公开(公告)号：US20180351130A1

公开(公告)日：2018-12-06

申请号：US15778333

申请日：2016-11-22

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Theresa Chang ,  Leonard Charles Dabich ,  Mark Alan Lewis ,  Stephan Lvovich Logunov ,  Mark Alejandro Quesada ,  Wageesha Senaratne ,  Alexander Mikhailovich Streltsov

IPC: H01L51/52 ,  H01L51/56 ,  B23K26/24 ,  C03C8/24 ,  C03C8/02

CPC classification number: H01L51/5246 ,  H01L51/56

Abstract: A laser weldable device housing substrate, device housing and related method are provided. The substrate includes a first surface, a second surface opposite the first surface, and a thin inorganic particle layer supported by the first surface. The inorganic particle layer includes a plurality of particles arranged in a layer on the first surface. The particles have an average diameter of less than or equal to 1.0 μm, and the inorganic particle layer has an average thickness of less than or equal to 5 μm.