公开(公告)号：US10996118B2

公开(公告)日：2021-05-04

申请号：US16065380

申请日：2016-12-21

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Lin Qu ,  Haohui Long ,  Xiong Yang ,  Taixiang Liu

IPC: G01L1/14

Abstract: In one example implementation, a sensor apparatus includes a bracket, a first polar plate, a first contact portion, a first leading wire, a rotating shaft, a support frame, a second polar plate, a second contact portion, and a second leading wire. The bracket is of a cylindrical structure with two open ends. The first leading wire is disposed on the first polar plate and an external side of the bracket, one end of the first leading wire is connected to the first contact portion, and the other end of the first leading wire is connected to the first polar plate. The second contact portion is disposed at a first end of the support frame. The second leading wire is disposed on the support frame and the second polar plate.

公开(公告)号：US11309227B2

公开(公告)日：2022-04-19

申请号：US16757012

申请日：2017-10-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Jianping Fang ,  Yanqin Liao ,  Haohui Long ,  Hui Si

IPC: H01L23/31 ,  G06K9/00 ,  H01L21/56 ,  H01L23/498 ,  H01L23/00

Abstract: A chip package structure and a chip package method, the chip package structure including a die and a package substrate disposed around the die. A solder joint is disposed on a first surface of the die. Remaining surfaces of the die other than a second surface are wrapped by an injection molding material. At least one pair of opposite sides of the package substrate is embedded in the injection molding material. A contact area between the pair of opposite sides and the injection molding material accounts for more than half of a surface area of the pair of opposite sides. The second surface is a surface that is of the die and that is opposite to the first surface.

公开(公告)号：US10996265B2

公开(公告)日：2021-05-04

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

公开(公告)号：US20230267883A1

公开(公告)日：2023-08-24

申请号：US18007259

申请日：2021-07-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Xuan Cao ,  Runqing Ye ,  Jianping Fang ,  Xiaochen Chen

IPC: G09G3/3233 ,  G09G3/00 ,  G06V40/13

CPC classification number: G09G3/3233 ,  G09G3/035 ,  G06V40/1318 ,  G09G2354/00 ,  G09G2300/0452 ,  G09G2300/0408 ,  G09G2330/02

Abstract: A display module includes a circuit board, an integrated chip, and a pixel chipset. The integrated chip is electrically connected to the circuit board, and the integrated chip includes a first chiplet and a plurality of display pixel drive circuits integrated into the first chiplet. The pixel chipset includes a plurality of light-emitting chips. In addition, at least one pixel chipset is disposed on a surface of a side that is of an integrated chip and that is away from the circuit board, a light-emitting chip disposed on the integrated chip is electrically connected to a display pixel drive circuit in the integrated chip, and the display pixel drive circuit is configured to drive the light-emitting chip to emit light.

公开(公告)号：US11450690B2

公开(公告)日：2022-09-20

申请号：US17419118

申请日：2018-12-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Shanshan Wei ,  Yanfeng Liang ,  Yuanjian Liu ,  Jianhui Li ,  Haohui Long

IPC: H01L27/12 ,  G02F1/1345 ,  G06F3/041 ,  G02F1/1333 ,  H01L27/32 ,  H01L51/52

Abstract: A display includes at least an array substrate, and the array substrate has a drive circuit layer. At least one first notch is provided on an outer edge of a lead-out side of the array substrate, and a first conductor is disposed in each first notch. A first end of the first conductor is in contact with a lead end of the drive circuit layer, and a second end of the first conductor extends along the first notch to a back side of the array substrate.

公开(公告)号：US20210391730A1

公开(公告)日：2021-12-16

申请号：US17458904

申请日：2021-08-27

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Yanlin Wang ,  Taixiang Liu

IPC: H02J7/00

Abstract: An electronic device comprises a processor, a charging port, and memory, that stores program code. When the program code is executed by the processor, the electronic device charges a battery of the electronic device using the charging port when a charger is connected to the charging port, stops charging in response to detecting that the charging port is abnormal, and displays a first window on a display interface of the electronic device in response to detecting that the charging port is abnormal. The first window comprises a first prompt information and a second prompt information. The first prompt information is used to prompt that liquid intake exists in the charging port, and the second prompt information is used to prompt a user to exclude a liquid intake situation of the charging port.

公开(公告)号：US11128154B2

公开(公告)日：2021-09-21

申请号：US16828508

申请日：2020-03-24

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Yanlin Wang ,  Taixiang Liu

IPC: H02J7/00

Abstract: A charging method and a related device are provided. A charge protection apparatus includes a micro control unit MCU, a current detection circuit, a gating circuit, and an I/O interface. The current detection circuit detects an external charging current flowing through a power cable. The current detection circuit transmits the external charging current to the MCU. The MCU transmits the external charging current to a user terminal by using the I/O interface, so that the user terminal calculates a current difference between the external charging current and an internal charging current detected by the user terminal, and determines, based on the current difference, whether to generate a circuit control command. The MCU receives the circuit control command sent by the user terminal, and controls, according to the circuit control command, the gating circuit to be in a closed state or an open state.

公开(公告)号：US20190324080A1

公开(公告)日：2019-10-24

申请号：US16095858

申请日：2016-10-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Hui Si ,  Haohui Long ,  Jianping Fang ,  Runqing Ye ,  Weiqiang Hong ,  Yunfei Wang ,  Taixiang Liu

IPC: G01R31/28 ,  H01L21/66

Abstract: A crack detection system and an apparatus equipped with a crack detection circuit, including a main body, and a detection control circuit and a detection coil disposed on the main body. The main body includes a top surface, a bottom surface, and a side surface coupled between the top surface and the bottom surface. The detection coil is distributed on an edge of the main body and disposed surrounding the side surface. Two ends of the detection coil are electrically coupled to the detection control circuit to form a closed-loop detection circuit. The detection circuit is configured to detect a crack in an edge region of the main body. The detection coil includes a plurality of detection sections sequentially coupled from head-to-tail, and adjacent detection sections are not collinear.

公开(公告)号：US20230352334A1

公开(公告)日：2023-11-02

申请号：US18006066

申请日：2021-07-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Haohui Long ,  Shanshan Wei ,  Yong She ,  Jianping Fang

IPC: H01L21/683 ,  H01L25/075

CPC classification number: H01L21/6835 ,  H01L25/0753 ,  H01L2221/68368

Abstract: A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.

公开(公告)号：US11515367B2

公开(公告)日：2022-11-29

申请号：US16979601

申请日：2018-03-31

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Shanshan Wei ,  Yanfeng Liang ,  Haohui Long ,  Jianhui Li ,  Lin Qu

IPC: H01L27/32 ,  G06F3/041 ,  H01L51/56 ,  H05K1/18

Abstract: An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.