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Patent Agency Ranking
公开(公告)号：US09397632B2
公开(公告)日：2016-07-19
申请号：US14313696
申请日：2014-06-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Bin Tan , Ronghua Xie
CPC classification number: H03H7/0138 , H01G4/012 , H01G4/232 , H01G4/30 , H01G4/38 , H03H7/427 , H03H2001/0085
Abstract: The present invention provides a filter. The filter includes two common electrode layers and two inner electrode layers, where the two inner electrode layers are located between the two common electrode layers, and an electrical insulation layer is disposed between any two adjacent electrode layers of the two common electrode layers and the two inner electrode layers; each of the two common electrode layers is connected to at least one grounding electrode; and each of the two inner electrode layers is connected to at least one signal electrode. The filter provided by embodiments of the present invention can perform filtering processing on low-frequency noise such as that of a direct current power supply, and has a good filtering processing effect.
Abstract translation: 本发明提供了一种过滤器。 滤波器包括两个公共电极层和两个内部电极层，其中两个内部电极层位于两个公共电极层之间，并且电绝缘层设置在两个公共电极层的任何两个相邻的电极层之间，并且两个 内电极层; 两个公共电极层中的每一个连接到至少一个接地电极; 并且两个内部电极层中的每一个连接到至少一个信号电极。 由本发明实施例提供的滤波器可以对诸如直流电源的低频噪声进行滤波处理，并具有良好的滤波处理效果。
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公开(公告)号：US10164731B2
公开(公告)日：2018-12-25
申请号：US15055324
申请日：2016-02-26
Applicant: Huawei Technologies Co., Ltd.
Inventor： Jian Ou , Ronghua Xie
IPC: H04J4/00 , H04J14/02 , H04L27/26 , H04B10/548 , H04B10/2575 , H04L5/00
Abstract: Embodiments of the present disclosure disclose a method for base station backhaul, a related device and a system for base station backhaul. The method for base station backhaul includes: modulating data carried on at least two channels to corresponding subcarriers respectively, combining and modulating the subcarriers to a first OFDM signal, sending a first broadband OFDM signal to a remote radio unit, sending, by the remote radio unit, the first broadband OFDM signal to an antenna port after splitting and filtering the same; receiving a second broadband OFDM signal sent by the remote radio unit, demodulating subcarriers included in the second broadband OFDM signal, and sending data obtained by demodulating to corresponding channels respectively. By adopting the present disclosure, a utilization rate of a link channel may be improved, and high-capacity base station backhaul may be achieved under a low cost condition.
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公开(公告)号：US11756922B2
公开(公告)日：2023-09-12
申请号：US17525964
申请日：2021-11-15
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Ran He , Huifang Jiao , Yufeng Dai , Guanglin Yang , Chihon Ho , Ronghua Xie
CPC classification number: H01L24/80 , H01L24/08 , H01L2224/0801 , H01L2224/08056 , H01L2224/08059 , H01L2224/08145 , H01L2224/80047 , H01L2224/80095 , H01L2224/80345 , H01L2224/80895 , H01L2224/80896
Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.
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公开(公告)号：US20220077105A1
公开(公告)日：2022-03-10
申请号：US17525964
申请日：2021-11-15
Applicant: HUAWEI TECHNOLOGIES CO.,LTD.
Inventor： Ran He , Huifang Jiao , Yufeng Dai , Guanglin Yang , Chihon Ho , Ronghua Xie
IPC: H01L23/00
Abstract: Embodiments of this application disclose a hybrid bonding structure and a hybrid bonding method. The hybrid bonding structure includes a first chip and a second chip. A surface of the first chip includes a first insulation dielectric and a first metal, and a first gap area exists between the first metal and the first insulation dielectric. A surface of the second chip includes a second insulation dielectric and a second metal. A surface of the first metal is higher than a surface of the first insulation dielectric. Metallic bonding is formed after the first metal is in contact with the second metal, and the first metal is longitudinally and transversely deformed in the first gap area. Insulation dielectric bonding is formed after the first insulation dielectric is in contact with the second insulation dielectric.
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公开(公告)号：US20140312991A1
公开(公告)日：2014-10-23
申请号：US14313696
申请日：2014-06-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Bin Tan , Ronghua Xie
IPC: H03H7/01
CPC classification number: H03H7/0138 , H01G4/012 , H01G4/232 , H01G4/30 , H01G4/38 , H03H7/427 , H03H2001/0085
Abstract: The present invention provides a filter. The filter includes two common electrode layers and two inner electrode layers, where the two inner electrode layers are located between the two common electrode layers, and an electrical insulation layer is disposed between any two adjacent electrode layers of the two common electrode layers and the two inner electrode layers; each of the two common electrode layers is connected to at least one grounding electrode; and each of the two inner electrode layers is connected to at least one signal electrode. The filter provided by embodiments of the present invention can perform filtering processing on low-frequency noise such as that of a direct current power supply, and has a good filtering processing effect.
Abstract translation: 本发明提供了一种过滤器。 滤波器包括两个公共电极层和两个内部电极层，其中两个内部电极层位于两个公共电极层之间，并且电绝缘层设置在两个公共电极层的任何两个相邻的电极层之间，并且两个 内电极层; 两个公共电极层中的每一个连接到至少一个接地电极; 并且两个内部电极层中的每一个连接到至少一个信号电极。 由本发明实施例提供的滤波器可以对诸如直流电源的低频噪声进行滤波处理，并具有良好的滤波处理效果。
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