Scan Chain Analysis Using Predefined Capture Signature

    公开(公告)号:US20240393394A1

    公开(公告)日:2024-11-28

    申请号:US18323946

    申请日:2023-05-25

    Applicant: Apple Inc.

    Abstract: An apparatus includes a plurality of circuit blocks, a plurality of scan-enabled flip-flop circuits, and a plurality of scan signature circuits. The plurality of scan-enabled flip-flop circuits may be coupled in a sequential manner across the plurality of circuit blocks, and be configured to shift a scan chain test signal from a test input interface to a test output interface. The plurality of scan signature circuits may be coupled to respective ones of a subset of the plurality of scan-enabled flip-flop circuits, and be configured to, in response to a particular test signal, concurrently load a known scan-chain pattern to the subset of the scan-enabled flip-flop circuits. The plurality of scan-enabled flip-flop circuits may be further configured to sequentially output at least a portion of the known scan-chain pattern to the test output interface.

    Scan chain analysis using predefined capture signature

    公开(公告)号:US12216161B2

    公开(公告)日:2025-02-04

    申请号:US18323946

    申请日:2023-05-25

    Applicant: Apple Inc.

    Abstract: An apparatus includes a plurality of circuit blocks, a plurality of scan-enabled flip-flop circuits, and a plurality of scan signature circuits. The plurality of scan-enabled flip-flop circuits may be coupled in a sequential manner across the plurality of circuit blocks, and be configured to shift a scan chain test signal from a test input interface to a test output interface. The plurality of scan signature circuits may be coupled to respective ones of a subset of the plurality of scan-enabled flip-flop circuits, and be configured to, in response to a particular test signal, concurrently load a known scan-chain pattern to the subset of the scan-enabled flip-flop circuits. The plurality of scan-enabled flip-flop circuits may be further configured to sequentially output at least a portion of the known scan-chain pattern to the test output interface.

    SYSTEMS AND METHODS FOR SILICON CRACK DETECTION STRUCTURE

    公开(公告)号:US20240077531A1

    公开(公告)日:2024-03-07

    申请号:US18450714

    申请日:2023-08-16

    Applicant: Apple Inc.

    CPC classification number: G01R31/2884

    Abstract: Systems and methods are provided for detecting defects caused by cracks in an integrated circuit, which may arise during or after a silicon wafer is singulated into separate integrated circuits. An integrated circuit may include crack detection circuitry including a metal circuit. The metal circuit may fracture or break due to crack propagation through a portion of the integrated circuit. In the event of a crack, testing may detect the fracture of the metal circuit. The crack detection circuitry may also detect accurate operation of circuitry of the integrated circuit.

    Scan Data Transfer Circuits for Multi-die Chip Testing

    公开(公告)号:US20250093416A1

    公开(公告)日:2025-03-20

    申请号:US18391145

    申请日:2023-12-20

    Applicant: Apple Inc.

    Abstract: An apparatus includes a first set of scan-enabled flip-flop circuits may be configured to shift a scan-chain pattern from a first test input node to a first test output node using a first clock signal. A particular lockup latch may be coupled to the first test output node and to a second test input node. This particular lockup latch may be configured to, when enabled, delay propagation of the scan-chain pattern from the first test output node to the second test input node. A second set of scan-enabled flip-flop circuits may be configured to shift the scan-chain pattern from the second test input node to a second test output node using a second clock signal, different from the first clock signal. A control circuit may be configured to determine whether to enable the particular lockup latch using a particular scan test signal.

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