公开(公告)号：US20150093590A1

公开(公告)日：2015-04-02

申请号：US14216614

申请日：2014-03-17

申请人： Apple Inc.

发明人： Matthew S. Theobald ,  Sarah J. Montplaisir

IPC分类号： B23K26/24 ,  B32B15/01 ,  B32B7/04

CPC分类号： B32B15/01 ,  B23K26/24 ,  B32B3/266 ,  B32B7/045 ,  B32B2307/718 ,  B32B2457/00 ,  Y10T428/12292

摘要： A structural member having an internal geometry capable of receive an object and substantially seamless outer surfaces, and that is obtainable by a method that includes providing several small plates, welding together the small plates, removing the weld residue, and polishing an outer surface of the structural member to achieve a certain desired visual effect. A middle plate, or several middle plates, may be positioned between a first plate and a second plate. The middle portion occupied by the middle plates includes an opening, cavity, and/or channel. The opening, cavity, and/or channel may receive a cable from an electronic device, or house a component. The plates and the opening, cavity, and/or channels between the plates, generally have a small form factor, and accordingly, require an assembly process to create the opening, cavity, and/or channels rather than using traditional drilling and/or milling techniques.

摘要翻译： 具有能够接收物体和基本上无缝的外表面的内部几何形状的结构构件，并且可通过包括提供几个小板，将小板焊接在一起，移除焊接残余物并且抛光该外部表面的方法而获得的结构构件 结构构件达到一定的期望视觉效果。 中间板或几个中间板可以定位在第一板和第二板之间。 由中间板占据的中间部分包括开口，空腔和/或通道。 开口，空腔和/或通道可以从电子设备接收电缆，或容纳组件。 板和板之间的开口，空腔和/或通道通常具有小的外形尺寸，因此，需要组装过程以产生开口，空腔和/或通道，而不是使用传统的钻孔和/或铣削 技术

公开(公告)号：US10120409B2

公开(公告)日：2018-11-06

申请号：US15160054

申请日：2016-05-20

申请人： Apple Inc.

发明人： Steven J. Osborne ,  Joss N. Giddings ,  Adam T. Garelli ,  William F. Leggett ,  Sarah J. Montplaisir ,  Eric T. Corriveau ,  Tyler J. Ewing

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  B23K1/00 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/227 ,  B23K20/233 ,  B23K103/08 ,  B23K103/10 ,  B23K103/18 ,  B23K103/04

摘要： Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

公开(公告)号：US10437282B2

公开(公告)日：2019-10-08

申请号：US15028847

申请日：2013-10-23

申请人： Apple Inc.

发明人： Kevin M. Kenney ,  Nicholas A. Rundle ,  Adam T. Garelli ,  Sarah J. Montplaisir ,  Matthew W. Crowley ,  Dinesh C. Mathew

IPC分类号： G06F1/16 ,  G06F1/20 ,  H04N5/64

摘要： An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

公开(公告)号：US20190025874A1

公开(公告)日：2019-01-24

申请号：US16137461

申请日：2018-09-20

申请人： Apple Inc.

发明人： Steven J. Osborne ,  Joss N. Giddings ,  Adam T. Garelli ,  William F. Leggett ,  Sarah J. Montplaisir ,  Eric T. Corriveau ,  Tyler J. Ewing

IPC分类号： G06F1/16 ,  B23K20/233 ,  B23K20/227 ,  B23K20/10 ,  B23K1/00 ,  B23K1/06 ,  B23K1/19 ,  B23K103/10 ,  B23K103/04 ,  B23K103/08 ,  B23K103/18

CPC分类号： G06F1/16 ,  B23K1/0016 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/106 ,  B23K20/227 ,  B23K20/2275 ,  B23K20/233 ,  B23K20/2336 ,  B23K2103/05 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/18 ,  G06F1/1633

摘要： Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

公开(公告)号：US09629271B1

公开(公告)日：2017-04-18

申请号：US14499142

申请日：2014-09-27

申请人： Apple Inc.

发明人： Simon R. Lancaster-Larocque ,  Sarah J. Montplaisir ,  Collin D. Chan

IPC分类号： B23K26/00 ,  H05K5/03 ,  H05K5/04 ,  H05K5/00 ,  B24C1/06 ,  B24C1/08

CPC分类号： B24C1/08 ,  B23K26/355 ,  B23K26/362 ,  B24C1/06

摘要： A method for manufacturing an enclosure for an electronic device using laser texturing to create a first surface having different surface characteristics than a second surface adjacent to the first surface.

公开(公告)号：US11504945B2

公开(公告)日：2022-11-22

申请号：US16358590

申请日：2019-03-19

申请人： Apple Inc.

发明人： Sofiane Berlat ,  Aedhan M. Loomis ,  Peter F. Coxeter ,  Sarah J. Montplaisir ,  Timon A. Wright ,  Yohji Hamada ,  Patrick Perry ,  Chad J. Miller ,  Andrew L. Rosenberg ,  Daniel A. Podhajny ,  Daniel D. Sunshine ,  Jessica J. Lu ,  Lia M. Uesato ,  Donald L. Olmstead

IPC分类号： B32B7/09 ,  D04B1/08 ,  D04B21/20 ,  D04B1/22 ,  D05B1/06 ,  D05B93/00 ,  B29C70/24 ,  B29C65/00 ,  A45C11/00 ,  B32B3/26 ,  B32B5/06

摘要： An item may be formed from structures that include holes. Stitching may be used to form a seam that joins the structures. The stitching may be formed from a chain stitch that passes through the holes. The holes may be formed from loops of knit fabric or other holes. Leather layers, polymer layers, fabric layers, and other structures with holes may be joined using the stitching. During fabrication, a layer of material with holes may be placed on an adjustable-shape fixture having a bed of needles. The shape of the bed of nails in the adjustable-shape fixture may then be changed. After the fixture has been used to transform the shape of one or more of the structures, the structures may be placed on needles in an assembly fixture and the stitching between the structures may be formed. The item may be an electronic device cover or other item.

公开(公告)号：US10664007B2

公开(公告)日：2020-05-26

申请号：US16137461

申请日：2018-09-20

申请人： Apple Inc.

发明人： Steven J. Osborne ,  Joss N. Giddings ,  Adam T. Garelli ,  William F. Leggett ,  Sarah J. Montplaisir ,  Eric T. Corriveau ,  Tyler J. Ewing

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  B23K1/00 ,  B23K1/06 ,  B23K1/19 ,  B23K20/10 ,  B23K20/227 ,  B23K20/233 ,  B23K103/04 ,  B23K103/08 ,  B23K103/10 ,  B23K103/18

摘要： Techniques for bonding structural features together in an enclosure of an electronic device are disclosed. A structural feature may be ultrasonically soldered to the enclosure to provide structural support and form a magnetic circuit within the device. Also, ultrasonic welding can bond various features to an interior region of the enclosure without leaving a mark or trace to an exterior region of the enclosure in a location corresponding to the various features. Further, one or more features can be actuated against the enclosure to bond the one or more features by friction welding. In addition, a rotational friction welding machine can rotate a feature having a relatively small diameter at relatively high speeds against the enclosure to drive the feature into the enclosure and frictionally weld the feature with the enclosure. Also, the friction welding does not leave any an appearance of cosmetic deformation on the exterior region.

公开(公告)号：US10279564B2

公开(公告)日：2019-05-07

申请号：US14216614

申请日：2014-03-17

申请人： Apple Inc.

发明人： Matthew S. Theobald ,  Sarah J. Montplaisir

IPC分类号： B23K26/24 ,  B32B15/01 ,  B32B3/26 ,  B32B7/04

摘要： A structural member having an internal geometry capable of receive an object and substantially seamless outer surfaces, and that is obtainable by a method that includes providing several small plates, welding together the small plates, removing the weld residue, and polishing an outer surface of the structural member to achieve a certain desired visual effect. A middle plate, or several middle plates, may be positioned between a first plate and a second plate. The middle portion occupied by the middle plates includes an opening, cavity, and/or channel. The opening, cavity, and/or channel may receive a cable from an electronic device, or house a component. The plates and the opening, cavity, and/or channels between the plates, generally have a small form factor, and accordingly, require an assembly process to create the opening, cavity, and/or channels rather than using traditional drilling and/or milling techniques.

公开(公告)号：US09910460B2

公开(公告)日：2018-03-06

申请号：US14815376

申请日：2015-07-31

申请人： Apple Inc.

发明人： Adam T. Garelli ,  Simon Regis Louis Lancaster-Larocque ,  Dinesh C. Mathew ,  Bruce E. Berg ,  Sarah J. Montplaisir ,  Nicholas A. Rundle

IPC分类号： H05K5/02 ,  F21V33/00 ,  G06F1/16 ,  B29C45/14 ,  B29C45/34 ,  B29K19/00 ,  B29K33/00 ,  B29L31/34

CPC分类号： G06F1/1656 ,  B29C45/14344 ,  B29C45/34 ,  B29C2045/14352 ,  B29C2045/14368 ,  B29K2019/00 ,  B29K2033/08 ,  B29L2031/34

摘要： An electronic device having protruding features and a method for molding the protruding features to the electronic device are described. The protruding features may be formed by a molding tool that releases a material that flows through several apertures of a substrate. Also, the molding tool is positioned with respect to the substrate such that the material from the molding tool flows from an interior region of the substrate to an exterior region of the substrate via the several apertures. Accordingly, each aperture extends from an opening of the interior region and to an opening of the exterior region of the substrate. In some cases, the apertures may include a conical shape. For example, the opening in the interior region may include a diameter greater than a diameter of the opening in the exterior region. In this manner, the material, when cured, is mechanically secured to the substrate.

公开(公告)号：US20160259366A1

公开(公告)日：2016-09-08

申请号：US15028847

申请日：2013-10-23

申请人： APPLE INC.

发明人： Kevin M. Kenney ,  Nicholas A. Rundle ,  Adam T. Garelli ,  Sarah J. Montplaisir ,  Matthew W. Crowley ,  Dinesh C. Mathew

IPC分类号： G06F1/16 ,  H04N5/64 ,  G06F1/20

CPC分类号： G06F1/1601 ,  G06F1/20 ,  G06F1/203 ,  H04N5/64

摘要： An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

摘要翻译： 电子设备可以设置有显示器。 显示器可以安装在具有多个显示器外壳层的显示器壳体中。 显示器外壳层可以包括金属层和纤维复合层。 纤维复合显示器壳体层可以具有凹坑阵列。 纤维复合材料显示器外壳层可以使用粘合剂附接到平面金属层。 可以在金属层中形成开口阵列以减轻显示器外壳。 泡沫层或其它芯可以夹在显示器外壳层之间。 组分可以嵌入泡沫中。 边缘构件可以沿着显示器外壳层的周边边缘延伸。 电气部件可以安装在印刷电路上并且容纳在显示器壳体中的空腔内。 电气部件可以包括用于显示器的发光二极管。 来自电气部件的热可以在金属层中消散。