公开(公告)号：US11515689B2

公开(公告)日：2022-11-29

申请号：US16958355

申请日：2018-12-26

申请人： FUJIKURA LTD.

发明人： Ken Katagiri ,  Yohei Kasai

IPC分类号： H01S5/02325 ,  H01S5/40 ,  H01S5/0235 ,  H01S5/02251 ,  H01S5/023 ,  H01S5/0233

摘要： A semiconductor laser module includes: an optical fiber that outputs a first laser beam to an exterior of the semiconductor laser module; semiconductor laser devices each including an emission portion that emits a second laser beam, an electrically conductive portion that supplies electric power to the emission portion, and a mount on which the emission portion and the electrically conductive portion are disposed; a mount base including mount surfaces that form steps; and an optical system that optically couples the second laser beams from the emission portions to an incident end face of the optical fiber. The mounts of the semiconductor laser devices are disposed on the mount surfaces. The semiconductor laser devices include an upper semiconductor laser device and a lower semiconductor laser device adjacent to each other in a step direction of the mount base.

公开(公告)号：US20200064567A1

公开(公告)日：2020-02-27

申请号：US16482042

申请日：2017-09-08

申请人： FUJIKURA LTD.

发明人： Yohei Kasai

IPC分类号： G02B6/42 ,  H01S5/022 ,  G02B7/02 ,  H01S5/40 ,  G02B27/30

摘要： A light-guiding device includes: a group of mirrors that converts a first beam bundle including a plurality of first laser beams into a second beam bundle including a plurality of second laser beams; a group of collimating lenses disposed at a stage previous to the group of mirrors and including collimating lenses that each collimate a divergence, in an F-axis direction, of a corresponding one of the plurality of first laser beams; and a converging lens disposed at a stage subsequent to the group of mirrors, the converging lens converges the second beam bundle by refracting each of the plurality of second laser beams.

公开(公告)号：US20170100917A1

公开(公告)日：2017-04-13

申请号：US15388070

申请日：2016-12-22

申请人： FUJIKURA LTD.

发明人： Shohei Kumeta ,  Gento Yoshino ,  Yohei Kasai ,  Akira Sakamoto

IPC分类号： B32B15/04 ,  C09J5/02 ,  B32B7/12 ,  B32B38/00 ,  B32B37/12

摘要： The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).

公开(公告)号：US08818159B2

公开(公告)日：2014-08-26

申请号：US13969716

申请日：2013-08-19

申请人： Fujikura Ltd.

发明人： Nozomu Toyohara ,  Akira Sakamoto ,  Yohei Kasai

IPC分类号： G02B6/00

CPC分类号： G02B6/3628 ,  B23K1/0056 ,  G02B6/4202 ,  G02B6/424 ,  G02B6/4257

摘要： A fiber mount device 2 includes a fiber sub-mount main body 31 that is made of ceramic transmitting a laser beam having a predetermined wavelength, a bonding pad 33 that is provided on the upper surface of the fiber sub-mount main body 31, and a laser absorption layer 32 that is provided on at least a part of the lower surface of the fiber sub-mount main body 31 and absorbs the laser beam having the predetermined wavelength.

摘要翻译： 光纤安装装置2包括由传输具有预定波长的激光束的陶瓷制成的光纤副安装主体31，设置在光纤分支架主体31的上表面上的焊盘33，以及 激光吸收层32，其设置在光纤副安装主体31的下表面的至少一部分上并吸收具有预定波长的激光束。

公开(公告)号：US10668696B2

公开(公告)日：2020-06-02

申请号：US15388070

申请日：2016-12-22

申请人： FUJIKURA LTD.

发明人： Shohei Kumeta ,  Gento Yoshino ,  Yohei Kasai ,  Akira Sakamoto

IPC分类号： B32B3/00 ,  B32B15/04 ,  C09J5/02 ,  C09J201/00 ,  C03C27/04 ,  H01L23/00 ,  B32B17/00 ,  B32B15/20 ,  B32B7/12 ,  B32B37/12 ,  B32B38/00

摘要： The present invention provides a bonding method (S1) which is capable of achieving a high adhesive force without carrying out any special treatment on the second member (14), even in a case where the first member (11) has a surface on which a gold thin film (12) is formed. The first member (11) is made of a material other than gold and has a surface on which the gold thin film (12) is formed. The bonding method (S1) includes the steps of: (S11) irradiating, with laser light, at least part of a specific region (12a) of the surface of the first member (11), so that a base of the thin film (12) is exposed in the at least part of the specific region (12a); and (S12) bonding the second member (14) to the specific region (12a) by use of an adhesive (13).

公开(公告)号：US20180175583A1

公开(公告)日：2018-06-21

申请号：US15736563

申请日：2016-02-26

申请人： Fujikura Ltd.

发明人： Shinichi Sakamoto ,  Yohei Kasai

IPC分类号： H01S5/022 ,  H01L23/36 ,  H01S5/024

CPC分类号： H01S5/02256 ,  H01L23/36 ,  H01S5/0207 ,  H01S5/022 ,  H01S5/02236 ,  H01S5/02268 ,  H01S5/02272 ,  H01S5/024 ,  H01S5/02469

摘要： In a laser device 1 in which a laser module 2 is mounted on a heat sink 3, a base plate 20 of the laser module 2 is fixed onto a mounting surface 3s of the heat sink 3 in such a manner that a peripheral part 20b is fixed to the heat sink 3 with screws. The elastic force of the base plate 20 causes stress in the direction toward the mounting surface 3s on the central part 20a of the base plate 20 surrounded by the peripheral part 20b.

公开(公告)号：US09897768B2

公开(公告)日：2018-02-20

申请号：US15432070

申请日：2017-02-14

申请人： Fujikura Ltd.

发明人： Yohei Kasai

IPC分类号： G02B6/42 ,  G02B6/32 ,  H01S5/00 ,  H01S5/022 ,  H01S5/024

CPC分类号： G02B6/42 ,  G02B6/32 ,  G02B6/4269 ,  H01S5/0071 ,  H01S5/02216 ,  H01S5/02236 ,  H01S5/02284 ,  H01S5/02438 ,  H01S5/02469

摘要： An optical fiber module has a package housing having an internal space defined by a base plate, a side wall, and a cover member, a laser device disposed on the base plate within the internal space, an optical fiber that transmits a laser beam emitted from the laser device to an outside of the package housing, a light scattering member that scatters light having a wavelength of the laser beam and covers an outer circumferential surface of the projecting end of the optical fiber, and a heat dissipation portion disposed on the base plate. The optical fiber has a projecting end projecting from an inner surface of the side wall toward the internal space. The heat dissipation portion covers a portion of an outer circumferential surface of the light scattering member and exposes another portion of the outer circumferential surface of the light scattering member to the internal space.

公开(公告)号：US09088128B2

公开(公告)日：2015-07-21

申请号：US14296799

申请日：2014-06-05

申请人： FUJIKURA LTD.

发明人： Yohei Kasai

IPC分类号： H01S3/30 ,  H01S3/067 ,  G02B6/42 ,  B23K1/00 ,  H01S5/00 ,  H01S5/022

CPC分类号： H01S3/06704 ,  B23K1/0008 ,  G02B6/4204 ,  G02B6/4248 ,  G02B6/4268 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01S5/005 ,  H01S5/02248 ,  H01S5/02252 ,  H01S5/02284 ,  H01L2924/00014

摘要： A laser module includes: a bottom plate of a box; the frame member being fixed to the bottom plate; a pipe member including a hollow portion PH communicating with the through hole OP of a box, the pipe member being fixed to the outer wall of the frame member; an optical fiber held on the hollow portion PH of the pipe member; and a laser element accommodated in the internal space of the box, the optical axis of the laser element being aligned with the optical axis of the optical fiber. When the bottom plate is placed on a plane, the bottom face of the pipe member is on the same face as a bottom plate portion contacting the plane.

摘要翻译： 激光模块包括：盒的底板; 框架构件固定到底板; 管构件，其包括与箱体的通孔OP连通的中空部PH，所述管构件固定在所述框架构件的外壁上; 保持在管构件的中空部PH上的光纤; 以及容纳在盒的内部空间中的激光元件，激光元件的光轴与光纤的光轴对准。 当底板被放置在平面上时，管件的底面位于与平面接触的底板部分相同的面上。

公开(公告)号：US08638826B2

公开(公告)日：2014-01-28

申请号：US13628944

申请日：2012-09-27

申请人： Fujikura Ltd.

发明人： Akira Sakamoto ,  Nozomu Toyohara ,  Yohei Kasai

IPC分类号： H01S3/04

摘要： The laser device includes a semiconductor laser element having an emission surface from which laser light is emitted, an optical fiber having an end part facing the emission surface, and an optical fiber supporting member which (i) supports the optical fiber and (ii) has a bonding pad to which the optical fiber is fixed by solder. The optical fiber supporting member includes a beam part having (i) a first main surface on which the bonding pad is provided and (ii) a second main surface opposite to the first main surface, and a pillar part which is fixed to a base and is joined to the beam part on an end portion of the beam part such that the second main surface and the base face each other while being spatially away from each other.

公开(公告)号：US20230352913A1

公开(公告)日：2023-11-02

申请号：US18041607

申请日：2021-10-22

申请人： Fujikura Ltd.

发明人： Yohei Kasai

IPC分类号： H01S5/40 ,  H01S5/02253 ,  H01S5/02251 ,  H01S5/02326

CPC分类号： H01S5/4012 ,  H01S5/4087 ,  H01S5/02253 ,  H01S5/02251 ,  H01S5/02326

摘要： A laser module includes: a first laser diode that emits a first light beam having a first wavelength; a second laser diode that emits a second light beam having a second wavelength different from the first wavelength; a fast-axis collimating lens disposed corresponding to each of the first and second laser diodes to collimate a fast-axis direction of each of the first and second light beams emitted from each of the first and second laser diodes; a slow-axis collimating lens disposed corresponding to each of the first and second laser diodes to collimate a slow-axis direction of each of the first and second light beams emitted from each of the first and second laser diodes; and a wavelength combining element including a volume Bragg grating (VBG) or a diffraction grating.