公开(公告)号：US09386686B2

公开(公告)日：2016-07-05

申请号：US13450229

申请日：2012-04-18

申请人： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

发明人： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC分类号： H05K7/20 ,  H05K1/02 ,  H05K3/44 ,  H05K1/18

CPC分类号： H05K1/0204 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48248 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/181 ,  H05K1/184 ,  H05K3/445 ,  H05K2201/10515 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2924/00

摘要： An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage.

摘要翻译： 提供一种电子封装结构，其包括金属芯PCB，能量存储装置和至少一个电子元件。 至少一个电子部件设置在金属芯PCB和能量存储装置之间。 金属芯PCB至少定义一个通孔。 热通道设置在通孔中。 绝缘层设置在通孔中并且位于金属芯PCB的金属层和热通道之间，以防止热通道和金属层之间的电耦合。 能量存储装置至少包括与热通道热接触的连接销。

公开(公告)号：US20120075808A1

公开(公告)日：2012-03-29

申请号：US13206810

申请日：2011-08-10

申请人： Han-Hsiang LEE ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

发明人： Han-Hsiang LEE ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC分类号： H05K7/20 ,  H05K7/00

CPC分类号： H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

摘要： An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

摘要翻译： 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。

公开(公告)号：US08619428B2

公开(公告)日：2013-12-31

申请号：US13206810

申请日：2011-08-10

申请人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

发明人： Han-Hsiang Lee ,  Yi-Cheng Lin ,  Pei-Chun Hung ,  Bau-Ru Lu ,  Da-Jung Chen ,  Jeng-Jen Li

IPC分类号： H05K7/20

CPC分类号： H05K7/1432 ,  H01L23/13 ,  H01L23/49531 ,  H01L23/49541 ,  H01L2224/49175 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30107 ,  H02M3/00 ,  H05K1/021 ,  H05K3/0061 ,  H05K2201/10924 ,  H05K2203/1327 ,  H01L2924/00

摘要： An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.

摘要翻译： 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。

公开(公告)号：US20100309638A1

公开(公告)日：2010-12-09

申请号：US12783792

申请日：2010-05-20

申请人： Da-Jung Chen ,  Chi-Feng Huang ,  Yi-Tsung Chen ,  Huei-Ren You ,  Jeng-Jen Li

发明人： Da-Jung Chen ,  Chi-Feng Huang ,  Yi-Tsung Chen ,  Huei-Ren You ,  Jeng-Jen Li

IPC分类号： H05K7/02

CPC分类号： H01L23/49861 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48145 ,  H01L2924/00012

摘要： An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.

摘要翻译： 提供了一种包括引线框架，绝缘层和至少一个电子元件的电子元件封装模块。 引线框架是图案化金属片，并且具有第一表面，与其相对的第二表面和从第一表面延伸到第二表面的通孔。 通过沟槽限定引线框架的基板部分周围的基板部分和多个引线部分。 引线框架的第二表面暴露在电子元件封装模块的外部。 布置在通孔中的绝缘层分别具有与第一表面和第二表面大致共面的第三表面和第四表面。 布置在第一表面上的电子元件连接到引线框架。

公开(公告)号：US08253041B2

公开(公告)日：2012-08-28

申请号：US12783792

申请日：2010-05-20

申请人： Da-Jung Chen ,  Chi-Feng Huang ,  Yi-Tsung Chen ,  Huei-Ren You ,  Jeng-Jen Li

发明人： Da-Jung Chen ,  Chi-Feng Huang ,  Yi-Tsung Chen ,  Huei-Ren You ,  Jeng-Jen Li

IPC分类号： H01L23/495

CPC分类号： H01L23/49861 ,  H01L23/49548 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48145 ,  H01L2924/00012

摘要： An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.

摘要翻译： 提供了一种包括引线框架，绝缘层和至少一个电子元件的电子元件封装模块。 引线框架是图案化金属片，并且具有第一表面，与其相对的第二表面和从第一表面延伸到第二表面的通孔。 通过沟槽限定引线框架的基板部分周围的基板部分和多个引线部分。 引线框架的第二表面暴露在电子元件封装模块的外部。 布置在通孔中的绝缘层分别具有与第一表面和第二表面大致共面的第三表面和第四表面。 布置在第一表面上的电子元件连接到引线框架。

公开(公告)号：US20120262074A1

公开(公告)日：2012-10-18

申请号：US13425412

申请日：2012-03-20

申请人： Wei-Cheng Wang ,  Bau-Ru Lu ,  Chun-Hsien Lu ,  Jeng-Jen Li

发明人： Wei-Cheng Wang ,  Bau-Ru Lu ,  Chun-Hsien Lu ,  Jeng-Jen Li

IPC分类号： H05B37/02

CPC分类号： H05B33/083

摘要： A driving circuit of light emitting diodes includes a power supply circuit, at least one bypass circuit, and a temperature control circuit. The power supply circuit is used for providing a driving voltage to at least one series of light emitting diodes. Each bypass circuit of the at least one bypass circuit is used for being turned on when an ambient temperature is lower than a predetermined temperature. The temperature control circuit is coupled to the at least one bypass circuit for detecting the ambient temperature, and sending a control signal to the at least one bypass circuit when the ambient temperature is lower than the predetermined temperature. Therefore, the driving voltage can still drive the at least one series of light emitting diodes when the ambient temperature is lower than the predetermined temperature.

摘要翻译： 发光二极管的驱动电路包括电源电路，至少一个旁路电路和温度控制电路。 电源电路用于向至少一系列的发光二极管提供驱动电压。 当环境温度低于预定温度时，所述至少一个旁路电路的每个旁路电路用于接通。 温度控制电路耦合到至少一个旁路电路，用于检测环境温度，并且当环境温度低于预定温度时，将控制信号发送到至少一个旁路电路。 因此，当环境温度低于预定温度时，驱动电压仍能驱动至少一系列的发光二极管。

公开(公告)号：US10373930B2

公开(公告)日：2019-08-06

申请号：US13571378

申请日：2012-08-10

申请人： Jeng-Jen Li ,  Bau-Ru Lu

发明人： Jeng-Jen Li ,  Bau-Ru Lu

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L23/00 ,  H01L23/13 ,  H01L23/538 ,  H01L25/16 ,  H01L23/498

摘要： The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.

公开(公告)号：US09536798B2

公开(公告)日：2017-01-03

申请号：US13401853

申请日：2012-02-22

申请人： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

发明人： Bau-Ru Lu ,  Jeng-Jen Li ,  Kun-Hong Shih ,  Kaipeng Chiang

IPC分类号： H05K1/03 ,  H01L23/13 ,  H05K1/02 ,  H05K1/18 ,  H01L23/498 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L23/49537 ,  H01L21/563 ,  H01L23/13 ,  H01L23/49506 ,  H01L23/49534 ,  H01L23/49548 ,  H01L23/49575 ,  H01L23/49827 ,  H01L23/49833 ,  H01L24/16 ,  H01L2224/16225 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/15321 ,  H05K1/021 ,  H05K1/186 ,  Y10T29/49124 ,  H01L2924/00

摘要： The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.

摘要翻译： 本发明公开了一种由装置载体和可修改基底的组合制成的封装结构。 在一个实施例中，在器件载体中形成凹部，并且导电元件设置在衬底上，其中衬底设置在器件载体上，并且导电元件位于器件载体的凹部中。 衬底中的导电图案电连接到器件载体和第一导电元件的I / O端子。 本发明还公开了一种用于制造由器件载体和可修改基底的组合制成的封装结构的方法。 在一个实施例中，衬底中的导电图案的一部分可以被修改。

公开(公告)号：US07405467B2

公开(公告)日：2008-07-29

申请号：US11233578

申请日：2005-09-22

申请人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Chieh Hsu ,  Chau Chun Wen

发明人： Chun-Tiao Liu ,  Da-Jung Chen ,  Chun-Liang Lin ,  Jeng-Jen Li ,  Cheng Chieh Hsu ,  Chau Chun Wen

IPC分类号： H01L23/495 ,  H01L21/00 ,  H01R9/00 ,  H01R43/00

CPC分类号： H01L23/49575 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/49 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/181 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced because the size of the substrate is shrunk. Furthermore, the power chips are placed on a material with high thermal conductivity. The heat produced from the power chips can be transmitted quickly. Thus, the reliability of the power module package can be improved.

摘要翻译： 公开了功率模块封装结构。 控制电路制造在电路板上，而不是直接在主衬底上制造。 由于基板的尺寸缩小，所以制造成本降低。 此外，功率芯片放置在具有高导热性的材料上。 从功率芯片产生的热量可以快速传输。 因此，可以提高功率模块封装的可靠性。

公开(公告)号：US20060284340A1

公开(公告)日：2006-12-21

申请号：US11192651

申请日：2005-07-29

申请人： Chun-Tiao Liu ,  Da-Jung Chen ,  Jeng-Jen Li ,  Chun-Liang Lin ,  Chau Wen

发明人： Chun-Tiao Liu ,  Da-Jung Chen ,  Jeng-Jen Li ,  Chun-Liang Lin ,  Chau Wen

IPC分类号： B29C45/14

CPC分类号： B29C45/14655 ,  B29C45/14065 ,  B29C45/1418 ,  B29C45/14336 ,  B29C2045/14131 ,  H01L21/565 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for preventing the overflowing of the molding compound is disclosed. The method provides a substrate that having at least a pair of outer leads. By the pressed downward the pair of outer leads as the thimble point, the substrate can contact with the mold completely without any gap therebetween, thus, the overflowing of the molding compound would not be occurred.

摘要翻译： 公开了一种防止模塑料溢出的方法。 该方法提供了具有至少一对外引线的基板。 通过向下按压一对外引线作为套管点，基板可以完全与模具接触而没有间隙，因此不会发生模塑料的溢流。