Electronic device assembly with compression gasket
    1.
    发明授权
    Electronic device assembly with compression gasket 有权
    带压缩垫片的电子装置组件

    公开(公告)号:US09411385B2

    公开(公告)日:2016-08-09

    申请号:US13892571

    申请日:2013-05-13

    摘要: An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.

    摘要翻译: 组件(1000)包括设置在基板上的基板(1002)和发热电子部件(1001)。 屏蔽层(1003)设置在基板上,从而封装发热电子部件。 显示组件(101)设置在护罩的上方。 可压缩垫(1004)设置在屏蔽和显示组件之间。 可压缩垫在发热电气部件上方形成孔(1005)。 孔径可以具有作为屏蔽区域和发热电气部件面积的函数的尺寸。