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公开(公告)号：US20220282918A1
公开(公告)日：2022-09-08
申请号：US17681671
申请日：2022-02-25
发明人： Justin Ho Kuen Wong
摘要： A substrate cleaning and drying system includes a cleaning station, a drying station positioned adjacent the cleaning station, a cleaner robot to transfer a substrate from the cleaning station to the drying station, an aligner stage adjacent to the drying station, a robot arm rotatable between a substantially vertical first position for receiving the substrate from the drying station and a substantially horizontal second position for releasing the substrate onto the aligner stage, and a factory interface robot to transfer a substrate from the aligner stage into a factory interface module while in a horizontal orientation. The aligner stage includes a rotatable support to hold the substrate in a substantially horizontal orientation and to rotate the substrate to a desired orientation.
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公开(公告)号：US11929264B2
公开(公告)日：2024-03-12
申请号：US17681670
申请日：2022-02-25
发明人： Justin Ho Kuen Wong
IPC分类号： H01L21/02 , B08B3/10 , F26B3/04 , F26B11/18 , F26B25/00 , H01L21/67 , H01L21/68 , H01L21/687
CPC分类号： H01L21/67057 , B08B3/10 , F26B3/04 , F26B11/18 , F26B25/003 , H01L21/67259 , H01L21/68 , H01L21/68707
摘要： A substrate cleaning and drying system includes a cleaning station, a drying station positioned adjacent the cleaning station, a cleaner robot to transfer a substrate from the cleaning station to the drying station, an aligner stage adjacent to the drying station, a robot arm rotatable between a substantially vertical first position for receiving the substrate from the drying station and a substantially horizontal second position for releasing the substrate onto the aligner stage, and a factory interface robot to transfer a substrate from the aligner stage into a factory interface module while in a horizontal orientation. The aligner stage includes a rotatable support to hold the substrate in a substantially horizontal orientation and to rotate the substrate to a desired orientation.
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公开(公告)号：US11890715B2
公开(公告)日：2024-02-06
申请号：US17355038
申请日：2021-06-22
摘要： A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.
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公开(公告)号：US20220285175A1
公开(公告)日：2022-09-08
申请号：US17681670
申请日：2022-02-25
发明人： Justin Ho Kuen Wong
IPC分类号： H01L21/67 , B08B3/10 , H01L21/68 , H01L21/687
摘要： A substrate cleaning and drying system includes a cleaning station, a drying station positioned adjacent the cleaning station, a cleaner robot to transfer a substrate from the cleaning station to the drying station, an aligner stage adjacent to the drying station, a robot arm rotatable between a substantially vertical first position for receiving the substrate from the drying station and a substantially horizontal second position for releasing the substrate onto the aligner stage, and a factory interface robot to transfer a substrate from the aligner stage into a factory interface module while in a horizontal orientation. The aligner stage includes a rotatable support to hold the substrate in a substantially horizontal orientation and to rotate the substrate to a desired orientation.
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公开(公告)号：US20210402547A1
公开(公告)日：2021-12-30
申请号：US17355038
申请日：2021-06-22
IPC分类号： B24B37/005 , B24B37/32
摘要： A carrier head for holding a substrate in a polishing system includes a housing, a first flexible membrane secured to the housing to form one or more pressurizable chambers to apply pressure through a central membrane portion of the first flexible membrane to a central portion of a substrate, and a plurality of independently operable piezoelectric actuators supported by the housing, the plurality of piezoelectric actuators positioned radially outward of the central membrane portion and at different angular positions so as to independently adjust pressure on a plurality of angular zones in an annular outer region of the substrate surrounding the central portion of the substrate.
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公开(公告)号：US12030156B2
公开(公告)日：2024-07-09
申请号：US17355024
申请日：2021-06-22
摘要： A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carrier plate. The first flexible membrane has an upper surface and having a lower surface that provides a substrate mounting surface. The piezoelectric actuators are positioned above the first flexible membrane so as to independently adjust compressive pressure on the upper surface of the first flexible membrane.
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公开(公告)号：US11749552B2
公开(公告)日：2023-09-05
申请号：US16738798
申请日：2020-01-09
发明人： Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
IPC分类号： H01L21/677 , H01L21/687 , B24B41/06 , H01L21/67
CPC分类号： H01L21/68707 , B24B41/06 , H01L21/67028 , H01L21/67051 , H01L21/67703
摘要： A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.
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公开(公告)号：US20230352337A1
公开(公告)日：2023-11-02
申请号：US18348146
申请日：2023-07-06
发明人： Jagan Rangarajan , Edward Golubovsky , Shaun Van Der Veen , Justin Ho Kuen Wong , Steven M. Zuniga
IPC分类号： H01L21/687 , H01L21/677 , B24B41/06 , H01L21/67
CPC分类号： H01L21/68707 , H01L21/67703 , B24B41/06 , H01L21/67051 , H01L21/67028
摘要： A wafer processing device may include a wafer exchanger including two or more blades, each of the two or more blades may be configured to receive a wafer, the two or more blades may be rotatable about an axis on a single horizontal plane, and the two or more blades may be movable between at least a load cup and a robot access location; wherein the load cup may include a wafer station that is vertically moveable relative a blade located in the load cup and may be configured to remove a wafer from a blade located in the load cup and place a wafer on a blade located in the load cup. Other devices, load cups and methods are also disclosed herein.
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公开(公告)号：US20210402546A1
公开(公告)日：2021-12-30
申请号：US17355024
申请日：2021-06-22
IPC分类号： B24B37/005 , B24B37/10 , B24B49/10 , B24B29/00
摘要： A carrier head for holding a substrate in a polishing system has a housing including a carrier plate, a first flexible membrane secured to the housing, and a plurality of independently operable piezoelectric actuators secured to the carrier plate. The first flexible membrane has an upper surface and having a lower surface that provides a substrate mounting surface. The piezoelectric actuators are positioned above the first flexible membrane so as to independently adjust compressive pressure on the upper surface of the first flexible membrane.
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