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公开(公告)号:US10480995B2
公开(公告)日:2019-11-19
申请号:US15550127
申请日:2015-11-19
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Masatoshi Ishihara , Hiroo Yamamoto , Yoshiaki Ohshige
Abstract: The signal processing board includes a plurality of signal processing circuits configured to process signals output from a plurality of pixels of an infrared detecting element. The signal processing board includes an element placement area where the infrared detecting element is placed, and a circuit placement area positioned outside the element placement area to surround the element placement area when viewed from a direction orthogonal to the signal processing board. The signal processing board includes a plurality of insulating layers that are stacked on a surface side opposing the semiconductor substrate. A plurality of signal processing circuits are placed in the circuit placement area. A heat-conducting layer is placed to be positioned on at least one of the insulating layers and in the element placement area, in the signal processing board. The heat-conducting layer has a heat conductivity that is higher than a heat conductivity of the insulating layers.
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公开(公告)号:US10393649B2
公开(公告)日:2019-08-27
申请号:US15542530
申请日:2016-01-13
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Ryusuke Kitaura , Masatoshi Ishihara , Masahiro Yamazaki , Hironori Takahashi
IPC: G01N21/35 , G01N21/3581 , G01J1/02 , G01R29/08 , H01Q19/30 , G01J3/42 , G01J5/08 , G01J5/20 , G01J5/24 , G01J5/04 , H01Q1/24 , H01Q1/38
Abstract: A THz bolometer detector includes a directional antenna 1 that receives a THz wave having a wavelength λ and radiates the received THz wave, a reception antenna 2 that is provided so as to face the directional antenna 1, and a bolometer 4 that detects heat generation due to a current flowing in the reception antenna 2. The directional antenna 1 overlaps the reception antenna 2 in plan view, and a longitudinal length of the directional antenna 1 is set to be less than a longitudinal length of the reception antenna 2.
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