Abstract:
A charged particle beam apparatus is provided with a controller configured to control other components and perform operations including: an irradiating operation to irradiate a first position of a sample with a charged particle beam while gradually changing a scan range of the charged particle beam to move from a first position; a first image acquiring operation to acquire an image of each portion where the charged particle beam moves; an indicator forming operation to form an indicator at a second position by the charged particle beam when the scan range of the charged particle beam reaches the second position; a second image acquiring operation to acquire an image of the second position in a state where the indicator is formed; and an adjusting operation to adjust relative position between the stage and the scan range of the charged particle beam.
Abstract:
A TEM sample preparation method including: placing a thin sample on a sample holder so that a first side surface of the thin sample which is closer to a desired observation target is opposed to a focused ion beam column; setting a processing region, which is to be subjected to etching processing by a focused ion beam so as to form a thin film portion including the observation target and having a thickness direction substantially parallel to a thickness direction of the thin sample, to a region of the first side surface that is adjacent to the thin film portion; and performing the etching processing to a portion of the thin sample extending from the first side surface thereof to a front surface thereof by irradiating the processing region with the focused ion beam from the focused ion beam column.
Abstract:
A focused ion beam apparatus includes: an image generation unit which generates a sample image including location detection marks formed on a sample based on secondary charged particles generated with emission of a focused ion beam to a sample; a display unit which displays a sample image; and a control unit which, in a case of performing working by emitting the focused ion beam to a working region beyond a display range, moves a sample stage, detects locations of the location detection marks included in the sample image after the movement of the sample stage as reference marks from the location detection marks included in the sample image before moving the sample stage, and controls an emission location of the focused ion beam based on the reference marks detected in the sample image after being moved.
Abstract:
Provided is a sample preparation method, including: processing a sample by an ion beam, thereby forming a thin film portion having a thickness that allows an electron beam to transmit therethrough; supplying deposition gas to the thin film portion; and irradiating the thin film portion with the electron beam, thereby forming a deposition film on a front surface of the thin film portion and a deposition film on a rear surface of the thin film portion opposed to the front surface.
Abstract:
A thin-sample-piece fabricating device is provided with a focused-ion-beam irradiation optical system, a stage, a stage driving mechanism, and a computer. The focused-ion-beam irradiation optical system performs irradiation with a focused ion beam (FIB). The stage holds a sample piece (Q). The stage driving mechanism drives the stage. The computer sets a thin-piece forming region serving as a treatment region, as well as a peripheral section surrounding the entire periphery of the thin-piece forming region, on the sample piece (Q). The computer causes irradiation with the focused ion beam (FIB) from a direction crossing the irradiated face of the sample piece (Q) so as to perform etching treatment such that the thickness of the thin-piece forming region becomes less than the thickness of the peripheral section.
Abstract:
Provided are a thin film sample creation method and a charged particle beam apparatus capable of preventing a thin film sample piece from being damaged. The method includes a process of processing a sample by irradiating a surface of the sample with a focused ion beam (FIB) from a second direction that crosses a normal line to the surface of the sample to create a thin film sample piece and a connection portion positioned at and connected to one side of the thin film sample piece, a process of rotating the sample around the normal line, a process of connecting the thin film sample piece to a needle for holding the thin film sample piece, and a process of separating the thin film sample piece from the sample by irradiating the connection portion with a focused ion beam from a third direction that crosses the normal line.