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公开(公告)号：US11963297B2
公开(公告)日：2024-04-16
申请号：US17279629
申请日：2019-12-24
发明人： Hirokazu Komori , Hiroyuki Yoshimoto , Masaji Komori , Yuki Ueda , Junpei Terada
IPC分类号： H05K1/03 , B32B5/02 , B32B15/082 , B32B15/20 , B32B17/10 , B32B27/12 , B32B27/20 , B32B27/32 , C08F214/26 , C08J5/18 , C08K3/36 , C08K7/18
CPC分类号： H05K1/0366 , B32B5/022 , B32B5/024 , B32B15/082 , B32B15/20 , B32B17/10 , B32B27/12 , B32B27/20 , B32B27/322 , C08F214/262 , C08J5/18 , C08K3/36 , C08K7/18 , B32B2262/101 , B32B2264/1021 , B32B2457/08 , C08F2800/10 , C08J2327/18 , H05K2201/015
摘要： A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 106 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.
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公开(公告)号：US20230383030A1
公开(公告)日：2023-11-30
申请号：US18447502
申请日：2023-08-10
发明人： Kyouhei SAWAKI , Shingo Okuno , Yuki Ueda , Ken Okanishi , Toshiyuki Fukushima , Hitoshi Imamura
CPC分类号： C08F214/262 , H05K3/4644 , H05K1/0373 , C08L27/18 , C08K3/36 , C08J3/20 , C08J3/28 , H05K2203/092 , H05K2203/06 , C08J2327/18 , C08L2203/20
摘要： A modified fluororesin material containing a modified fluororesin which contains a tetrafluoroethylene unit, a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene, and a tertiary carbon atom. The tertiary carbon atom is present in an amount of 0.001 to 0.030 mol % of a total amount of the tetrafluoroethylene unit and the modifying monomer unit. The modified fluororesin material has a linear expansion coefficient at 20° C. to 200° C. that is 10% or more lower than that of a non-modified fluororesin material. The non-modified fluororesin material contains a tetrafluoroethylene unit and a modifying monomer unit based on a modifying monomer copolymerizable with tetrafluoroethylene and containing no tertiary carbon atom. Also disclosed is a material for a circuit board including the modified fluororesin material, a laminate for a circuit board, a circuit board, and a method for producing the modified fluororesin material.
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公开(公告)号：US10113041B2
公开(公告)日：2018-10-30
申请号：US15326896
申请日：2015-07-16
发明人： Koji Nakanishi , Yuki Ueda , Haruhisa Masuda , Kazuki Sakami
IPC分类号： C08F12/20 , C08F8/00 , C08K5/07 , C08J5/18 , C08L27/18 , C08L71/10 , H04R7/02 , C08L71/00 , G10K13/00 , C08J5/22
摘要： The present invention aims to provide a film having excellent mechanical strength and abrasion resistance. The film of the present invention contains an aromatic polyether ketone resin (I) and a fluororesin (II). The aromatic polyether ketone resin (I) has a crystallinity of 10% or higher.
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公开(公告)号：US10964444B2
公开(公告)日：2021-03-30
申请号：US14906939
申请日：2014-07-24
发明人： Yuki Ueda , Masami Nishiumi , Haruhisa Masuda
IPC分类号： C08L27/18 , H01B3/30 , H01B3/44 , H01B3/42 , C09D127/18 , C09D171/00 , C08L71/00
摘要： The present invention aims to provide a resin composition which can provide a molded article excellent in insulation and showing a low relative permittivity and which causes no melt fracture even when extrusion-molded at a high shear rate. The resin composition of the present invention includes an aromatic polyether ketone resin (I) and a fluororesin (II). The fluororesin (II) is a copolymer of tetrafluoroethylene and a perfluoro ethylenically unsaturated compound represented by the following formula (1): CF2═CF—Rf1 (1) wherein Rf1 represents —CF3 or —ORf2; and Rf2 represents a C1-C5 perfluoroalkyl group. The aromatic polyether ketone resin (I) and the fluororesin (II) satisfy a melt viscosity ratio (I)/(II) of not lower than 0.001 but lower than 0.3.
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公开(公告)号：US10294362B2
公开(公告)日：2019-05-21
申请号：US14415381
申请日：2013-07-23
发明人： Yuki Ueda , Masami Nishiumi , Haruhisa Masuda
摘要： The present invention aims to provide a resin composition capable of providing a molded article which is excellent in flexibility, acid resistance, and electrical properties. The resin composition of the present invention includes: an aromatic polyether ketone resin (I); and a fluororesin (II), the fluororesin (II) being a copolymer of tetrafluoroethylene and a perfluoroethylenic unsaturated compound represented by the following formula (1): CF2═CF—Rf1 (1) wherein Rf1 represents —CF3 or —ORf2, and Rf2 represents a C1-C5 perfluoroalkyl group, the fluororesin (II) being dispersed as particles in the aromatic polyether ketone resin (I), the resin composition satisfying a ratio (I):(II) by mass between the aromatic polyether ketone resin (I) and the fluororesin (II) of 50:50 to 10:90.
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公开(公告)号：US20150203679A1
公开(公告)日：2015-07-23
申请号：US14415381
申请日：2013-07-23
发明人： Yuki Ueda , Masami Nishiumi , Haruhisa Masuda
CPC分类号： C08L61/16 , C08G2650/40 , C08L27/18 , C08L71/00 , C08L2201/02 , C08L2203/202 , H01B3/307 , H01B3/308 , H01B3/36 , H01B3/427 , H01B3/445 , Y10T428/31544 , C08L71/12
摘要： The present invention aims to provide a resin composition capable of providing a molded article which is excellent in flexibility, acid resistance, and electrical properties. The resin composition of the present invention includes: an aromatic polyether ketone resin (I); and a fluororesin (II), the fluororesin (II) being a copolymer of tetrafluoroethylene and a perfluoroethylenic unsaturated compound represented by the following formula (1): CF2═CF—Rf1 (1) wherein Rf1 represents —CF3 or —ORf2, and Rf2 represents a C1-C5 perfluoroalkyl group, the fluororesin (II) being dispersed as particles in the aromatic polyether ketone resin (I), the resin composition satisfying a ratio (I):(II) by mass between the aromatic polyether ketone resin (I) and the fluororesin (II) of 50:50 to 10:90.
摘要翻译： 本发明的目的在于提供一种能够提供柔软性，耐酸性和电性能优异的成型体的树脂组合物。 本发明的树脂组合物包括：芳族聚醚酮树脂（I）; 和氟树脂（II），氟树脂（II）是四氟乙烯和由下式（1）表示的全氟烯属不饱和化合物的共聚物：CF2 = CF-Rf1（1）其中Rf1表示-CF3或-ORf2，Rf2 代表C1-C5全氟烷基，氟树脂（II）作为颗粒分散在芳族聚醚酮树脂（I）中，树脂组合物满足芳族聚醚酮树脂（I）之间的质量比（I）：（II） ）和氟树脂（II）为50:50〜10:90。
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公开(公告)号：US10991478B2
公开(公告)日：2021-04-27
申请号：US14760562
申请日：2014-01-07
发明人： Haruhisa Masuda , Yuki Ueda , Masami Nishiumi
摘要： An object of the present invention is to provide an insulated wire which includes an insulating layer with a low relative permittivity and has excellent heat resistance and excellent abrasion resistance. The insulated wire of the present invention includes a conductor (A), and an insulating layer (B) formed on the periphery of the conductor (A), the insulating layer (B) is formed from a resin composition that contains a resin (I) with a relative permittivity of 3.0 to 4.0 and a fluororesin (II).
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