公开(公告)号：US10068800B2

公开(公告)日：2018-09-04

申请号：US14407633

申请日：2013-02-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasuhito Yoneta ,  Ryoto Takisawa ,  Shingo Ishihara ,  Hisanori Suzuki ,  Masaharu Muramatsu

IPC: H01L31/0203 ,  H01L21/77 ,  H01L27/146 ,  H04N5/369

Abstract: A method for manufacturing a solid-state imaging device comprises a first step of preparing an imaging element having a second principal surface having an electrode arranged thereon, and a photoelectric converter part configured to photoelectrically convert the incident energy line so as to generate a signal charge; a second step of preparing a support substrate, provided with a through hole extending in a thickness direction thereof, having a third principal surface; a third step of aligning the imaging element and the support substrate with each other so that the electrode is exposed out of the through hole while the second and third principal surfaces oppose each other and joining the imaging element and the support substrate to each other; and a fourth step of arranging a conductive ball-shaped member in the through hole and electrically connecting the ball-shaped member to the electrode after the third step.

公开(公告)号：US20150187649A1

公开(公告)日：2015-07-02

申请号：US14407633

申请日：2013-02-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasuhito Yoneta ,  Ryoto Takisawa ,  Shingo Ishihara ,  Hisanori Suzuki ,  Masaharu Muramatsu

IPC: H01L21/77 ,  H04N5/369

CPC classification number: H01L21/77 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/1469 ,  H01L2224/11 ,  H04N5/369 ,  Y10T29/49124

Abstract: A method for manufacturing a solid-state imaging device comprises a first step of preparing an imaging element having a second principal surface having an electrode arranged thereon, and a photoelectric converter part configured to photoelectrically convert the incident energy line so as to generate a signal charge; a second step of preparing a support substrate, provided with a through hole extending in a thickness direction thereof, having a third principal surface; a third step of aligning the imaging element and the support substrate with each other so that the electrode is exposed out of the through hole while the second and third principal surfaces oppose each other and joining the imaging element and the support substrate to each other; and a fourth step of arranging a conductive ball-shaped member in the through hole and electrically connecting the ball-shaped member to the electrode after the third step.

Abstract translation: 一种制造固态成像装置的方法包括：准备具有布置在其上的具有电极的第二主表面的成像元件的第一步骤和被配置为对入射能量线进行光电转换以产生信号电荷的光电转换器部分 ; 制备具有沿其厚度方向延伸的通孔的支撑基板的第二步骤，具有第三主表面; 第三步骤，使成像元件和支撑基板彼此对准，使得电极从通孔露出，同时第二和第三主表面彼此相对并且将成像元件和支撑基板彼此接合; 以及第四步骤，在所述通孔中布置导电球形构件，并且在所述第三步骤之后将所述球形构件电连接到所述电极。

公开(公告)号：US09754995B2

公开(公告)日：2017-09-05

申请号：US14406851

申请日：2013-02-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasuhito Yoneta ,  Ryoto Takisawa ,  Shingo Ishihara ,  Hisanori Suzuki ,  Masaharu Muramatsu

IPC: H01L27/148 ,  H01L27/146

CPC classification number: H01L27/1469 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/148

Abstract: A method for manufacturing a solid-state imaging device comprises a first step of preparing an imaging element including a second principal surface having an electrode arranged thereon, and a photoelectric converter part configured to photoelectrically convert the incident energy line so as to generate a signal charge; a second step of preparing a support substrate, provided with at least one through hole extending in a thickness direction thereof, having a third principal surface; a third step of aligning the imaging element and the support substrate with each other so that the one electrode is exposed out of the one through hole while the second and third principal surfaces oppose each other and joining the imaging element and the support substrate to each other; and a fourth step of embedding a conductive member in the through hole after the third step.

公开(公告)号：US09502456B2

公开(公告)日：2016-11-22

申请号：US14760258

申请日：2013-09-24

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Shin-ichiro Takagi ,  Shingo Ishihara ,  Masaharu Muramatsu

IPC: H01L31/00 ,  H01L27/146 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L27/14636 ,  H01L23/49838 ,  H01L23/4985 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/48997 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/49429 ,  H01L2224/78301 ,  H01L2224/85181 ,  H01L2224/85207 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2924/00014 ,  H01L2924/10161 ,  H01L2924/15787 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599 ,  H01L2224/48455

Abstract: An electronic component device includes a first electronic component on which a first electrode pad is disposed, a second electronic component on which a second electrode pad having a first pad portion and a second pad portion is disposed, a first bonding wire having one end connected to the first electrode pad and the other end connected to the first pad portion, and a second bonding wire having one end connected to a connection portion between the first pad portion and the first bonding wire and the other end connected to the second pad portion. The second electrode pad is disposed on the second electronic component so that the first pad portion and the second pad portion are laid along a direction intersecting with an extending direction of the first bonding wire. The extending direction of the first bonding wire intersects with an extending direction of the second bonding wire.

Abstract translation: 电子部件装置包括：第一电子部件，配置有第一电极焊盘;第二电子部件，具有第一焊盘部和第二焊盘部的第二电极焊盘，第一焊接线的一端连接到 第一电极焊盘和另一端连接到第一焊盘部分，以及第二接合线，其一端连接到第一焊盘部分和第一焊接线之间的连接部分，而另一端连接到第二焊盘部分。 第二电极焊盘设置在第二电子部件上，使得第一焊盘部分和第二焊盘部分沿着与第一焊接线的延伸方向交叉的方向放置。 第一接合线的延伸方向与第二接合线的延伸方向相交。

公开(公告)号：US20150137301A1

公开(公告)日：2015-05-21

申请号：US14406851

申请日：2013-02-21

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasuhito Yoneta ,  Ryoto Takisawa ,  Shingo Ishihara ,  Hisanori Suzuki ,  Masaharu Muramatsu

IPC: H01L27/146

CPC classification number: H01L27/1469 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/148

Abstract: A method for manufacturing a solid-state imaging device comprises a first step of preparing an imaging element including a second principal surface having an electrode arranged thereon, and a photoelectric converter part configured to photoelectrically convert the incident energy line so as to generate a signal charge; a second step of preparing a support substrate, provided with at least one through hole extending in a thickness direction thereof, having a third principal surface; a third step of aligning the imaging element and the support substrate with each other so that the one electrode is exposed out of the one through hole while the second and third principal surfaces oppose each other and joining the imaging element and the support substrate to each other; and a fourth step of embedding a conductive member in the through hole after the third step.

Abstract translation: 一种制造固态成像装置的方法包括：准备包括其上布置有电极的第二主表面的成像元件的第一步骤和被配置为对入射的能量线进行光电转换以产生信号电荷的光电转换器部分 ; 制备具有至少一个沿其厚度方向延伸的通孔的支撑衬底的第二步骤，具有第三主表面; 使成像元件和支撑基板彼此对准的第三步骤，使得一个电极从一个通孔露出，同时第二和第三主表面彼此相对并且将成像元件和支撑基板彼此接合 ; 以及在第三步骤之后将通孔嵌入到通孔中的第四步骤。

公开(公告)号：US10825730B2

公开(公告)日：2020-11-03

申请号：US16000603

申请日：2018-06-05

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yasuhito Yoneta ,  Ryoto Takisawa ,  Shingo Ishihara ,  Hisanori Suzuki ,  Masaharu Muramatsu

IPC: H01L27/146 ,  H01L21/77 ,  H04N5/369

Abstract: A method for manufacturing a solid-state imaging device comprises a first step of preparing an imaging element having a second principal surface having an electrode arranged thereon, and a photoelectric converter part configured to photoelectrically convert the incident energy line so as to generate a signal charge; a second step of preparing a support substrate, provided with a through hole extending in a thickness direction thereof, having a third principal surface; a third step of aligning the imaging element and the support substrate with each other so that the electrode is exposed out of the through hole while the second and third principal surfaces oppose each other and joining the imaging element and the support substrate to each other; and a fourth step of arranging a conductive ball-shaped member in the through hole and electrically connecting the ball-shaped member to the electrode after the third step.