公开(公告)号：US08518742B1

公开(公告)日：2013-08-27

申请号：US13046903

申请日：2011-03-14

申请人： Chenglin Liu ,  Shiann-Ming Liou ,  Albert Wu

发明人： Chenglin Liu ,  Shiann-Ming Liou ,  Albert Wu

IPC分类号： H01L21/00

CPC分类号： H01L23/50 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H04N5/4401 ,  H04N21/426 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.

摘要翻译： 封装半导体包括内键指，至少第一和第二半导体管芯，以及插入件。 封装半导体还包括第一和第二半导体管芯与内部接合点之间的布线，插入件与内部接合指状物之间的布线以及插入件与第一和第二半导体管芯之间的布线。 插入器与第一和第二半导体管芯之间的布线因此减少了第一和第二半导体管芯与内部接合点之间的布线所需的内部接合指的数量。 当内键指不能被第一和第二半导体管芯访问时，插入件进一步提供对内部键合指的间接访问。

公开(公告)号：US07911053B2

公开(公告)日：2011-03-22

申请号：US12105235

申请日：2008-04-17

申请人： Chenglin Liu ,  Shiann-Ming Liou ,  Albert Wu

发明人： Chenglin Liu ,  Shiann-Ming Liou ,  Albert Wu

IPC分类号： H01L23/34

CPC分类号： H01L23/50 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H04N5/4401 ,  H04N21/426 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.

摘要翻译： 封装半导体包括内键指，至少第一和第二半导体管芯，以及插入件。 封装半导体还包括第一和第二半导体管芯与内部接合点之间的布线，插入件与内部接合指状物之间的布线以及插入件与第一和第二半导体管芯之间的布线。 插入器与第一和第二半导体管芯之间的布线因此减少了第一和第二半导体管芯与内部接合点之间的布线所需的内部接合指的数量。 当内键指不能被第一和第二半导体管芯访问时，插入件进一步提供对内部键合指的间接访问。

公开(公告)号：US20080258291A1

公开(公告)日：2008-10-23

申请号：US12105235

申请日：2008-04-17

申请人： Chenglin Liu ,  Shiann-Ming Liou ,  Albert Wu

发明人： Chenglin Liu ,  Shiann-Ming Liou ,  Albert Wu

IPC分类号： H01L23/492 ,  H01L21/50

CPC分类号： H01L23/50 ,  H01L23/49531 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/32145 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2225/06562 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/30105 ,  H01L2924/30107 ,  H04N5/4401 ,  H04N21/426 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A packaged semiconductor includes inner bond fingers, at least first and second semiconductor dies, and an interposer. The packaged semiconductor further includes wiring between the first and second semiconductor dies and the inner bond fingers, wiring between the interposer and the inner bond fingers, and wiring between the interposer and the first and second semiconductor dies. The wiring between the interposer and the first and second semiconductor dies thereby reduces the count of inner bond fingers needed for the wiring between the first and second semiconductor dies and the inner bond fingers. The interposer further provides indirect access to the inner bond fingers when the inner bond fingers are inaccessible by the first and second semiconductor dies.

摘要翻译： 封装半导体包括内键指，至少第一和第二半导体管芯，以及插入件。 封装半导体还包括第一和第二半导体管芯与内部接合点之间的布线，插入件与内部接合指状物之间的布线以及插入件与第一和第二半导体管芯之间的布线。 插入器与第一和第二半导体管芯之间的布线因此减少了第一和第二半导体管芯与内部接合点之间的布线所需的内部接合指的数量。 当内键指不能被第一和第二半导体管芯访问时，插入件进一步提供对内部键合指的间接访问。

公开(公告)号：US08900932B2

公开(公告)日：2014-12-02

申请号：US13613886

申请日：2012-09-13

申请人： Chenglin Liu ,  Shiann-Ming Liou

发明人： Chenglin Liu ,  Shiann-Ming Liou

IPC分类号： H01L29/72 ,  H01L23/00 ,  H01L23/367 ,  H01L23/538 ,  H01L23/31

CPC分类号： H01L23/3128 ,  H01L23/367 ,  H01L23/5389 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/92224 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/00

摘要： A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.

摘要翻译： 一种制造集成电路封装的方法。 该方法包括将半导体管芯的第一表面附接到热和/或导电衬底，在半导体管芯的第二表面上形成多个管芯连接器，并将半导体管芯和多个管芯连接器封装在密封剂 材料。 该方法还包括去除一部分密封剂材料以暴露多个模具连接器中的一个或多个，由此形成路由表面。 该方法还包括在路由表面上形成多个导电迹线。 多个导电迹线中的每一个的特征在于与多个管芯连接器之一电连通的第一部分和与封装连接器电连通的第二部分。

公开(公告)号：US20130011964A1

公开(公告)日：2013-01-10

申请号：US13613886

申请日：2012-09-13

申请人： Chenglin Liu ,  Shiann-Ming Liou

发明人： Chenglin Liu ,  Shiann-Ming Liou

IPC分类号： H01L21/56

CPC分类号： H01L23/3128 ,  H01L23/367 ,  H01L23/5389 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/92224 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/00

摘要： A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.

公开(公告)号：US08022522B1

公开(公告)日：2011-09-20

申请号：US11388343

申请日：2006-03-23

申请人： Shiann-Ming Liou ,  Chenglin Liu

发明人： Shiann-Ming Liou ,  Chenglin Liu

IPC分类号： H01L23/02

CPC分类号： H01L23/49575 ,  H01L21/50 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49537 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/85 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48253 ,  H01L2224/48257 ,  H01L2224/4911 ,  H01L2224/49171 ,  H01L2224/49425 ,  H01L2224/49429 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/07802 ,  H01L2924/0781 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor package is provided and methods for bonding wires in the semiconductor package. In one implementation, the semiconductor package includes a lead frame including a first die pad and a second die pad; each die pad is supported by one or more supports and isolated from another; at least first and second dice, a first die being disposed on the first die pad and a second die being disposed on the second die pad; wire bonds in communication with the first and second dice; and an encapsulant adapted to encapsulate the die pads, the dice, the lead frame and the wire bonds.

摘要翻译： 提供一种半导体封装以及用于在半导体封装中接合引线的方法。 在一个实施方式中，半导体封装包括包括第一管芯焊盘和第二管芯焊盘的引线框架; 每个管芯焊盘由一个或多个支撑件支撑并与另一个支撑隔离; 至少第一和第二骰子，第一管芯设置在第一管芯焊盘上，第二管芯设置在第二管芯焊盘上; 与第一和第二骰子通信的电线键; 以及适于封装管芯焊盘，裸片，引线框架和引线接合的密封剂。

公开(公告)号：US07969022B1

公开(公告)日：2011-06-28

申请号：US12053253

申请日：2008-03-21

申请人： Chenglin Liu ,  Shiann-Ming Liou

发明人： Chenglin Liu ,  Shiann-Ming Liou

IPC分类号： H01L23/48 ,  H01L29/40 ,  H01L23/495

CPC分类号： H01L25/0657 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/05644 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48147 ,  H01L2224/48465 ,  H01L2224/48471 ,  H01L2224/48479 ,  H01L2224/48644 ,  H01L2224/4903 ,  H01L2224/4911 ,  H01L2224/49429 ,  H01L2224/85051 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554

摘要： Methods for die-to-die wire-bonding, and devices and systems formed thereby, are described herein. A die to die wire-bonding method may comprise bonding a first conductive bump having a first bump size to a first die pad; bonding a first wire to a second die pad, the first wire bonded to the second die pad by a second conductive bump having a second bump size, the second bump size being smaller than the first bump size; and bonding the first wire to the first conductive bump.

摘要翻译： 这里描述了芯片到芯片引线接合的方法，以及由此形成的器件和系统。 芯片引线接合方法可以包括将具有第一凸起尺寸的第一导电凸块接合到第一裸片焊盘; 将第一线接合到第二管芯焊盘，所述第一引线通过具有第二凸起尺寸的第二导电凸块接合到所述第二管芯焊盘，所述第二凸起尺寸小于所述第一凸起尺寸; 以及将所述第一导线接合到所述第一导电凸块。

公开(公告)号：US07675157B2

公开(公告)日：2010-03-09

申请号：US11471057

申请日：2006-06-19

申请人： Chenglin Liu ,  Shiann-Ming Liou

发明人： Chenglin Liu ,  Shiann-Ming Liou

IPC分类号： H01L23/48

CPC分类号： H01L23/3128 ,  H01L23/367 ,  H01L23/5389 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/92224 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/00

摘要： A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.

摘要翻译： 一种制造集成电路封装的方法。 该方法包括将半导体管芯的第一表面附接到导热和/或导电的衬底，在半导体管芯的第二表面上形成多个管芯连接器，并将半导体管芯和多个管芯连接器封装在密封剂 材料。 该方法还包括去除一部分密封剂材料以暴露多个模具连接器中的一个或多个，由此形成路由表面。 该方法还包括在路由表面上形成多个导电迹线。 多个导电迹线中的每一个的特征在于与多个管芯连接器之一电连通的第一部分和与封装连接器电连通的第二部分。

公开(公告)号：US08357568B2

公开(公告)日：2013-01-22

申请号：US12496379

申请日：2009-07-01

申请人： Chenglin Liu ,  Shiann-Ming Liou

发明人： Chenglin Liu ,  Shiann-Ming Liou

IPC分类号： H01L29/72

CPC分类号： H01L23/3128 ,  H01L23/367 ,  H01L23/5389 ,  H01L24/19 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2224/92224 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/19041 ,  H01L2924/00

摘要： A method of manufacturing an integrated circuit package. The method includes attaching a first surface of a semiconductor die to a thermally and/or electrically conductive substrate, forming a plurality of die connectors on a second surface of the semiconductor die, and encapsulating the semiconductor die and the plurality of die connectors in an encapsulant material. The method also includes removing a portion of the encapsulant material to expose one or more of the plurality of die connectors, thereby forming a routing surface. The method further includes forming a plurality of conductive traces on the routing surface. Each of the plurality of conductive traces is characterized by a first portion in electrical communication with one of the plurality of die connectors and a second portion in electrical communication with a package connector.

摘要翻译： 一种制造集成电路封装的方法。 该方法包括将半导体管芯的第一表面附接到热和/或导电衬底，在半导体管芯的第二表面上形成多个管芯连接器，并将半导体管芯和多个管芯连接器封装在密封剂 材料。 该方法还包括去除一部分密封剂材料以暴露多个模具连接器中的一个或多个，由此形成路由表面。 该方法还包括在路由表面上形成多个导电迹线。 多个导电迹线中的每一个的特征在于与多个管芯连接器之一电连通的第一部分和与封装连接器电连通的第二部分。

公开(公告)号：US07957094B1

公开(公告)日：2011-06-07

申请号：US12842452

申请日：2010-07-23

申请人： Chenglin Liu ,  Shiann-Ming Liou

发明人： Chenglin Liu ,  Shiann-Ming Liou

IPC分类号： G11B33/14

CPC分类号： G06F1/20 ,  G11B33/1426 ,  H05K1/0206 ,  H05K3/30

摘要： A drive system includes a printed circuit board. A first integrated circuit is associated with the printed circuit board. A drive assembly case is connected to the printed circuit board. A first thermal interface material, wherein (i) the thermal interface material is in thermal contact with the first integrated circuit and (ii) the drive assembly case is in thermal contact with the thermal interface material. The drive assembly case dissipates thermal energy generated by the first integrated circuit.

摘要翻译： 驱动系统包括印刷电路板。 第一集成电路与印刷电路板相关联。 驱动器组件壳体连接到印刷电路板。 第一热界面材料，其中（i）热界面材料与第一集成电路热接触，和（ii）驱动组件壳体与热界面材料热接触。 驱动器组合箱散发由第一集成电路产生的热能。