Chip Transfer Method and Electronic Device
    2.
    发明公开

    公开(公告)号:US20230352334A1

    公开(公告)日:2023-11-02

    申请号:US18006066

    申请日:2021-07-20

    CPC classification number: H01L21/6835 H01L25/0753 H01L2221/68368

    Abstract: A chip transfer method includes: first, providing a stretchable layer, where the stretchable layer includes a first cloth layer and a second cloth layer, a plurality of first fibers and a plurality of second fibers located between the first cloth layer and the second cloth layer, and a plurality of intersections exist between the first fiber and the second fiber; sticking the stretchable layer to chips, where the first cloth layer is closer to the chips than the second cloth layer; then, separating a plurality of chips, where the plurality of separated chips are separately connected to the first fiber and the second fiber; respectively disposing, at a plurality of preset locations of the substrate, the plurality of chips stuck to the stretchable layer; and removing the first fiber and the second fiber.

    Touchscreen for narrow-frame electronic device, and electronic device

    公开(公告)号:US11550417B2

    公开(公告)日:2023-01-10

    申请号:US17422899

    申请日:2020-01-17

    Abstract: A touchscreen for a narrow-frame electronic device including a conductive layer, a display module, a first circuit board, and a second circuit board. The conductive layer includes a touch sensing electrode and N first traces. The first circuit board includes a touch driving integrated circuit. The second circuit board includes at least one wire. The touch sensing electrode is coupled to a first end of each of the N first traces. A second end of each of M first traces is coupled to a first end of one wire on the second circuit board through the display module, and a second end of each wire on the second circuit board is coupled to the touch driving integrated circuit. The at least one wire on the second circuit board is configured to couple the second end of each of the M first traces to the touch driving integrated circuit.

    Display apparatus, method for manufacturing display apparatus, and electronic device

    公开(公告)号:US11515367B2

    公开(公告)日:2022-11-29

    申请号:US16979601

    申请日:2018-03-31

    Abstract: An electronic device and a method for manufacturing the display apparatus. The electronic device includes a display apparatus and a processor, wherein the display apparatus includes an active-matrix organic light emitting diode (AMOLED) panel, a touch panel, a chip IC, and a printed circuit board. The touch panel is disposed on an upper surface of the AMOLED panel, and the touch panel and the AMOLED panel each has an outgoing line. The outgoing line of the touch panel and the outgoing line of the AMOLED panel are separately extended to form an outgoing line extension end of the touch panel and an outgoing line extension end of the AMOLED panel. The outgoing line extension end of the AMOLED panel and the outgoing line extension end of the touch panel are electrically connected to the printed circuit board PCB by using the chip IC.

    Touch Display Panel, Flexible Display Apparatus, and Method for Manufacturing Touch Display Panel

    公开(公告)号:US20210004101A1

    公开(公告)日:2021-01-07

    申请号:US16766587

    申请日:2017-11-24

    Abstract: This application provides a touch display panel, a flexible display apparatus, and a method for manufacturing the touch display panel. The touch display panel includes a flexible substrate, a display component, a touch component, and a thin film encapsulation layer. The touch component and the display component are located at different locations on an upper surface of the flexible substrate, and the touch component and the display component are stacked together through folding, to form the touch display panel. The thin film encapsulation layer is formed on an upper surface of the touch component, an upper surface of the display component, and the upper surface of the flexible substrate. Due to a bendable feature of the flexible substrate, the display component and the touch component are manufactured at different locations on the flexible substrate at the same time, and an integrated touch display panel is formed through folding. In this way, a procedure of separately manufacturing the touch component is saved, and corresponding manufacturing costs are reduced. In addition, because the touch component and the display component are interconnected by using an internal circuit, a procedure of electrically connecting the touch component to the display component during assembly is saved. This shortens a manufacturing procedure and reduces costs of the touch display panel.

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