公开(公告)号：US20240077531A1

公开(公告)日：2024-03-07

申请号：US18450714

申请日：2023-08-16

Applicant: Apple Inc.

Inventor： David A. Karol ,  Date J.W. Noorlag ,  Scott D. Hector ,  Vasu P. Ganti

IPC: G01R31/28

CPC classification number: G01R31/2884

Abstract: Systems and methods are provided for detecting defects caused by cracks in an integrated circuit, which may arise during or after a silicon wafer is singulated into separate integrated circuits. An integrated circuit may include crack detection circuitry including a metal circuit. The metal circuit may fracture or break due to crack propagation through a portion of the integrated circuit. In the event of a crack, testing may detect the fracture of the metal circuit. The crack detection circuitry may also detect accurate operation of circuitry of the integrated circuit.