发明申请
- 专利标题： PACKAGE STRUCTURE AND THE METHOD TO FABRICATE THEREOF
- 专利标题（中）： 包装结构及其制作方法
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申请号： US13273247申请日： 2011-10-14
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公开(公告)号： US20130093069A1公开(公告)日： 2013-04-18
- 发明人: BAU-RU LU , JENG-JEN LI , CHIANG KAIPENG
- 申请人： BAU-RU LU , JENG-JEN LI , CHIANG KAIPENG
- 申请人地址： TW Hsinchu
- 专利权人： CYNTEC CO., LTD.
- 当前专利权人： CYNTEC CO., LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/495
- IPC分类号： H01L23/495 ; H01L21/768
摘要：
The invention discloses a package structure made of the combination of a metallic substrate and a lead frame. In one embodiment, a recess is formed in the metallic substrate and a first conductive element having at least one first I/O terminal is bonded in the recess. A lead frame is formed on the metallic substrate and comprises a plurality of electrical connections to connect with said at least one first I/O terminal of the first conductive element. In another embodiment, another conductive element is disposed in the vacancy of the lead frame. The invention also discloses a method for manufacturing a package structure made of the combination of a metallic substrate and a lead frame.
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