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公开(公告)号：US20220282138A1
公开(公告)日：2022-09-08
申请号：US17687733
申请日：2022-03-07
Applicant: DENSO CORPORATION , ADEKA CORPORATION
Inventor： Kazuma YAMAGUCHI , Takao IZUMI , Keisuke OTA , Kohei HIRAYAMA , Shinsuke YAMADA , Ryo OGAWA
IPC: C09J163/00 , C09J11/04 , C09J11/06
Abstract: There is provided a photocurable adhesive having good deep-section curability. A photocurable adhesive is formulated to be curable by laser light irradiation. The photocurable adhesive contains an epoxy adhesive component and titanium black. The content of the titanium black is 1 ppm by mass or more and 150 ppm by mass or less relative to 100 parts by mass of the epoxy adhesive component. The titanium black may have a primary particle size of 5 nm or more and 150 nm or less.
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公开(公告)号：US20220282139A1
公开(公告)日：2022-09-08
申请号：US17687728
申请日：2022-03-07
Applicant: DENSO CORPORATION , ADEKA CORPORATION
Inventor： Kazuma YAMAGUCHI , Takao IZUMI , Keisuke OTA , Kohei HIRAYAMA , Shinsuke YAMADA , Ryo OGAWA
IPC: C09J175/04 , C09J11/04 , C08G18/00
Abstract: There is provided a photocurable adhesive which is capable of reducing the amount of gas discharged from the cured product. A photocurable adhesive is formulated to be curable by laser light irradiation, The photocurable adhesive contains an epoxy adhesive component, and a light-absorbing component configured to generate heat by laser light irradiation. The epoxy adhesive component contains a cyanate ester resin (A), epoxy resin (B), latent amine curing agent (C), and ion scavenger (D)
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公开(公告)号：US20170145268A1
公开(公告)日：2017-05-25
申请号：US15312736
申请日：2015-05-22
Applicant: DENSO CORPORATION , ADEKA CORPORATION
Inventor： Kenji KOGA , Daisuke TAKAMA , Ryo OGAWA , Shinsuke YAMADA , Takuya MATSUDA
IPC: C09J163/00
CPC classification number: C09J163/00 , C08G59/50 , C08K3/04 , C08K3/22 , C08K3/36 , C08K2003/2227 , C08L79/04
Abstract: Provided is a photocurable adhesive with which curing by direct irradiation of laser light is possible with almost no occurrence of surface carbonization and which is capable of satisfactory curing even when the coating thickness is increased. A photocurable adhesive, which is cured by irradiation of laser light, is provided. The curable adhesive contains an epoxy adhesive component, a light-absorbing component for thermal curing of the epoxy adhesive component by absorption of laser light, and an inorganic filler. The content of the light-absorbing component is 0.1 mass % or less. The pre-curing thermal conductivity of the photocurable adhesive is at least 0.2 W/m·K and the post-curing thermal conductivity is at least 0.5 W/m·K.
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公开(公告)号：US20160200860A1
公开(公告)日：2016-07-14
申请号：US14913431
申请日：2014-08-18
Applicant: ADEKA CORPORATION
Inventor： Ryo OGAWA , Takuya MATSUDA
CPC classification number: C08G59/66 , C08G59/245 , C08G59/5073 , C08G59/56
Abstract: A one-component curable resin composition that does not contain an isocyanate compound, comprised of uniformly blended (A) a compound having two or more epoxy groups within a molecule, (B) a compound having two or more thiol groups within a molecule, and (C) an imidazole compound of formula (I), wherein the component (C) exists in the form of liquid.
Abstract translation: 不含有异氰酸酯化合物的单组分固化性树脂组合物，其包含在分子内均匀混合（A）具有两个以上环氧基的化合物，（B）分子内具有2个以上硫醇基的化合物，以及 （C）式（I）的咪唑化合物，其中组分（C）以液体的形式存在。
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公开(公告)号：US20240141095A1
公开(公告)日：2024-05-02
申请号：US18547092
申请日：2022-02-08
Applicant: ADEKA CORPORATION
Inventor： Keisuke OTA , Kohei HIRAYAMA , Ryo OGAWA , Shinsuke YAMADA
IPC: C08G59/24 , C08G59/32 , C08G59/34 , C08G59/50 , C08G59/56 , C08K3/36 , C08K5/5419 , C08L61/14 , C09J163/08
CPC classification number: C08G59/245 , C08G59/3227 , C08G59/34 , C08G59/502 , C08G59/56 , C08K3/36 , C08K5/5419 , C08L61/14 , C09J163/08 , C08K2201/005 , C08L2205/025 , C08L2205/035
Abstract: Disclosed is a curable resin composition containing: (A) a cyanate ester resin; (B) an epoxy resin essentially including at least a 4-amino-3-methylphenol-type epoxy resin; and (C) a latent curing agent. Preferably, the cyanate ester resin (A) is at least one selected from the group consisting of compounds represented by formula (1) below, compounds represented by formula (2) below, and at least one of polymer of these compounds. Formula (1): NC—O-A1-Y1-A2-O—CN (See the Description for the symbols in the formula). Formula (2): (See the Description for the symbols in the formula).
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Patent Agency Ranking
公开(公告)号：US20240109869A1
公开(公告)日：2024-04-04
申请号：US18262337
申请日：2022-01-25
Applicant: ADEKA CORPORATION
Inventor： Takeshi ENDO , Yasuyuki MORI , Ippei OKANO , Ryo OGAWA , Junji UEYAMA
IPC: C07D403/06 , C08G59/50 , H01B1/12
CPC classification number: C07D403/06 , C08G59/5073 , H01B1/121
Abstract: Disclosed is a charge transfer complex capable of obtaining a curable resin composition having an excellent balance between curability and storage stability when used as an epoxy-resin curing agent. The charge transfer complex has an imidazole moiety as an electron donor moiety. The charge transfer complex may be an assembly wherein electrons included in a compound (a) having an imidazole moiety are accepted by a compound (b) having an electron acceptor moiety, or may be a compound having an imidazole moiety and an electron acceptor moiety in its molecule, and the electron acceptor moiety accepts electrons included in the imidazole moiety.
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公开(公告)号：US20240317967A1
公开(公告)日：2024-09-26
申请号：US18262521
申请日：2022-01-25
Applicant: ADEKA CORPORATION
Inventor： Takeshi ENDO , Yasuyuki MORI , Ken-ichi TAMASO , Ryo OGAWA , Junji UEYAMA
IPC: C08K5/3415 , C08G59/50
CPC classification number: C08K5/3415 , C08G59/5073
Abstract: A curing resin composition well balanced in curing properties and storage stability. The composition contains (A) an epoxy resin, (B) a curing agent, and (C) at least one of imide compounds represented by formulae (1-1), (1-2), and (1-3), wherein R11 represents an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.; R1, R2, R3, and R4 each independently represent a hydrogen atom, an alkyl group with 1 to 10 carbon atoms, etc.; and R12 and R13 each independently represent a hydrogen atom, an optionally substituted alkyl group with 1 to 10 carbon atoms, etc.
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公开(公告)号：US20180037014A1
公开(公告)日：2018-02-08
申请号：US15547090
申请日：2016-01-26
Applicant: ADEKA CORPORATION
Inventor： Takeshi ENDO , Kozo MATSUMOTO , Ken-ichi TAMASO , Chihiro ASAKURA , Ryo OGAWA
Abstract: A flame-retardant epoxy resin composition wherein (A) epoxy resin, (B) a curing agent and (C) a phosphorous-containing compound expressed by the following general formula (1) are contained; a prepreg using the same and a laminated plate using said prepreg; wherein m expresses an integer from 2 to 10, R1 and R2 each independently express an alkyl group or an aryl group, R3 expresses a hydrocarbon group that may contain an oxygen atom, a sulfur atom or a nitrogen atom, X expresses an oxygen atom or a sulfur atom, Y expresses an oxygen atom, a sulfur atom or —NR4—, and in this regard, R4 expresses a hydrogen atom, an alkyl group or an aryl group.
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公开(公告)号：US20240141094A1
公开(公告)日：2024-05-02
申请号：US18547066
申请日：2022-02-08
Applicant: ADEKA CORPORATION
Inventor： Kohei HIRAYAMA , Keisuke OTA , Ryo OGAWA , Shinsuke YAMADA
IPC: C08G59/24 , C08G59/28 , C08G59/34 , C08G59/50 , C08G59/56 , C08K3/08 , C08K3/36 , C08L61/14 , C09J163/08
CPC classification number: C08G59/245 , C08G59/28 , C08G59/34 , C08G59/502 , C08G59/56 , C08K3/08 , C08K3/36 , C08L61/14 , C09J163/08 , C08K2003/0812 , C08K2201/003 , C08L2205/025 , C08L2205/035
Abstract: A curing resin composition including (A) a cyanate ester resin, (B) an epoxy resin, (C) an active hydrogen-containing amine latent curing agent, and (D) an ion scavenger. The cyanate ester resin (A) is preferably at least one of a compound of formula (1) below, a compound of formula (2) below, and a polymer of at least one of these compounds (1) and (2).
NC—O-A1-Y1-A2-O—CN (1)
wherein the symbols are as defined in the description.
wherein the symbols are as defined in the description.-
公开(公告)号：US20220185946A1
公开(公告)日：2022-06-16
申请号：US17436498
申请日：2020-03-27
Applicant: ADEKA CORPORATION
Inventor： Shota KOBAYASHI , Ken-ichi TAMASO , Ryo OGAWA , Tamotsu NAGAMATSU
Abstract: Disclosed is a curable resin composition that has excellent curability by irradiation of light and heating and that is suitable for such applications as liquid encapsulants, liquid adhesives, adhesives for camera modules, and liquid crystal sealants. The curable resin composition contains (A) an aromatic epoxy resin having an allyl group, (B) a thiol-based curing agent, (C) a photoradical initiator, and (D) a thermally latent curing agent. Preferably, (A) the compound having an allyl group and an epoxy group is an aromatic epoxy resin having an allyl group. Preferably, the thiol-based curing agent, which is component (B), is in liquid form at 25° C.
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