Abstract:
A fiber-optic cable with a fitting capable of increasing connection strength between a fiber-optic cable and an optical connector, which includes a fiber-optic cable including a sheath and a tensile member, an inner ring mounted on a circumference of the sheath from a position where the tensile member is drawn out of the sheath through a slit to a front end of the sheath, and a fitting mounted on the circumference and including a first portion mounted from the position where the tensile member is drawn out of the sheath to a position of the sheath on a side opposite to the ring side, and a second portion mounted while covering a circumference of the ring, wherein the first portion connects with the sheath, and the end portion of the tensile member is sandwiched by the ring and the second portion.
Abstract:
A semiconductor device includes: a semiconductor layer; at least one electrode formed on a semiconductor layer to be in contact with the semiconductor layer; and a passivation film covering the semiconductor layer and at least part of the top surface of the electrode to protect the semiconductor layer and formed of a plurality of sub-films. The passivation film includes a first sub-film made of aluminum nitride.
Abstract:
A field effect transistor includes a first semiconductor layer made of a first group III-V nitride; a second semiconductor layer formed on the first semiconductor layer, made of a second group III-V nitride and having a gate recess portion for exposing the first semiconductor layer therein; and a gate electrode formed on the first semiconductor layer in the gate recess portion. A product of stress applied by the second semiconductor layer to the first semiconductor layer and the thickness of the second semiconductor layer is 0.1 N/cm or less.
Abstract:
A switching semiconductor device includes a first compound layer formed on a single crystal substrate which includes silicon carbide or sapphire, and including a general formula InxGa1-xN, where 0≦x≦1; a second compound layer formed on the first compound layer, and including a general formula InyALzGa1-y-zN, where 0≦y≦1 and 0
Abstract translation:开关半导体器件包括形成在包括碳化硅或蓝宝石的单晶衬底上的第一复合层,并且包括通式为N 1 Ga 1-x N,其中 0 <= x <= 1; 形成在第一化合物层上的第二化合物层,并且包含通式为Y 1,Y z,Ga 1-y z N,其中0 < = y <= 1,0
Abstract:
The invention has an object to provide a method of making an optical fiber array in which bare fibers obtained by removing a coating of an optical fiber ribbon can be certainly arrayed on a V-groove substrate. A first feature of the invention is to use a positioning guide, and the positioning guide is provided with a recess portion having inclined wall surfaces, and its bottom portion is made to have a width equal to the whole width of the bare fibers in an arrayed state. By using this positioning guide, the optical fiber array can be made in a process as follows. In a state where bare fibers exposed by removing part of coating of tip portions of two fiber ribbons are alternately arranged, the positioning guide is raised from below. The bare fibers with irregular gaps are moved by the positioning guide and are arranged. In this state, the bare fibers are pressed by a fiber pressing member from above, and the V-groove substrate is raised, so that they are put on V grooves and are fixed by an adhesive.
Abstract:
An optical connector for connecting optical fibers, comprises: a guide-groove substrate having grooves for positioning optical fibers and guide pins; an upper plate having groove portions each for covering the guide pins positioned in the guide grooves of the guide-groove substrate; elastic guide-pin pressing members each provided in the groove portions of the upper plate above portions where the guide pin grooves are in contact with the guide pins. In such a arrangement, it is preferable to form an oxide film on said V-grooves of the guide-groove substrate at least in the vicinity of contact points between the guide pins and the V-grooves. The optical connector further includes a resin molding portion for surrounding the substrate and the upper plate, the resin molding portion including a pair of opposite opened portions at a front and back surfaces thereof.
Abstract:
A semiconductor device includes a semiconductor layer stack 13 formed on a substrate 11 and having a channel region, a first electrode 16A and a second electrode 16B formed spaced apart from each other on the semiconductor layer stack 13, a first gate electrode 18A formed between the first electrode 16A and the second electrode 16B, and a second gate electrode 18B formed between the first gate electrode 18A and the second electrode 16B. A first control layer 19A having a p-type conductivity is formed between the semiconductor layer stack 13 and the first gate electrode 18A.
Abstract:
A field effect transistor includes a first semiconductor layer made of a multilayer of a plurality of semiconductor films and a second semiconductor layer formed on the first semiconductor layer. A source electrode and a drain electrode are formed on the second semiconductor layer to be spaced from each other. An opening having an insulating film on its inner wall is formed in a portion of the second semiconductor layer sandwiched between the source electrode and the drain electrode so as to expose the first semiconductor layer therein. A gate electrode is formed in the opening to be in contact with the insulating film and the first semiconductor layer on the bottom of the opening.
Abstract:
An object of the present invention is to provide a semiconductor device and a manufacturing method thereof which can realize a normally-off field-effect transistor made of a III group nitride semiconductor. The present invention includes: placing a sapphire substrate in a crystal growth chamber; forming a low-temperature GaN buffer layer made of GaN as the III group nitride semiconductor, on a main surface of the sapphire substrate by a MOCVD method; and forming a GaN layer on the low-temperature GaN buffer layer by the MOCVD method. Here, a [11-20] axis of the GaN layer is perpendicular to the main surface of the sapphire substrate.
Abstract:
A semiconductor device, which can accurately control carrier density, includes: a single crystal substrate; a semiconductor layer which is made of hexagonal crystal with 6 mm symmetry and is formed on the single crystal substrate; a source electrode, a drain electrode and a gate electrode which are formed on the semiconductor layer, where the main surfaces of a GaN layer and an AlGaN layer constituting the semiconductor layer respectively include C-axis of the hexagonal crystal, and a length direction of a channel region in the semiconductor layer is parallel to the C-axis of the hexagonal crystal.