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公开(公告)号：US11986926B2
公开(公告)日：2024-05-21
申请号：US17897088
申请日：2022-08-26
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
CPC classification number: B24B57/02 , B24B37/10 , H01L21/67075 , H01L21/6708
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.
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公开(公告)号：US20210331288A1
公开(公告)日：2021-10-28
申请号：US17371032
申请日：2021-07-08
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.
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公开(公告)号：US11806835B2
公开(公告)日：2023-11-07
申请号：US17209034
申请日：2021-03-22
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
CPC classification number: B24B57/02 , B24B37/10 , H01L21/6708 , H01L21/67075
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.
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公开(公告)号：US10967483B2
公开(公告)日：2021-04-06
申请号：US15626857
申请日：2017-06-19
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.
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公开(公告)号：US09452506B2
公开(公告)日：2016-09-27
申请号：US14530163
申请日：2014-10-31
Applicant: Applied Materials, Inc.
Inventor： Paul D. Butterfield , Shou-Sung Chang , Bum Jick Kim
IPC: B24B53/00 , B24B53/017
CPC classification number: B24B53/017
Abstract: Vacuum cleaning systems and related methods are disclosed. A polishing pad in combination with a fluid, such as a slurry, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system includes an enclosure body having an inlet opening which may be placed proximate to the polishing pad and an exit opening in communication with a vacuum source to remove the debris and the fluid from the polishing pad through a passageway connecting the inlet and exit openings. By including contact members secured to the enclosure body and configured to form an abutment against a working surface of the polishing pad, a Venturi effect zone between the enclosure body and the working surface of the polishing pad may be created to dislodge fluid and debris from the working surface. In this manner, scratches and contamination are avoided for later-polished substrates.
Abstract translation: 公开了真空清洁系统及相关方法。 与诸如浆料的流体结合的抛光垫与衬底接触以在其表面平坦化材料并且导致碎屑。 清洁系统包括具有可以靠近抛光垫设置的入口开口的外壳主体和与真空源连通的出口，以通过连接入口和出口的通道从抛光垫移除碎屑和流体 。 通过包括固定到外壳主体并被配置为形成与抛光垫的工作表面的抵接件的接触构件，可以产生外壳主体和抛光垫的工作表面之间的文丘里效应区，以将流体和碎屑从 工作面 以这种方式，可以避免稍后抛光的基材产生划伤和污染。
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Patent Agency Ranking
公开(公告)号：US11077536B2
公开(公告)日：2021-08-03
申请号：US15626936
申请日：2017-06-19
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface. The first barrier includes a solid first body having a first flat bottom surface and having a first leading surface configured to contact the used polishing liquid.
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公开(公告)号：US20210205953A1
公开(公告)日：2021-07-08
申请号：US17209034
申请日：2021-03-22
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a first barrier positioned before the portion of the polishing surface and configured to block used polishing liquid from reaching the portion of the polishing surface.
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公开(公告)号：US10350728B2
公开(公告)日：2019-07-16
申请号：US14919406
申请日：2015-10-21
Applicant: Applied Materials, Inc.
Inventor： Jie Diao , Erik S. Rondum , Thomas Ho Fai Li , Bum Jick Kim , Christopher Heung-Gyun Lee
IPC: B24B37/04 , B24B53/017 , H01L21/306 , H01L21/3105 , B24B57/02
Abstract: Polishing pad cleaning systems and related methods are disclosed. A rotatable platen comprising a polishing pad in combination with a fluid, such as a polishing fluid, contacts a substrate to planarize material at the surface thereof and resultantly creates debris. A cleaning system introduces a spray system to remove debris from the polishing pad to prevent substrate damage and improve efficiency, a waste removal system for removing used spray, used polishing fluid, and debris from the polishing pad, and a polishing fluid delivery system for providing fresh polishing fluid to the polishing pad, such that the substrate only receives fresh polishing fluid upon each complete rotation of the platen. In this manner, within die performance is enhanced, the range of certain CMP processes is improved, scratches and contamination are avoided for each polished substrate and for later-polished substrates, and platen temperatures are reduced.
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公开(公告)号：US12076877B2
公开(公告)日：2024-09-03
申请号：US16884888
申请日：2020-05-27
Applicant: Applied Materials, Inc.
Inventor： Bum Jick Kim , Danielle Loi , Jay Gurusamy , Steven M. Zuniga
CPC classification number: B26D3/006 , B23B1/00 , B24B37/10 , B24B37/11 , B24B37/30 , B24B41/04 , B24D3/00 , B26D1/02
Abstract: Embodiments of the present disclosure generally relate to methods of manufacturing polishing platens for use on a chemical mechanical polishing (CMP) system and polishing platens formed therefrom. A method of manufacturing a polishing includes positioning a polishing platen on a support of a manufacturing system. The manufacturing system includes the support and a cutting tool facing there towards. Here, the polishing platen includes a cylindrical metal body having a polymer layer disposed on a surface thereof and the polymer layer has a thickness of about 100 μm or more. The method further includes removing at least a portion of the polymer layer using the cutting tool to form a polishing pad-mounting surface. Beneficially, the method may be used to form a pad-mounting surface having a desired flatness or shape, such as a concave or convex shape.
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公开(公告)号：US20220402096A1
公开(公告)日：2022-12-22
申请号：US17897088
申请日：2022-08-26
Applicant: Applied Materials, Inc.
Inventor： Yen-Chu Yang , Stephen Jew , Jianshe Tang , Haosheng Wu , Shou-Sung Chang , Paul D. Butterfield , Alexander John Fisher , Bum Jick Kim
Abstract: An apparatus for chemical mechanical polishing includes a rotatable platen having a surface to support a polishing pad, a carrier head to hold a substrate in contact with the polishing pad, and a polishing liquid distribution system. The polishing liquid distribution system includes a dispenser positioned to deliver a polishing liquid to a portion of a polishing surface of the polishing pad, and a curved barrier positioned after the dispenser to spread fresh polishing liquid from the dispenser.
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