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公开(公告)号：US09386686B2
公开(公告)日：2016-07-05
申请号：US13450229
申请日：2012-04-18
申请人： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
发明人： Chi-Feng Huang , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
CPC分类号： H05K1/0204 , H01L2224/48091 , H01L2224/48247 , H01L2224/48248 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H05K1/0203 , H05K1/021 , H05K1/181 , H05K1/184 , H05K3/445 , H05K2201/10515 , Y02P70/611 , H01L2924/00014 , H01L2924/00
摘要： An electronic package structure is provided which comprises a metal core PCB, an energy storage device and at least one electronic component. The at least one electronic component is disposed between the metal core PCB and the energy storage device. The metal core PCB defines at least a through hole. A thermal passage is disposed in the through hole. An insulating layer is disposed in the through hole and located between the metal layer of the metal core PCB and the thermal passage to prevent the electric coupling between the thermal passage and the metal layer. The energy storage device comprises at least a connecting pin in thermal contact with the thermal passage.
摘要翻译： 提供一种电子封装结构，其包括金属芯PCB，能量存储装置和至少一个电子元件。 至少一个电子部件设置在金属芯PCB和能量存储装置之间。 金属芯PCB至少定义一个通孔。 热通道设置在通孔中。 绝缘层设置在通孔中并且位于金属芯PCB的金属层和热通道之间，以防止热通道和金属层之间的电耦合。 能量存储装置至少包括与热通道热接触的连接销。
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公开(公告)号：US20120075808A1
公开(公告)日：2012-03-29
申请号：US13206810
申请日：2011-08-10
申请人： Han-Hsiang LEE , Yi-Cheng Lin , Pei-Chun Hung , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
发明人： Han-Hsiang LEE , Yi-Cheng Lin , Pei-Chun Hung , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
CPC分类号： H05K7/1432 , H01L23/13 , H01L23/49531 , H01L23/49541 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H02M3/00 , H05K1/021 , H05K3/0061 , H05K2201/10924 , H05K2203/1327 , H01L2924/00
摘要： An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
摘要翻译： 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。
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公开(公告)号：US08619428B2
公开(公告)日：2013-12-31
申请号：US13206810
申请日：2011-08-10
申请人： Han-Hsiang Lee , Yi-Cheng Lin , Pei-Chun Hung , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
发明人： Han-Hsiang Lee , Yi-Cheng Lin , Pei-Chun Hung , Bau-Ru Lu , Da-Jung Chen , Jeng-Jen Li
IPC分类号： H05K7/20
CPC分类号： H05K7/1432 , H01L23/13 , H01L23/49531 , H01L23/49541 , H01L2224/49175 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/30107 , H02M3/00 , H05K1/021 , H05K3/0061 , H05K2201/10924 , H05K2203/1327 , H01L2924/00
摘要： An electronic package structure is provided. The electronic package structure comprises a substrate, a first electronic element, and a second electronic element. The substrate includes a heat-dissipating plate and a circuit board disposed on the heat-dissipating plate. The first electronic element is disposed on the heat-dissipating plate and coupled to the circuit board. The second electronic element is disposed on the circuit board and coupled to the circuit board.
摘要翻译： 提供电子封装结构。 电子封装结构包括基板，第一电子元件和第二电子元件。 基板包括散热板和布置在散热板上的电路板。 第一电子元件设置在散热板上并耦合到电路板。 第二电子元件设置在电路板上并且耦合到电路板。
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公开(公告)号：US20100309638A1
公开(公告)日：2010-12-09
申请号：US12783792
申请日：2010-05-20
申请人： Da-Jung Chen , Chi-Feng Huang , Yi-Tsung Chen , Huei-Ren You , Jeng-Jen Li
发明人： Da-Jung Chen , Chi-Feng Huang , Yi-Tsung Chen , Huei-Ren You , Jeng-Jen Li
IPC分类号： H05K7/02
CPC分类号： H01L23/49861 , H01L23/49548 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/01013 , H01L2924/01019 , H01L2924/01079 , H01L2924/16152 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48145 , H01L2924/00012
摘要： An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.
摘要翻译： 提供了一种包括引线框架，绝缘层和至少一个电子元件的电子元件封装模块。 引线框架是图案化金属片，并且具有第一表面，与其相对的第二表面和从第一表面延伸到第二表面的通孔。 通过沟槽限定引线框架的基板部分周围的基板部分和多个引线部分。 引线框架的第二表面暴露在电子元件封装模块的外部。 布置在通孔中的绝缘层分别具有与第一表面和第二表面大致共面的第三表面和第四表面。 布置在第一表面上的电子元件连接到引线框架。
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公开(公告)号：US08253041B2
公开(公告)日：2012-08-28
申请号：US12783792
申请日：2010-05-20
申请人： Da-Jung Chen , Chi-Feng Huang , Yi-Tsung Chen , Huei-Ren You , Jeng-Jen Li
发明人： Da-Jung Chen , Chi-Feng Huang , Yi-Tsung Chen , Huei-Ren You , Jeng-Jen Li
IPC分类号： H01L23/495
CPC分类号： H01L23/49861 , H01L23/49548 , H01L24/16 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32145 , H01L2224/32225 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/49175 , H01L2224/73265 , H01L2924/01013 , H01L2924/01019 , H01L2924/01079 , H01L2924/16152 , H01L2924/181 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2224/48145 , H01L2924/00012
摘要： An electronic element packaging module including a lead frame, an insulating layer and at least one electronic element is provided. The lead frame is a patterned metal sheet and has a first surface, a second surface opposite thereto and a through trench passing from the first surface to the second surface. A substrate portion and a plurality of lead portions around the substrate portion of the lead frame are defined by the through trench. The second surface of the lead frame is exposed outside the electronic element packaging module. The insulating layer disposed in the through trench has a third surface and a forth surface substantially coplanar with the first and the second surfaces, respectively. The electronic element disposed on the first surface is coupled to the lead frame.
摘要翻译： 提供了一种包括引线框架，绝缘层和至少一个电子元件的电子元件封装模块。 引线框架是图案化金属片，并且具有第一表面，与其相对的第二表面和从第一表面延伸到第二表面的通孔。 通过沟槽限定引线框架的基板部分周围的基板部分和多个引线部分。 引线框架的第二表面暴露在电子元件封装模块的外部。 布置在通孔中的绝缘层分别具有与第一表面和第二表面大致共面的第三表面和第四表面。 布置在第一表面上的电子元件连接到引线框架。
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6.发明授权公开(公告)号：US09514964B2
公开(公告)日：2016-12-06
申请号：US14821812
申请日：2015-08-10
申请人： Bau-Ru Lu , Da-Jung Chen , Yi-Cheng Lin
发明人： Bau-Ru Lu , Da-Jung Chen , Yi-Cheng Lin
IPC分类号： H01L21/00 , H01L21/48 , H01L23/495 , H01L21/768 , H01L25/00 , H01L25/16 , H01L23/00
CPC分类号： H01L21/4825 , H01L21/4821 , H01L21/76877 , H01L23/49503 , H01L23/49524 , H01L23/49527 , H01L23/49534 , H01L23/49558 , H01L23/49575 , H01L23/49582 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L25/16 , H01L25/50 , H01L2224/215 , H01L2224/24011 , H01L2224/24247 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , Y10T29/49123 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
摘要翻译： 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。
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公开(公告)号：US20100059870A1
公开(公告)日：2010-03-11
申请号：US12491096
申请日：2009-06-24
申请人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
发明人： Chau-Chun Wen , Da-Jung Chen , Bau-Ru Lu , Chun-Hsien Lu
IPC分类号： H01L23/495
CPC分类号： H01L23/4334 , H01L23/3735 , H01L23/49531 , H01L23/49586 , H01L23/62 , H01L24/48 , H01L25/0655 , H01L25/072 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/09701 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/1532 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A chip package structure including a substrate, at least one chip, a plurality of leads, a heat dissipation device, a molding compound, and at least one insulating sheet is provided. The chip is disposed on the substrate. The leads are electrically connected to the substrate. The molding compound having a top surface encapsulates the chip, the substrate, and a portion of the leads. The heat dissipation device is disposed on the top surface of the molding compound. The insulating sheet disposed between the heat dissipation device and at least one of the leads has a bending line dividing the insulating sheet into a main body disposed on the molding compound and a bending portion extending from the main body.
摘要翻译： 提供了包括基板，至少一个芯片，多个引线，散热装置，模塑料和至少一个绝缘片的芯片封装结构。 芯片设置在基板上。 引线电连接到基板。 具有顶表面的模制化合物封装芯片，衬底和引线的一部分。 散热装置设置在模塑料的顶表面上。 布置在散热装置与至少一个引线之间的绝缘片具有将绝缘片划分为设置在模制化合物上的主体和从主体延伸的弯曲部的弯曲线。
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公开(公告)号：US20080179722A1
公开(公告)日：2008-07-31
申请号：US11930183
申请日：2007-10-31
申请人： Da-Jung Chen , Chung-Shiun Fang , Bau-Ru Lu , Yi-Cheng Lin , Chau-Chun Wen
发明人： Da-Jung Chen , Chung-Shiun Fang , Bau-Ru Lu , Yi-Cheng Lin , Chau-Chun Wen
IPC分类号： H01L23/495
CPC分类号： H05K1/141 , H01L23/495 , H01L23/49555 , H01L23/49575 , H01L24/48 , H01L25/162 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2924/00014 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/19041 , H01L2924/19106 , H01L2924/30107 , H05K1/0262 , H05K3/284 , H05K3/3421 , H05K2201/10166 , H05K2201/10924 , H05K2201/10969 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： An electronic package structure including a first carrier, at least one first electronic element, at least one second electronic element, and an encapsulant is provided. The first carrier has a first carrying surface and a second carrying surface opposite to the first carrying surface. The first electronic element is disposed on the first carrying surface and electrically connected to the first carrier. The second electronic element is disposed on the second carrying surface and electrically connected to the first carrier. The encapsulant at least covers the first electronic element, the second electronic element, and a part of the first carrier. The space utilization rate of the first carrier of the electronic package structure is higher.
摘要翻译： 提供了包括第一载体，至少一个第一电子元件，至少一个第二电子元件和密封剂的电子封装结构。 第一载体具有与第一载体表面相对的第一载体表面和第二载体表面。 第一电子元件设置在第一承载表面上并电连接到第一载体。 第二电子元件设置在第二承载表面上并电连接到第一载体。 密封剂至少覆盖第一电子元件，第二电子元件和第一载体的一部分。 电子封装结构的第一载体的空间利用率更高。
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公开(公告)号：US09001527B2
公开(公告)日：2015-04-07
申请号：US13485954
申请日：2012-06-01
申请人： Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
发明人： Da-Jung Chen , Chun-Tiao Liu , Bau-Ru Lu
IPC分类号： H05K5/02 , H05K1/18 , H01L23/64 , H01L25/16 , H01F27/02 , H05K3/34 , H01L23/24 , H01L23/31 , H01L23/552
CPC分类号： H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
摘要： The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
摘要翻译： 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。
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公开(公告)号：US20120236519A1
公开(公告)日：2012-09-20
申请号：US13485954
申请日：2012-06-01
申请人： Da-Jung Chen , Chun-Tiao Liu , BAU-RU LU
发明人： Da-Jung Chen , Chun-Tiao Liu , BAU-RU LU
CPC分类号： H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
摘要： The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
摘要翻译： 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。
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