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公开(公告)号：US12243902B2
公开(公告)日：2025-03-04
申请号：US17231319
申请日：2021-04-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Yufeng Dai , Hongyi Qin
IPC: H01L27/146 , H04N25/77
Abstract: This application discloses an image sensor, which includes a color film layer. The color film layer includes a plurality of color film units, the color film unit includes at least one color-determined subunit and at least three transparent subunits, and a color of the color-determined subunit is determined. The color-determined subunit is configured to filter out a portion of the received light, and the transparent subunit is configured to allow light to pass through. A ratio of a quantity of the at least one color-determined subunit to a quantity of the plurality of subunits is less than 1/2. Because the transparent subunit can allow light to pass through, and most of light incident to the color film layer can be received by a photodiode, light sensitivity of the image sensor can be effectively increased without increasing an area of the color film layer or increasing a size of the photodiode.
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Patent Agency Ranking
2.发明申请公开(公告)号：US20140368300A1
公开(公告)日：2014-12-18
申请号：US14451661
申请日：2014-08-05
Applicant: Huawei Technologies, Co., Ltd.
Inventor： Yanzhao Zhou , Yufeng Dai , Xiang Wei
CPC classification number: H01P11/007 , H01P1/208 , Y10T29/49016
Abstract: A waveguide filter, a preparation method thereof, and a communication device to resolve a problem in which a prepared high-resonance-frequency waveguide filter cannot meet an application requirement due to a low precision of an existing machining process. The waveguide filter includes a substrate made of a silicon material, where an etching cavity having a flat side wall is formed in the substrate, a depth of the etching cavity is not greater than 0.7 mm, and an angle between the side wall of the etching cavity and a vertical direction is not smaller than 1 degree, and a waveguide port is disposed on the substrate, where the waveguide port is connected to the etching cavity and electrically connected to the etching cavity.
Abstract translation: 波导滤波器及其制备方法以及解决由于现有的加工过程的精度低而不能满足应用要求的制备的高共振频率波导滤波器的问题的通信装置。 波导滤波器包括由硅材料制成的衬底，其中在衬底中形成具有平坦侧壁的蚀刻腔，蚀刻腔的深度不大于0.7mm，蚀刻侧壁之间的角度 空腔和垂直方向不小于1度，并且波导端口设置在基板上，其中波导端口连接到蚀刻腔并电连接到蚀刻腔。
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公开(公告)号：US12167183B2
公开(公告)日：2024-12-10
申请号：US17722509
申请日：2022-04-18
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Min Cheng , Daolong Tang , Yufeng Dai
Abstract: In an image processing method, an image processing device obtains an input image from an image sensor. Each pixel of the input image is either a type-I pixel or a type-II pixel. Each type-I pixel carries a luminance channel value and no color data, and each type-II pixel carries a single color channel value and no luminance data, wherein the single color channel value is a cyan channel value, a magenta channel value, or a yellow channel value. The image processing device generates a target image by performing interpolation based on the luminance channel values and the single color channel values of the pixels of the input image, wherein each pixel in the target image corresponds in location to a pixel in the input image and has three color channel values generated by the interpolation.
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公开(公告)号：US20220077105A1
公开(公告)日：2022-03-10
申请号：US17525964
申请日：2021-11-15
Applicant: HUAWEI TECHNOLOGIES CO.,LTD.
Inventor： Ran He , Huifang Jiao , Yufeng Dai , Guanglin Yang , Chihon Ho , Ronghua Xie
IPC: H01L23/00
Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.
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公开(公告)号：US11756922B2
公开(公告)日：2023-09-12
申请号：US17525964
申请日：2021-11-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Ran He , Huifang Jiao , Yufeng Dai , Guanglin Yang , Chihon Ho , Ronghua Xie
CPC classification number: H01L24/80 , H01L24/08 , H01L2224/0801 , H01L2224/08056 , H01L2224/08059 , H01L2224/08145 , H01L2224/80047 , H01L2224/80095 , H01L2224/80345 , H01L2224/80895 , H01L2224/80896
Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.
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公开(公告)号：US20220239881A1
公开(公告)日：2022-07-28
申请号：US17722509
申请日：2022-04-18
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Min Cheng , Daolong Tang , Yufeng Dai
Abstract: In an image processing method, an image processing device obtains an input image from an image sensor. Each pixel of the input image is either a type-I pixel or a type-II pixel. Each type-I pixel carries a luminance channel value and no color data, and each type-II pixel carries a single color channel value and no luminance data, wherein the single color channel value is a cyan channel value, a magenta channel value, or a yellow channel value. The image processing device generates a target image by performing interpolation based on the luminance channel values and the single color channel values of the pixels of the input image, wherein each pixel in the target image corresponds in location to a pixel in the input image and has three color channel values generated by the interpolation.
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