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公开(公告)号：US20130093069A1
公开(公告)日：2013-04-18
申请号：US13273247
申请日：2011-10-14
申请人： BAU-RU LU , JENG-JEN LI , CHIANG KAIPENG
发明人： BAU-RU LU , JENG-JEN LI , CHIANG KAIPENG
IPC分类号： H01L23/495 , H01L21/768
CPC分类号： H01L23/49861 , H01L23/13 , H01L23/49524 , H01L23/49833 , H01L24/45 , H01L24/48 , H01L24/83 , H01L25/16 , H01L2224/2919 , H01L2224/29339 , H01L2224/32257 , H01L2224/45144 , H01L2224/48245 , H01L2224/48247 , H01L2224/83192 , H01L2224/83411 , H01L2224/83439 , H01L2224/83447 , H01L2224/83851 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00
摘要： The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
摘要翻译： 本发明公开了一种由金属基底和引线框组合而成的封装结构。 在一个实施例中，在金属基板中形成凹部，并且具有至少一个第一I / O端子的第一导电元件接合在凹部中。 引线框架形成在金属基板上并且包括多个电连接以与第一导电元件的所述至少一个第一I / O端子连接。 在另一个实施例中，另一导电元件设置在引线框架的空位中。 本发明还公开了一种用于制造由金属基底和引线框的组合制成的封装结构的方法。
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公开(公告)号：US20140042610A1
公开(公告)日：2014-02-13
申请号：US13571378
申请日：2012-08-10
申请人： JENG-JEN LI , BAU-RU LU
发明人： JENG-JEN LI , BAU-RU LU
CPC分类号： H01L24/19 , H01L23/13 , H01L23/49816 , H01L23/5389 , H01L24/20 , H01L24/24 , H01L24/82 , H01L25/0652 , H01L25/16 , H01L2224/0401 , H01L2224/04105 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/24101 , H01L2224/24155 , H01L2224/244 , H01L2224/2518 , H01L2924/12042 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/00
摘要： The invention discloses a package structure with at least one portion of a first conductive element disposed in a through-opening of a first substrate. A conductive structure is disposed on the first substrate and the first conductive element, wherein the conductive structure is electrically connected to the first substrate and said at least one first I/O terminal of the first conductive element. The conductive structure comprises at least one of a second conductive element, a second substrate or a conductive pattern.
摘要翻译： 本发明公开了一种封装结构，其具有设置在第一基板的通孔中的第一导电元件的至少一部分。 导电结构设置在第一基板和第一导电元件上，其中导电结构电连接到第一基板和第一导电元件的所述至少一个第一I / O端子。 导电结构包括第二导电元件，第二基板或导电图案中的至少一个。
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公开(公告)号：US20130213704A1
公开(公告)日：2013-08-22
申请号：US13401853
申请日：2012-02-22
申请人： BAU-RU LU , JENG-JEN LI , KUN-HONG SHIH , KAIPENG CHIANG
发明人： BAU-RU LU , JENG-JEN LI , KUN-HONG SHIH , KAIPENG CHIANG
CPC分类号： H01L23/49537 , H01L21/563 , H01L23/13 , H01L23/49506 , H01L23/49534 , H01L23/49548 , H01L23/49575 , H01L23/49827 , H01L23/49833 , H01L24/16 , H01L2224/16225 , H01L2924/13055 , H01L2924/13091 , H01L2924/15321 , H05K1/021 , H05K1/186 , Y10T29/49124 , H01L2924/00
摘要： The invention discloses a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a recess is formed in the device carrier and a conductive element is disposed on the substrate, wherein the substrate is disposed on the device carrier and the conductive element is located in the recess of the device carrier. The conductive pattern in the substrate is electrically connected to the device carrier and I/O terminals of the first conductive element. The invention also discloses a method for manufacturing a package structure made of the combination of a device carrier and a modifiable substrate. In one embodiment, a portion of the conductive pattern in the substrate can be modified.
摘要翻译： 本发明公开了一种由装置载体和可修改基底的组合制成的封装结构。 在一个实施例中，在器件载体中形成凹部，并且导电元件设置在衬底上，其中衬底设置在器件载体上，并且导电元件位于器件载体的凹部中。 衬底中的导电图案电连接到器件载体和第一导电元件的I / O端子。 本发明还公开了一种用于制造由器件载体和可修改基底的组合制成的封装结构的方法。 在一个实施例中，衬底中的导电图案的一部分可以被修改。
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公开(公告)号：US20150029678A1
公开(公告)日：2015-01-29
申请号：US13950335
申请日：2013-07-25
申请人： BAU-RU LU , MING-CHIA WU
发明人： BAU-RU LU , MING-CHIA WU
CPC分类号： H01L24/24 , H01L21/56 , H01L21/561 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L23/5389 , H01L23/552 , H01L24/19 , H01L24/96 , H01L24/97 , H01L2224/04105 , H01L2224/19 , H01L2224/24137 , H01L2924/1206 , H01L2924/13055 , H01L2924/13091 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/3025 , H05K1/0218 , H05K3/284
摘要： A substrateless device comprises a plurality of first conductive elements and an encapsulant. The encapsulant encapsulates the plurality of first conductive elements, wherein the locations of the plurality of first conductive elements are fixed by the encapsulant; and a plurality of terminals of the plurality of first conductive elements are exposed outside the encapsulant, wherein the plurality of first conductive elements are not supported by a substrate.
摘要翻译： 一种无基底装置包括多个第一导电元件和密封剂。 密封剂封装多个第一导电元件，其中多个第一导电元件的位置由密封剂固定; 并且所述多个第一导电元件的多个端子暴露在所述密封剂的外部，其中所述多个第一导电元件不被基板支撑。
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公开(公告)号：US20120236519A1
公开(公告)日：2012-09-20
申请号：US13485954
申请日：2012-06-01
申请人： Da-Jung Chen , Chun-Tiao Liu , BAU-RU LU
发明人： Da-Jung Chen , Chun-Tiao Liu , BAU-RU LU
CPC分类号： H05K1/181 , H01F27/022 , H01F27/027 , H01F27/24 , H01F27/29 , H01F27/40 , H01L23/24 , H01L23/3121 , H01L23/552 , H01L23/645 , H01L24/73 , H01L25/16 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K3/3421 , H05K2201/1003 , H05K2201/10515 , H05K2201/10537 , H05K2201/10924 , Y02P70/611 , Y10T29/49146 , H01L2924/00012 , H01L2924/00
摘要： The present invention discloses an electronic package structure. The body has a top surface with a cavity thereon, the first conductive element is disposed in the cavity, and the second conductive element is disposed in the body. The first external electrode electrically connected to the first conductive element and the second external electrode electrically connected to the second conductive element are both disposed on the top surface of the body or a first surface formed by the top surface of the encapsulation compound and the exposed portions of the top surface of the body which are not covered by the encapsulation compound.
摘要翻译： 本发明公开了一种电子封装结构。 本体具有其上具有空腔的顶表面，第一导电元件设置在空腔中，并且第二导电元件设置在主体中。 电连接到第一导电元件的第一外部电极和与第二导电元件电连接的第二外部电极都设置在主体的顶表面上或由封装化合物的顶表面形成的第一表面和暴露部分 的未被封装化合物覆盖的身体的顶表面。
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6.发明申请公开(公告)号：US20150348801A1
公开(公告)日：2015-12-03
申请号：US14821812
申请日：2015-08-10
申请人： BAU-RU LU , DA-JUNG CHEN , YI-CHENG LIN
发明人： BAU-RU LU , DA-JUNG CHEN , YI-CHENG LIN
IPC分类号： H01L21/48 , H01L25/16 , H01L25/00 , H01L23/495 , H01L21/768
CPC分类号： H01L21/4825 , H01L21/4821 , H01L21/76877 , H01L23/49503 , H01L23/49524 , H01L23/49527 , H01L23/49534 , H01L23/49558 , H01L23/49575 , H01L23/49582 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L25/16 , H01L25/50 , H01L2224/215 , H01L2224/24011 , H01L2224/24247 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , Y10T29/49123 , H01L2924/00012 , H01L2924/00
摘要： A method for forming a conductive structure is disclosed, the method comprising the steps of: forming a metallic frame having a plurality of metal parts separated from each other; forming an insulating layer on the top surface of the plurality of metal parts; and forming a conductive pattern layer on the insulating layer for making electrical connections with at least one portion of the plurality of metal parts.
摘要翻译： 公开了一种形成导电结构的方法，所述方法包括以下步骤：形成具有彼此分离的多个金属部件的金属框架; 在所述多个金属部件的顶表面上形成绝缘层; 以及在所述绝缘层上形成导电图案层，用于与所述多个金属部件的至少一部分进行电连接。
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7.发明申请公开(公告)号：US20120319258A1
公开(公告)日：2012-12-20
申请号：US13163770
申请日：2011-06-20
申请人： BAU-RU LU , DA-JUNG CHEN , YI-CHENG LIN
发明人： BAU-RU LU , DA-JUNG CHEN , YI-CHENG LIN
IPC分类号： H01L23/495 , H01L21/50
CPC分类号： H01L21/4825 , H01L21/4821 , H01L21/76877 , H01L23/49503 , H01L23/49524 , H01L23/49527 , H01L23/49534 , H01L23/49558 , H01L23/49575 , H01L23/49582 , H01L24/24 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/82 , H01L25/16 , H01L25/50 , H01L2224/215 , H01L2224/24011 , H01L2224/24247 , H01L2224/2929 , H01L2224/29339 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48247 , H01L2224/73253 , H01L2224/73265 , H01L2224/73267 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/14 , H01L2924/15153 , H01L2924/19041 , H01L2924/19043 , H01L2924/19105 , H01L2924/30107 , H01L2924/3011 , Y10T29/49123 , H01L2924/00012 , H01L2924/00
摘要： A method of forming a conductive pattern on a metallic frame for manufacturing a stack frame for electrical connections is disclosed. In one embodiment, a recess is formed in the metallic frame and a conductive element is bonded in the recess to make a stack frame for electrical connections. In another embodiment, the process can be performed on both top surface and bottom surface of metallic frame to make another stack frame for electrical connections. In yet another embodiment, a package structure and a manufacturing method of forming a conductive pattern on a lead frame for electrical connections are disclosed.
摘要翻译： 公开了一种在用于制造用于电连接的堆叠框架的金属框架上形成导电图案的方法。 在一个实施例中，在金属框架中形成凹部，并且导电元件接合在凹部中以形成用于电连接的堆叠框架。 在另一个实施例中，该过程可以在金属框架的顶表面和底表面上进行以制造用于电连接的另一个堆叠框架。 在另一个实施例中，公开了一种在用于电连接的引线框架上形成导电图案的封装结构和制造方法。
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公开(公告)号：US20100117216A1
公开(公告)日：2010-05-13
申请号：US12540021
申请日：2009-08-12
申请人： BAU-RU LU , Chau-Chun Wen , Da-Jung Chen , Chun-Hsien Lu
发明人： BAU-RU LU , Chau-Chun Wen , Da-Jung Chen , Chun-Hsien Lu
IPC分类号： H01L23/48
CPC分类号： H01L23/49811 , H01L23/36 , H01L23/3735 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/48247 , H01L2224/49 , H01L2224/73265 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/1305 , H01L2924/13055 , H01L2924/15312 , H01L2924/1532 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A chip package structure including a substrate, at least one chip, a heat dissipation device, at least one first conductive bar, a molding compound, and at least one second conductive bar is provided. The chip and the heat dissipation device are respectively disposed on a first and a second surface of the substrate. The first conductive bar has two opposite end surfaces, wherein one end surface is disposed on the first surface of the substrate, the other end surface is extended away from the substrate, and a fastening slot is disposed between the two end surfaces and passes through the other end surface. The molding compound encapsulates the substrate, the chip, part of the heat dissipation device, and the first conductive bar. The second conductive bar is disposed on one surface of the molding compound and has a protrusion portion fastened to the fastening slot of the first conductive bar.
摘要翻译： 提供一种芯片封装结构，包括基板，至少一个芯片，散热装置，至少一个第一导电棒，模塑料和至少一个第二导电棒。 芯片和散热装置分别设置在基板的第一和第二表面上。 第一导电棒具有两个相对的端面，其中一个端面设置在基板的第一表面上，另一端表面远离基板延伸，并且紧固槽设置在两个端面之间并穿过 另一端面。 模塑料封装基板，芯片，散热装置的一部分和第一导电棒。 第二导电棒设置在模制化合物的一个表面上，并且具有紧固到第一导电棒的紧固槽的突起部分。
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