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公开(公告)号：US11876084B2
公开(公告)日：2024-01-16
申请号：US18171686
申请日：2023-02-21
发明人： Pengkai Ji , Shouyu Hong , Haoyi Ye , Jianhong Zeng
IPC分类号： H01L25/10 , H01L23/538 , H01L23/00 , H01L23/367 , H01L23/64 , H01L23/31 , H02M3/158 , H02M3/335
CPC分类号： H01L25/105 , H01L23/3121 , H01L23/3672 , H01L23/5381 , H01L23/562 , H01L23/642 , H01L23/645 , H02M3/1582 , H02M3/33576
摘要： A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.
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公开(公告)号：US11676756B2
公开(公告)日：2023-06-13
申请号：US16735723
申请日：2020-01-07
发明人： Pengkai Ji , Jinping Zhou , Shouyu Hong , Jianhong Zeng , Mingzhun Zhang , Min Zhou
IPC分类号： H01F27/28 , H01F27/30 , H01F27/26 , H01F27/32 , H01F17/04 , H01F27/29 , H01F3/08 , G05F1/30 , H02M3/158 , H01F5/06 , H01F3/14
CPC分类号： H01F27/306 , G05F1/30 , H01F3/08 , H01F3/14 , H01F5/06 , H01F17/04 , H01F27/266 , H01F27/29 , H01F27/324 , H02M3/158 , H01F2017/048
摘要： Provided are a coupled inductor and a power module including the coupled inductor. A coupled inductor includes: a magnetic core, a first winding and a second winding, where a first passage is formed in the magnetic core; a part of the first winding and a part of the second winding pass through the first passage, and the first winding crosses with the second winding outside the first passage. Another coupled inductor includes: a magnetic core, a first winding and a second winding, where the magnetic core has a first passage and a second passage in parallel, both run through the magnetic core from one end face thereof to another opposite end face, where the first winding and the second winding both penetrate the first passage and the second passage, such that differently-named terminals of the windings are located on the same end face of the magnetic core.
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公开(公告)号：US11621254B2
公开(公告)日：2023-04-04
申请号：US17102393
申请日：2020-11-23
发明人： Pengkai Ji , Shouyu Hong , Haoyi Ye , Jianhong Zeng
IPC分类号： H01L25/10 , H01L23/538 , H01L23/31 , H01L23/367 , H01L23/64 , H01L23/00 , H02M3/158 , H02M3/335
摘要： A power supply system includes a system board electrically connected to a load; a first package and a second package provided on an upper side of the system board; and a bridge member provided on upper sides of the first package and the second package, comprising a passive element and used for power coupling between the first package and the second package, wherein vertical projections of the first package and the second package on the system board are both overlapped with a vertical projection of the bridge member on the system board, the first package, and the second package are encapsulated with switching devices, terminals on upper surfaces of the first package and the second package are electrically connected to the bridge member, and terminals on lower surfaces thereof are electrically connected to the system board.
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公开(公告)号：US11610853B2
公开(公告)日：2023-03-21
申请号：US17809277
申请日：2022-06-28
发明人： Shouyu Hong , Shili Wu , Ganyu Zhou , Yuan Gao , Jinshan Shi , Jianhong Zeng
IPC分类号： H01L21/768 , H01L23/31 , H01L23/62 , H01L23/525 , H01L27/24 , H01L29/66 , H03K17/0812 , H03K17/08
摘要： The present disclosure provides a semiconductor chip including a functional area, a first end, a second end, a third end, and a connecting portion. The functional area has first and second sides opposite to each other. The first end is disposed on the first side and the third end is disposed on the first side, wherein the semiconductor chip is switched on or off according to the drive signal received between the third end and the first end, and the connecting portion is disposed on the first side of the functional area and connected to the first end and the third end, wherein when the temperature rises above the a first temperature, the connecting portion is in a conductive state, and when the temperature drops to be not higher than a third temperature, the connecting portion is in an insulated state.
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公开(公告)号：US11450480B2
公开(公告)日：2022-09-20
申请号：US16671158
申请日：2019-10-31
发明人： Chaofeng Cai , Xiaoni Xin , Jianhong Zeng , Shouyu Hong , Rui Wu , Haoyi Ye , Yiqing Ye , Jinping Zhou , Zhiheng Fu , Min Zhou , Yu-Ching Kuo , Tong-Sheng Pan , Wen-Yu Lin
IPC分类号： H01F5/00 , H01F41/08 , H01F41/064 , H01F41/02 , H01F30/08
摘要： The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, a first metal winding and a second metal winding. A first wiring layer, a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from the outside to the inside; the first metal winding is formed on the first wiring layer and winded around the magnetic core in a foil structure; the first insulating layer is at least partially covered by the first metal winding; a second metal winding is formed on the second wiring layer and winded around the magnetic core in a foil structure, wherein the second metal winding is at least partially covered by the first insulating layer, and is at least partially covered by the first metal winding.
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公开(公告)号：US11024588B2
公开(公告)日：2021-06-01
申请号：US16820690
申请日：2020-03-16
发明人： Jianhong Zeng , Yan Chen , Le Liang , Xiaoni Xin
IPC分类号： H01L23/538 , H01L23/64 , H01L23/50 , H01L23/66 , H01L23/482 , H01L23/00 , H01L23/48 , H01L27/088 , H01L27/02 , H01L23/522 , H01L23/528 , H01L21/56
摘要： A power integrated module, including at least one first bridge formed in a chip, wherein the first bridge includes: a first upper bridge switch, formed by a plurality of first sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first lower bridge switch, formed by a plurality of second sub switches formed in the chip connected in parallel, and including a first, a second and a control end; a first electrode, connected to the first end of the first upper bridge switch; a second electrode, connected to the second end of the first lower bridge switch; and a third electrode, connected to the second end of the first upper bridge switch and the first end of the first lower bridge switch, wherein the first, the second and the third electrode are bar-type electrodes arranged side by side.
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公开(公告)号：US10263530B2
公开(公告)日：2019-04-16
申请号：US15344765
申请日：2016-11-07
发明人： Jianhong Zeng , Xiaoni Xin
IPC分类号： H01F27/24 , H02M7/00 , H01F27/28 , H02M7/04 , H05K1/02 , H05K1/11 , H05K1/14 , H05K1/18 , H05K7/02 , H05K7/06 , H01F27/40 , H02M3/335 , H05K1/16 , H01F27/30 , H02M1/00
摘要： A converter module includes: a system board; and an isolated rectifier unit connected with the system board via at least one pin, the isolated rectifier unit including: a magnetic core including at least one core column parallel to the system board and two cover plates provided at both ends of the core column; and multiple carrier board units provided between the two cover plates and perpendicular to the system board, wherein the carrier board unit includes at least one via hole, at least one primary winding and at least one secondary winding; and wherein the at least one core column passes through the via hole of the carrier board unit, the pin is provided at one side of at least one of the carrier board units close to the system board and configured to connect the carrier board units with the system board.
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公开(公告)号：US20170256346A1
公开(公告)日：2017-09-07
申请号：US15158016
申请日：2016-05-18
发明人： Jianhong Zeng , Shouyu Hong , Min Zhou
CPC分类号： H05K1/181 , H01F3/14 , H01F17/0013 , H01F17/06 , H05K1/165 , H05K1/186 , H05K3/284 , Y02P70/611
摘要： A magnetic assembly is disclosed. The magnetic assembly includes a first magnetic core, a second magnetic core and a first series winding. The first magnetic core has a first top surface, a first bottom surface, a first sidewall, a second sidewall, at least one first sidewall through-hole and at least one second sidewall through-hole. The second magnetic core is connected to the first top surface of the first magnetic core. The first series winding has a first upper winding set, a first sidewall winding set, and a second sidewall winding set disposed on the first top surface, the first sidewall and the second sidewall respectively. The upper winding set is connected to the lower winding set via the first sidewall winding set and the second sidewall winding set is further connected to the lower winding set, so as to form the first series winding around the first magnetic core.
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公开(公告)号：US12106895B2
公开(公告)日：2024-10-01
申请号：US18492801
申请日：2023-10-24
发明人： Chaofeng Cai , Xiaoni Xin , Jianhong Zeng , Shouyu Hong , Rui Wu , Haoyi Ye , Yiqing Ye , Jinping Zhou , Zhiheng Fu , Min Zhou , Yu-Ching Kuo , Tong-Sheng Pan , Wen-Yu Lin
CPC分类号： H01F41/08 , H01F41/0213 , H01F41/064 , H01F30/08 , H01F41/04
摘要： The present disclosure provides a transformer module and a power module, wherein the transformer module comprises: a magnetic core, where a first insulating layer and a second wiring layer are sequentially disposed on the magnetic core from inside to outside; a first metal winding, wound around the magnetic core and comprising a first winding segment formed in the first wiring layer and a second winding segment formed in the second wiring layer; and a second metal winding, wound around the magnetic core and comprising a third winding segment formed in the first wiring layer and a fourth winding segment formed in the second wiring; where at least part of the first metal winding and the second metal winding are wound around the magnetic core in a foil structure.
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公开(公告)号：US11978584B2
公开(公告)日：2024-05-07
申请号：US18301977
申请日：2023-04-17
发明人： Shouyu Hong , Jianping Ying , Jianhong Zeng , Chaofeng Cai , Ganyu Zhou , Pengkai Ji
CPC分类号： H01F41/041 , H01F27/24 , H01F27/2804
摘要： The present disclosure provides a magnetic element and a method for manufacturing same. The method includes: forming a first metal wiring layer on a surface of at least one segment of a magnetic core; forming a first metal protection layer on the first metal wiring layer; removing a portion of the first metal protection layer with a direct writing technique to expose a portion of the first metal wiring layer; and etching the exposed first metal wiring layer in such a manner that the first metal wiring layer forms at least one first pattern to function as a winding, where at least one turn of the first pattern surrounds the magnetic core. The magnetic element and the method for manufacturing the magnetic element provided in the present disclosure can improve space utilization of the magnetic element.
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