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公开(公告)号：US20050009300A1
公开(公告)日：2005-01-13
申请号：US10893021
申请日：2004-07-16
IPC分类号： H01L23/31 , H01L23/36 , H01L23/373 , H01L23/482 , H01L21/44
CPC分类号： H01L24/01 , H01L23/3157 , H01L23/36 , H01L23/3735 , H01L23/4827 , H01L2224/274 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.
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公开(公告)号：US06969637B2
公开(公告)日：2005-11-29
申请号：US10893021
申请日：2004-07-16
IPC分类号： H01L23/31 , H01L23/36 , H01L23/373 , H01L23/482 , H01L21/44 , H01L21/301 , H01L21/46 , H01L21/48 , H01L21/50
CPC分类号： H01L24/01 , H01L23/3157 , H01L23/36 , H01L23/3735 , H01L23/4827 , H01L2224/274 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.
摘要翻译： 电子器件形成在包括半导体材料体的模具中，该半导体材料体具有被覆盖结构覆盖的第一面和第二面。 在切割成骰子之前，在制造晶片期间，金属的整体散热器在第二面上电镀生长。 覆盖结构包括钝化区域和不透明聚酰亚胺的保护区域; 保护区域和钝化区域在接触焊盘上方打开以引导引线通过。
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3.发明授权Method of producing suspended elements for electrical connection between two portions of a micromechanism which can move relative to one another 有权制造可以相对于彼此移动的微机构的两个部分之间的电连接的悬挂元件的方法公开(公告)号：US06779247B1
公开(公告)日：2004-08-24
申请号：US09676017
申请日：2000-09-29
IPC分类号： G11B5127
CPC分类号： G11B7/22 , G11B5/53 , G11B7/122 , Y10T29/49021 , Y10T29/49041
摘要： A method of producing suspended elements for electrical connection between two portions of a micro-mechanism that can move relative to one another provides for the formation of a layer of sacrificial material, the formation of the electrical connection elements on the layer of sacrificial material, and the selective removal of the layer of sacrificial material beneath the electrical connecting elements, the layer of sacrificial material being a thin film with at least one adhesive side that can be applied dry to the surface of the micro-mechanism.
摘要翻译： 一种用于在微机构的两部分之间进行电连接的悬挂元件的制造方法，该微机构可以相对于彼此移动，从而形成牺牲材料层，在牺牲材料层上形成电连接元件，以及 选择性地去除电连接元件下面的牺牲材料层，牺牲材料层是具有至少一个可以干燥地施加到微机构表面的粘合剂侧的薄膜。
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4.发明授权Method for the electrical and/or mechanical interconnection of components of a microelectronic system 有权用于微电子系统的部件的电和/或机械互连的方法公开(公告)号：US06423938B1
公开(公告)日：2002-07-23
申请号：US09662984
申请日：2000-09-15
IPC分类号： H05B100
CPC分类号： H01L24/81 , H01L23/345 , H01L24/98 , H01L2224/05568 , H01L2224/05573 , H01L2224/16148 , H01L2224/81191 , H01L2224/81192 , H01L2224/81234 , H01L2224/81815 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/19043 , H01L2224/05599
摘要： A method for the electrical and/or mechanical interconnection of components of a microelectronic system includes at least one first component and at least one second component to be connected, and at least one local Joule-effect micro-heater is incorporated in one of the first and second components at a respective soldering point therebetween. The method includes supplying electrical energy to the micro-heater to utilize the heat produced therefrom by the Joule effect to solder the first and second components at the respective soldering point.
摘要翻译： 用于微电子系统的部件的电和/或机械互连的方法包括至少一个第一部件和要连接的至少一个第二部件，并且至少一个局部焦耳效应微加热器被并入第一部件 和在它们之间的相应焊接点处的第二部件。 该方法包括向微加热器提供电能以利用焦耳效应产生的热量来在相应焊接点处焊接第一和第二部件。
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公开(公告)号：US06784522B2
公开(公告)日：2004-08-31
申请号：US09874381
申请日：2001-06-04
IPC分类号： H01L2972
CPC分类号： H01L24/01 , H01L23/3157 , H01L23/36 , H01L23/3735 , H01L23/4827 , H01L2224/274 , H01L2924/01005 , H01L2924/01006 , H01L2924/01015 , H01L2924/01029 , H01L2924/01033 , H01L2924/01079 , H01L2924/01082
摘要： The electronic device is formed in a die including a body of semiconductor material having a first face covered by a covering structure and a second face. An integral thermal spreader of metal is grown galvanically on the second face during the manufacture of a wafer, prior to cutting into dice. The covering structure comprises a passivation region and a protective region of opaque polyimide; the protective region and the passivation region are opened above the contact pads for the passage of leads.
摘要翻译： 电子器件形成在包括半导体材料体的模具中，该半导体材料体具有被覆盖结构覆盖的第一面和第二面。 在切割成骰子之前，在制造晶片期间，金属的整体散热器在第二面上电镀生长。 覆盖结构包括钝化区域和不透明聚酰亚胺的保护区域; 保护区域和钝化区域在接触焊盘上方打开以引导引线通过。
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6.发明授权Method for manufacturing a hard disk read/write unit, with micrometric actuation 有权制造硬盘读/写单元的方法，具有微动作动公开(公告)号：US06446326B1
公开(公告)日：2002-09-10
申请号：US09305862
申请日：1999-05-05
IPC分类号： G11B5127
CPC分类号： H02N1/006 , G11B5/5552 , G11B5/58 , Y10T29/49027 , Y10T29/49032 , Y10T29/49052 , Y10T29/49053
摘要： The method comprises the steps of: forming an integrated device including a microactuator in a semiconductor material wafer; forming an immobilization structure of organic material on the wafer; simultaneously forming a securing flange integral with the microactuator and electrical connections for connecting the integrated device to a read/write head; bonding a transducer supporting the read/write head to the securing flange; connecting the electrical connections to the read/write head; cutting the wafer into dices; bonding the microactuator to a suspension; and removing the immobilization structure.
摘要翻译： 该方法包括以下步骤：在半导体材料晶片中形成包括微致动器的集成器件; 在晶片上形成有机材料的固定结构; 同时形成与微致动器一体的固定凸缘和用于将集成装置连接到读/写头的电连接; 将支撑读/写头的换能器接合到固定凸缘; 将电气连接连接到读/写头; 将晶片切成骰子; 将微致动器粘合到悬浮液上; 并去除固定结构。
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7.发明授权Process for manufacturing integrated semiconductor devices comprising a chemoresistive gas microsensor 有权用于制造包括化学耐药性微量传感器的集成半导体器件的方法公开(公告)号：US06326229B1
公开(公告)日：2001-12-04
申请号：US09405893
申请日：1999-09-24
IPC分类号： H01L2100
CPC分类号： G01N27/12
摘要： To manufacture integrated semiconductor devices comprising chemoresistive gas microsensors, a semiconductor material body is first formed, on the semiconductor material body are successively formed, reciprocally superimposed, a sacrificial region of metallic material, formed at the same time and on the same level as metallic connection regions for the sensor, a heater element, electrically and physically separated from the sacrificial region and a gas sensitive element, electrically and physically separated from the heater element; openings are formed laterally with respect to the heater element and to the gas sensitive element, which extend as far as the sacrificial region and through which the sacrificial region is removed at the end of the manufacturing process.
摘要翻译： 为了制造包括化学耐化学气体微传感器的集成半导体器件，首先形成半导体材料体，在半导体材料体上依次形成与金属连接同时形成的金属材料的牺牲区域， 用于传感器的区域，与牺牲区电气和物理分离的加热器元件和气体敏感元件，与加热器元件电和物理分离; 开口相对于加热器元件和气体敏感元件横向形成，气体敏感元件延伸到牺牲区域并且在制造过程结束时除去牺牲区域。
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8.发明授权Method for assembling an actuator device for a hard disk, comprising a read/write transducer, a microactuator, and a suspension, and the actuator device thus obtained 有权组装用于硬盘的致动器装置的方法，包括读/写换能器，微致动器和悬架，以及由此获得的致动器装置公开(公告)号：US06501623B1
公开(公告)日：2002-12-31
申请号：US09357078
申请日：1999-07-20
IPC分类号： G11B555
CPC分类号： G11B5/5552 , G11B5/11
摘要： A microactuator is attached to a first face of a coupling formed on a suspension, so that an R/W transducer projects from an opposite face. A hole in the coupling permits passage of an adhesive mass interposed between a rotor of the microactuator and the R/W transducer. A strip of adhesive material extends between a die accommodating the microactuator and the coupling, and externally surrounds the microactuator. The coupling acts as a protective shield for the microactuator, both mechanically and electrically. The coupling covers the microactuator at the front, and prevents foreign particles from blocking the microactuator. In addition, the coupling electrically insulates the R/W transducer, which is sensitive to magnetic fields, from regions of the microactuator biased to a high voltage. With the coupling, the strip forms a sealing structure, which in practice surrounds the microactuator on all sides.
摘要翻译： 微型致动器附接到形成在悬架上的联接器的第一面上，使得R / W传感器从相对的面突出。 联接器中的孔允许插入在微致动器的转子和R / W换能器之间的粘合剂块的通过。 一条粘合剂材料在容纳微型致动器的模具和联接器之间延伸，并且外部包围微型致动器。 联轴器作为微型致动器的机械和电气保护屏蔽。 联轴器覆盖前部的微型致动器，并防止外来颗粒堵塞微型致动器。 另外，该耦合将对磁场敏感的R / W传感器与微型制动器的偏压高电压绝缘。 通过联接，条带形成密封结构，实际上围绕着所有侧面上的微致动器。
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9.发明授权Fabrication process for microstructure protection systems related to hard disk reading unit 有权与硬盘读取单元相关的微结构保护系统的制造工艺公开(公告)号：US06391741B1
公开(公告)日：2002-05-21
申请号：US09616227
申请日：2000-07-14
IPC分类号： H01L2176
CPC分类号： G11B5/56 , B81C1/00896 , H01L2224/48091 , H01L2224/48472 , H01L2224/73204 , H01L2924/10253 , H01L2924/00014 , H01L2924/00
摘要： A process for assembling a microactuator on a R/W transducer that includes forming a first wafer of semiconductor material having a plurality of microactuators including suspended regions and fixed regions separated from each other by first trenches; forming a second wafer of semiconductor material comprising blocking regions connecting mobile and fixed intermediate regions separated from each other by second trenches; bonding the two wafers so as to form a composite wafer wherein the suspended regions of the first wafer are connected to the mobile intermediate regions of the second wafer, and the fixed regions of the first wafer are connected to the fixed intermediate regions of the second wafer; cutting the composite wafer into a plurality of units; fixing the mobile intermediate region of each unit to a respective R/W transducer; and removing the blocking regions. The blocking regions are made of silicon oxide, and the intermediate regions are made of polycrystalline silicon.
摘要翻译： 一种在R / W换能器上组装微致动器的方法，包括形成具有多个微致动器的半导体材料的第一晶片，所述多个微致动器包括通过第一沟槽彼此分离的悬置区域和固定区域; 形成第二半导体材料晶片，其包括通过第二沟槽彼此分开的连接移动和固定中间区域的阻挡区域; 键合两个晶片以形成复合晶片，其中第一晶片的悬置区域连接到第二晶片的移动中间区域，并且第一晶片的固定区域连接到第二晶片的固定中间区域 ; 将复合晶片切割成多个单元; 将每个单元的移动中间区域固定到相应的R / W换能器; 并去除阻挡区域。 阻挡区域由氧化硅制成，中间区域由多晶硅制成。
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10.发明授权Process for manufacturing mechanical, electromechanical and opto-electromechanical microstructures having suspended regions subject to mechanical stresses during assembly 有权用于制造具有在组装期间受到机械应力的悬浮区域的机械，机电和光电机电微结构的工艺公开(公告)号：US06358769B1
公开(公告)日：2002-03-19
申请号：US09513476
申请日：2000-02-25
IPC分类号： H01L2100
CPC分类号： B81C1/00896
摘要： To reduce the risk of breakage of the moving parts of an integrated microstructure during manufacture steps causing mechanical stresses to the moving parts, a temporary immobilization and support structure is formed, whereby a moving region of the microstructure is temporarily integral with the fixed region. The temporary structure is removed at the end of the assembly operations by non-mechanical removal methods. According to one solution, the temporary structure is formed by a fusible element removed by melting or evaporation, by applying a sufficient quantity of energy thereto. Alternatively, a structural region of polymer material is formed in the trench separating the moving part from the fixed part, or an adhesive material layer sensitive to ultraviolet radiation is applied.
摘要翻译： 为了减少在对运动部件造成机械应力的制造步骤期间的集成微结构的运动部件的破损的危险，形成临时固定和支撑结构，由此微结构的运动区域与固定区域暂时成为一体。 临时结构在组装操作结束时通过非机械去除方法去除。 根据一种解决方案，临时结构由通过熔化或蒸发除去的可熔元件通过向其施加足够量的能量而形成。 或者，在将移动部分与固定部分分开的沟槽中形成聚合物材料的结构区域，或施加对紫外线辐射敏感的粘合剂材料层。
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