Method for manufacturing pattern-formed body

    公开(公告)号:US10545404B2

    公开(公告)日:2020-01-28

    申请号:US14897478

    申请日:2014-06-06

    IPC分类号: G03F7/038

    摘要: To provide a production method of a pattern-formed body, which can simply provide a pattern with surface free energy differences. A cured resin layer, to which a pattern of a master (20) has been transferred, is formed on a base (11), by applying a resin composition (12) containing a first compound exhibiting low surface free energy, and a second compound exhibiting surface free energy higher than the surface free energy of the first compound, on the base (11), and curing the resin composition (12) with bringing the resin composition into contact with a master (20), to which a pattern has been formed with surface free energy differences.

    Wiring board manufacturing method and wiring board

    公开(公告)号:US10477694B2

    公开(公告)日:2019-11-12

    申请号:US15735772

    申请日:2016-06-22

    摘要: A wiring board manufacturing method and a wiring board in which a pattern can be simply and easily formed even when using a coating composition having a high surface tension are provided. The method includes a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a surface free energy which is higher than that of the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing the resin composition to form a base material to which the surface free energy difference pattern is transferred; and a conductor pattern forming step of applying a conductive coating composition onto a pattern transfer surface of the base material to form a conductor pattern, the base material having a pattern of a high surface free energy region and a low surface free energy region, and the high surface free energy region having a surface free energy of more than 62 mJ/m2.

    Wiring board and method for manufacturing the same

    公开(公告)号:US10136521B2

    公开(公告)日:2018-11-20

    申请号:US15523764

    申请日:2015-11-11

    摘要: A wiring board and a method for manufacturing the same enabling simple and easy formation of a conductive pattern are provided. The method comprises a transferring step of bringing a resin composition containing a first compound inducing a low surface free energy and a second compound inducing a higher surface free energy than the first compound into contact with a master on which a desired surface free energy difference pattern is formed and curing to obtain a base material to which the surface free energy difference pattern is transferred; and a conductive pattern forming step of applying a conductive coating composition onto a surface of pattern transfer of the base material to form a conductive pattern.