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公开(公告)号：US12152311B2
公开(公告)日：2024-11-26
申请号：US17761304
申请日：2020-12-28
Applicant: EBARA CORPORATION
Inventor： Shao Hua Chang , Masaya Seki
Abstract: Provided is a wetting method for substrate that allows reducing an amount of air bubbles attached to a surface to be plated with a simple structure.
The wetting method for substrate includes a holding step 102 of holding a back surface of a substrate with a back plate such that a surface to be plated of the substrate is opposed to a liquid surface of a plating solution housed in a plating tank, a supplying step 104 of supplying the plating solution to the plating tank such that the plating solution upwardly flows through a plurality of through-holes in a center part of an ionically resistive element arranged inside the plating tank to raise a center part of the liquid surface of the plating solution, a first lowering step 106 of lowering a supporting member for supporting an outer edge portion of the surface to be plated of the substrate held by the holding member toward the liquid surface of the plating solution, and a second lowering step 108 of lowering the holding member such that the substrate is sandwiched by the supporting member lowered in the first lowering step 106 and the holding member while the center part of the liquid surface of the plating solution is raised in the supplying step 104.-
公开(公告)号：US11906299B2
公开(公告)日：2024-02-20
申请号：US17616906
申请日：2021-01-20
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Masaki Tomita , Shao Hua Chang
CPC classification number: G01B7/06 , C25D5/007 , C25D17/005 , C25D17/02 , C25D17/10 , C25D21/14 , G01R15/12 , G01R15/181
Abstract: Provided is a technique that allows measuring a film thickness of a substrate in a plating process.
A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.-
公开(公告)号：US11833551B2
公开(公告)日：2023-12-05
申请号：US17839070
申请日：2022-06-13
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Mitsutoshi Yahagi , Nobuya Yamada
IPC: B08B3/02 , C23C18/16 , C23C18/18 , H01L21/687
CPC classification number: B08B3/022 , C23C18/163 , C23C18/18 , H01L21/68764
Abstract: A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.
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公开(公告)号：US10403505B2
公开(公告)日：2019-09-03
申请号：US15701206
申请日：2017-09-11
Applicant: EBARA CORPORATION
Inventor： Kenya Ito , Masaya Seki , Kenichi Kobayashi , Michiyoshi Yamashita
IPC: H01L21/304 , B23K26/08 , B24B37/00 , H01L21/02 , H01L21/67 , B24B21/00 , B24B21/08 , B24B9/06 , B23K101/40
Abstract: A method and an apparatus for processing a peripheral portion of a substrate, such as a wafer, are disclosed. The substrate processing method includes: holding a substrate on a substrate stage; rotating the substrate stage and the substrate about an axis of the substrate stage; directing a laser beam to an edge portion of the rotating substrate to form an annular crack in the substrate; and pressing a polishing tool against the edge portion of the rotating substrate to form a stepped recess in a peripheral portion of the substrate.
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公开(公告)号：US09782869B2
公开(公告)日：2017-10-10
申请号：US14987434
申请日：2016-01-04
Applicant: EBARA CORPORATION
Inventor： Tetsuji Togawa , Masaya Seki , Hiroyuki Takenaka
IPC: B24B37/00 , B24B37/005 , B24B9/06 , B24B21/00
CPC classification number: B24B37/005 , B24B9/065 , B24B21/002
Abstract: Detection of an abnormality in polishing of a substrate is provided. A measuring device measures a position of the polishing tool relative to a surface of the substrate. A controller determines an amount of polishing of the substrate from the position of the polishing tool; calculates a polishing rate from the amount of polishing of the substrate; and judges that an abnormality in polishing of the edge portion of the substrate has occurred if the polishing rate is out of a predetermined range exceeds a predetermined threshold value.
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Patent Agency Ranking
公开(公告)号：US09561573B2
公开(公告)日：2017-02-07
申请号：US14167129
申请日：2014-01-29
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Tetsuji Togawa
CPC classification number: B24B21/002 , B24B9/065 , B24B21/004 , B24B21/18
Abstract: A polishing apparatus is used for polishing a substrate such as a semiconductor wafer. The polishing apparatus includes a substrate holder to hold a substrate and to rotate the substrate, a pressing member configured to press a polishing tool against the substrate and to polish the substrate, a pressing force control mechanism configured to control a pressing force of the pressing member, and a polishing position limiting mechanism configured to limit a polishing position of the pressing member. A polishing tape or a fixed abrasive is used as the polishing tool.
Abstract translation: 抛光装置用于抛光诸如半导体晶片的基板。 抛光装置包括用于保持基板并旋转基板的基板保持件，构造成将抛光工具压靠在基板上并对基板进行抛光的按压部件，被配置为控制按压部件的按压力的按压力控制机构 以及配置为限制按压部件的研磨位置的抛光位置限制机构。 抛光带或固定磨料用作抛光工具。
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公开(公告)号：US20150258653A1
公开(公告)日：2015-09-17
申请号：US14643529
申请日：2015-03-10
Applicant: Ebara Corporation
Inventor： Masaya Seki , Tetsuji Togawa , Kenya Ito
IPC: B24B21/00 , H01L21/304 , B24B49/00
CPC classification number: B24B21/002 , B24B9/065 , B24B21/00 , B24B21/004 , B24B21/02 , B24B27/0076 , B24B49/00 , B24B49/12
Abstract: A polishing unit of a polishing apparatus according to an embodiment includes: a polishing head having a pressing member configured to hold a polishing tape and press the polishing tape against a peripheral portion of a substrate from above; a tape supply and recovery mechanism configured to supply the polishing tape to the polishing head and recover the polishing tape from the polishing head; a first moving mechanism configured to move the polishing head in a radial direction of the substrate; and a second moving mechanism configured to move the tape supply and recovery mechanism in the radial direction of the substrate. The positioning unit includes a positioning block having a contacting surface, and alignment of the polishing tape is conducted by the second moving mechanism moving the tape supply and recovery mechanism so that a substrate-side edge of the polishing tape makes contact with the contacting surface.
Abstract translation: 根据实施例的抛光装置的抛光单元包括：抛光头，其具有构造成保持研磨带的按压构件，并且从上方将研磨带压靠在基板的周边部分; 磁带供给和恢复机构，被配置为将抛光带提供到抛光头并从抛光头回收抛光带; 第一移动机构，其构造成在所述基板的径向方向上移动所述抛光头; 以及第二移动机构，其构造成沿着所述基板的径向方向移动所述带供给和恢复机构。 定位单元包括具有接触表面的定位块，并且通过移动带供应和恢复机构的第二移动机构来导引研磨带的对准，使得研磨带的基板侧边缘与接触表面接触。
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公开(公告)号：US08748289B2
公开(公告)日：2014-06-10
申请号：US13868500
申请日：2013-04-23
Applicant: Ebara Corporation
Inventor： Masayuki Nakanishi , Tetsuji Togawa , Kenya Ito , Masaya Seki , Kenji Iwade , Takeo Kubota
CPC classification number: H01L21/02038 , B24B9/065 , B24B21/002 , B24B37/042 , H01L21/02087 , H01L21/304 , H01L21/76256
Abstract: A method for manufacturing a semiconductor device makes it possible to efficiently polish with a polishing tape a peripheral portion of a silicon substrate under polishing conditions particularly suited for a deposited film and for silicon underlying the deposited film. The method includes pressing a first polishing tape against a peripheral portion of a device substrate having a deposited film on a silicon surface while rotating the device substrate at a first rotational speed, thereby removing the deposited film lying in the peripheral portion of the device substrate and exposing the underlying silicon. A second polishing tape is pressed against the exposed silicon lying in the peripheral portion of the device substrate while rotating the device substrate at a second rotational speed, thereby polishing the silicon to a predetermined depth.
Abstract translation: 一种制造半导体器件的方法使得可以在抛光条件下，在特别适用于沉积膜的抛光条件和沉积膜下面的硅的抛光条件下，用研磨带有效地抛光硅衬底的周边部分。 该方法包括在第一旋转速度旋转器件基板的同时将第一研磨带压靠在具有沉积膜的器件基板的周边部分上，同时以第一转速旋转器件基板，从而去除位于器件基板的周边部分中的沉积膜， 暴露下面的硅。 在第二旋转速度旋转器件基板的同时，将第二研磨带压在位于器件基板的周边部分中的暴露的硅上，从而将硅抛光到预定的深度。
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公开(公告)号：US12180606B2
公开(公告)日：2024-12-31
申请号：US17617135
申请日：2021-02-22
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Masaki Tomita , Shao Hua Chang
Abstract: Provided is a technique that ensures suppressed invasion of particles generated at a bearing of a rotation mechanism into a plating tank.
A plating apparatus 1000 includes a labyrinth seal member 50. The labyrinth seal member includes an inner labyrinth seal 53 arranged below a bearing 33 to seal the bearing, an outer labyrinth seal 54 arranged outside in a radial direction of the rotation shaft 32 with respect to the inner labyrinth seal, a delivery port 55 configured to supply air to an inner seal space 60 formed inside in the radial direction with respect to the inner labyrinth seal, and a suction port 56 configured to suction air in an outer seal space 65 formed outside in the radial direction with respect to the inner labyrinth seal and inside in the radial direction with respect to the outer labyrinth seal.-
公开(公告)号：US12076760B2
公开(公告)日：2024-09-03
申请号：US18494501
申请日：2023-10-25
Applicant: EBARA CORPORATION
Inventor： Masaya Seki , Mitsutoshi Yahagi , Nobuya Yamada
IPC: B08B3/02 , C23C18/16 , C23C18/18 , H01L21/687
CPC classification number: B08B3/022 , C23C18/163 , C23C18/18 , H01L21/68764
Abstract: A preprocess is efficiently performed on a substrate. A pre-wet module 200 includes a deaeration tank 210, a processing device 258, a substrate holder 220, and a drive mechanism 230. The deaeration tank 210 is configured to house a deaerated liquid. The processing device 258 includes a nozzle 268 configured to supply a cleaning liquid to a surface to be processed of a substrate having the surface to be processed facing upward. The substrate holder 220 is disposed between the deaeration tank 210 and the processing device 258. The substrate holder 220 includes a first holding member 222 configured to hold a first substrate and a second holding member 224 configured to hold a second substrate. The drive mechanism 230 is configured to rotate and move up and down the substrate holder 220. The drive mechanism 230 includes a rotation mechanism 240 and an elevating mechanism 248. The rotation mechanism 240 is configured to rotate the substrate holder 220 between a first state where a surface to be processed of the first substrate is opposed to a deaerated liquid in the deaeration tank 210 and a second state where a surface to be processed of the second substrate is opposed to the deaerated liquid in the deaeration tank. The elevating mechanism 248 is configured to move up and down the substrate holder 220.
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