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    Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same
    1.
    发明授权
    Methods of bonding an optical fiber to a substrate using a laser and assemblies fabricated by the same 有权

    公开(公告)号：US11422310B2

    公开(公告)日：2022-08-23

    申请号：US16877859

    申请日：2020-05-19

    申请人： CORNING INCORPORATED

    发明人： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

    IPC分类号： G02B6/36 ,  C03C27/08 ,  C03B37/15 ,  G02B6/10

    摘要： Methods for laser welding one or more optical fibers to a substrate and assemblies are disclosed. In one embodiment, a method of bonding an optical fiber to a substrate having at least one film layer on a surface of the substrate includes directing a laser beam into the optical fiber disposed on the at least one film layer. The optical fiber has a curved surface that focuses the laser beam to a focused diameter. The method further includes melting, using the focused diameter laser beam, a material of the substrate to create a laser bond area between the optical fiber and the surface of the substrate. The laser bond area includes laser-melted material of the substrate that bonds the optical fiber to the substrate. The at least one film layer has an absorption of at least 15% at a wavelength of the focused diameter laser beam.

    Glass bumps on glass articles and methods of laser-induced growth
    2.
    发明授权
    Glass bumps on glass articles and methods of laser-induced growth 有权

    公开(公告)号：US11247939B2

    公开(公告)日：2022-02-15

    申请号：US16526472

    申请日：2019-07-30

    申请人： Corning Incorporated

    发明人： Leonard Thomas Masters ,  Alexander Mikhailovich Streltsov

    IPC分类号： C03C23/00

    摘要： A glass article having a glass bump formed integrally thereon by laser-irradiation methods. The glass bump includes a lower region connected to an upper region by an inflection region. The lower region projects from a surface of the glass article and is defined by concavely rounded sides with a radius of curvature R1. The upper region includes a transition portion and a top portion. The transition portion is defined by convexly rounded sides with a radius of curvature R2. The transition portion connects to the lower portion via the inflection region. The upper portion connects to the transition portion and is defined by a convexly rounded top surface with a radius of curvature R3, which is greater than radius of curvature R2.

    LASER SEALED HOUSING FOR ELECTRONIC DEVICE
    7.
    发明申请
    LASER SEALED HOUSING FOR ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20200238437A1

    公开(公告)日：2020-07-30

    申请号：US15754975

    申请日：2016-08-23

    申请人： Corning Incorporated

    发明人： Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Alexander Mikhailovich Streltsov

    IPC分类号： B23K26/0622 ,  H01L51/52 ,  B23K26/20 ,  B23K26/211 ,  B23K26/324

    摘要： A laser-welded, sealed electronic device housing and related systems and methods are provided. The sealed housing includes a first substrate having a first surface and a second substrate having a second surface facing the first surface. The sealed housing includes a recess formed in the first substrate. The recess faces the second surface such that the second surface and the recess define a chamber. A laser weld bonds the first surface to the second surface, and the laser weld surrounds the chamber. A functional film is supported by at least one of the first surface and the second surface, and the functional film extends from the chamber and across the laser weld. In exemplary arrangements the device is an OLED device and the functional film form conductive leads in communication with the OLED.