Semiconducting winding strip and use thereof
    1.
    发明申请
    Semiconducting winding strip and use thereof 审中-公开
    半导体绕组带及其用途

    公开(公告)号:US20070173151A1

    公开(公告)日:2007-07-26

    申请号:US10587696

    申请日:2005-02-03

    IPC分类号: B32B27/04 B32B7/12 B32B5/02

    摘要: The invention relates to a semiconducting winding strip which is suitable for equipotential bonding in high-voltage transformers. The filling material is selected in such a way that a semiconducting strip is obtained by saturation concentration in a binding agent, enabling good reproducible strips to be obtained, particularly with respect to the specific resistance thereof.

    摘要翻译: 本发明涉及一种适用于高压变压器等电位连接的半导体绕组条。 选择填充材料,使得通过粘合剂中的饱和浓度获得半导体条,使得可以获得良好的可再现条,特别是关于其电阻率。

    Glass/plastic compounds
    7.
    发明授权
    Glass/plastic compounds 失效
    玻璃/塑料化合物

    公开(公告)号:US06809134B2

    公开(公告)日:2004-10-26

    申请号:US10257664

    申请日:2002-10-15

    IPC分类号: C08K1302

    CPC分类号: C03C3/16 C08K3/40

    摘要: The thermoplast-based glass/plastic compounds according to the invention contain a low melting point sulfophosphate glass having the following composition: 4 to 10% Li2O; 4 to 10% Na2O; 4 to 8% K2O; 1 to 2% CaO; 35 to 37% ZnO; 0 to 3% La2O3; 19 to 22% P2O5 and 19 to 22% SO3, a high-performance thermoplast, an organic additive and/or a mineral filling material and optionally also carbon black and/or a sterically hindered phosphite or phenol.

    Metal/plastic hybrid and shaped body produced therefrom
    9.
    发明授权
    Metal/plastic hybrid and shaped body produced therefrom 有权
    由其制造的金属/塑料混合物和成形体

    公开(公告)号:US08173250B2

    公开(公告)日:2012-05-08

    申请号:US10582215

    申请日:2004-12-09

    IPC分类号: B32B23/18

    摘要: The invention relates to a metal/plastic hybrid and to a shaped body produced therefrom. By combining metallic additives in plastic, it has been shown for the first time that specific volume resistances of less than 10−2 Ωcm can be realized while the compounds have, at the same time, a good processability during the injection molding process.

    摘要翻译: 本发明涉及金属/塑料混合物以及由其制成的成形体。 通过将塑料中的金属添加剂结合起来,首次显示出可以实现小于10-2&OHgr·cm的比体积电阻,同时化合物在注射成型过程中同时具有良好的加工性能。