分类号： H05K1/11
CPC分类号： H05K1/0251 , H05K3/429 , H05K3/4602 , H05K2201/09809 , Y10T29/49165
摘要： A printed wiring board wiring board including a substrate having a first penetrating hole and multiple second penetrating holes formed around the first penetrating hole, a first conductive portion and a second conductive portion formed on one surface of the substrate, a third conductive portion and a fourth conductive portion formed on the opposite surface of the substrate, a first through-hole conductor formed in the first penetrating hole and connecting the first conductive portion and the third conductive portion, and multiple second through-hole conductors formed in the second penetrating holes and connecting the second conductive portion and the fourth conductive portion. The first through-hole conductor and the second through-hole conductors are made of conductive material filled in the first penetrating hole or the second penetrating holes.
摘要翻译： 一种印刷线路板布线板，包括：具有形成在第一贯通孔周围的第一贯通孔和多个第二贯通孔的基板;形成在基板的一个面上的第一导电部和第二导电部，第三导电部和第四导电部 形成在所述基板的相对表面上的导电部分，形成在所述第一贯通孔中并连接所述第一导电部和所述第三导电部的第一通孔导体，以及形成在所述第二贯通孔中的多个第二通孔导体， 第二导电部分和第四导电部分。 第一通孔导体和第二通孔导体由填充在第一贯通孔或第二贯通孔中的导电材料构成。
-
公开(公告)号：US08563873B2
公开(公告)日：2013-10-22
申请号：US12607666
申请日：2009-10-28
申请人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
发明人： Ayao Niki , Atsushi Ishida , Ryojiro Tominaga
CPC分类号： H05K3/4661 , H05K3/0035 , H05K3/387 , H05K3/422 , H05K3/4682 , H05K2201/0195 , H05K2201/0209 , H05K2201/0239 , H05K2201/09581 , H05K2201/09827 , H05K2203/1168
摘要： A method for manufacturing a substrate with a metal film includes preparing a first insulation layer having first and second surfaces, forming a first conductive circuit on the first surface of the first insulation layer, forming on the first surface of the first insulation layer and on the first conductive circuit a second insulation layer having first and second surfaces, forming in the second insulation layer a penetrating hole tapering from the first surface toward the first conductive circuit, forming on the inner wall of the penetrating hole, a composition containing a polymerization initiator and a polymerizable compound, providing a polymer on the inner wall of the penetrating hole by irradiating the composition, applying a plating catalyst on the polymer, and forming a plated-metal film on the inner wall of the penetrating hole. The first surface of the first insulation layer faces the second surface of the second insulation layer.
摘要翻译： 一种用金属膜制造衬底的方法包括制备具有第一和第二表面的第一绝缘层，在第一绝缘层的第一表面上形成第一导电电路，在第一绝缘层的第一表面上形成第一绝缘层， 第一导电电路，具有第一和第二表面的第二绝缘层，在所述第二绝缘层中形成从所述第一表面向所述第一导电电路渐缩的穿透孔，在所述穿透孔的内壁上形成含有聚合引发剂和 聚合性化合物，通过照射该组合物，在该聚合物上涂布电镀催化剂，在该贯通孔的内壁上形成聚合物，在该贯通孔的内壁上形成电镀金属膜。 第一绝缘层的第一表面面向第二绝缘层的第二表面。
-
-
-
-
-
-
-
-
-
搜索结果
16 条记录 (耗时 0.019 秒)
