Invention Grant
- Patent Title: Electronic device assembly with compression gasket
- Patent Title (中): 带压缩垫片的电子装置组件
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Application No.: US13892571Application Date: 2013-05-13
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Publication No.: US09411385B2Publication Date: 2016-08-09
- Inventor: Amber M. Pierce , Morris B. Bowers , Adam R. Cole , Srikanth V. Thiruppukuzhi
- Applicant: GOOGLE TECHNOLOGY HOLDINGS LLC.
- Applicant Address: US CA Mountain View
- Assignee: Google Technology Holdings LLC
- Current Assignee: Google Technology Holdings LLC
- Current Assignee Address: US CA Mountain View
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; G06F1/16 ; H05K9/00
Abstract:
An assembly (1000) includes a substrate (1002) and a heat emissive electrical component (1001) disposed on the substrate. A shield (1003) is disposed on the substrate, thereby enclosing the heat emissive electrical component. A display assembly (101) is disposed above the shield. A compressible pad (1004) is disposed between the shield and the display assembly. The compressible pad defines an aperture (1005) above the heat emissive electrical component. The aperture can have dimensions that are a function of a shield area and a heat emissive electrical component area.
Public/Granted literature
- US20140334081A1 ELECTRONIC DEVICE ASSEMBLY WITH COMPRESSION GASKET Public/Granted day:2014-11-13
Information query
