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    INTERNAL MOLD RELEASE
    3.
    发明申请
    INTERNAL MOLD RELEASE 审中-公开
    内部模具发布

    公开(公告)号：US20130126073A1

    公开(公告)日：2013-05-23

    申请号：US13626552

    申请日：2012-09-25

    Applicant: Apple Inc.

    Inventor： Kevin M. Kenney

    IPC: B05D5/00 ,  C08K7/06 ,  B29C65/70 ,  B05D3/00 ,  B29C43/02 ,  C08L63/00 ,  B05D3/02

    CPC classification number: B29C37/0067 ,  B29C70/46 ,  B29C70/50 ,  B29C2035/0827 ,  Y10T156/1002

    Abstract: A method of manufacturing a releasable composite prepreg for compression, sheet, or bulk molding. The method includes mixing together a resin and a curing agent, adding a release agent to the resin and curing agent creating a releasable epoxy, applying a backing to the releasable epoxy; and positioning a plurality of fibers within the releasable epoxy creating a releasable composite prepreg. The releasable composite prepreg created through the method can be molded to create components without requiring application of an external mold release agent.

    Abstract translation: 一种制造用于压缩，片材或块状模制的可释放复合预浸料的方法。 该方法包括将树脂和固化剂混合在一起，向树脂中加入脱模剂和固化剂，形成可释放的环氧树脂，将背衬施加到可释放的环氧树脂上; 并将多根纤维定位在可释放的环氧树脂内，形成可释放的复合预浸料。 通过该方法制备的可释放的复合预浸料可以被模制以产生组分，而不需要使用外部脱模剂。

    Electronic device with an increased flexural rigidity
    4.
    发明授权
    Electronic device with an increased flexural rigidity 有权

    公开(公告)号：US10398042B2

    公开(公告)日：2019-08-27

    申请号：US13764721

    申请日：2013-02-11

    Applicant: Apple Inc.

    Inventor： Kevin M. Kenney

    IPC: H05K5/02 ,  G06F1/16

    Abstract: An electronic device including at least one electronic component, such as a processor and a housing enclosing the at least one electronic component. The housing including a top skin forming an outer surface of the housing, a bottom skin forming an inner surface of the housing and facing the at least one electronic component, and a core sandwiched by the top skin and the bottom skin. The core is made from a first material having a first modulus of elasticity and the top skin and the bottom skin are made from a second material having a second modulus of elasticity, the second modulus greater than the first. The inner surface of the housing is positioned above the at least one electronic component such that a clearance level is defined between the inner surface of the housing and the at least one electronic component.

    INTEGRATED SPEAKERS
    6.
    发明申请
    INTEGRATED SPEAKERS 有权
    综合演讲者

    公开(公告)号：US20160088379A1

    公开(公告)日：2016-03-24

    申请号：US14495777

    申请日：2014-09-24

    Applicant: Apple Inc.

    Inventor： G. Kyle Lobisser ,  Jason S. Keats ,  Ryan J. Mihelich ,  Pablo Seoane Vieites ,  Kevin M. Kenney ,  John Raff ,  Erik A. Uttermann ,  Melody L. Kuna ,  Oliver C. Ross

    IPC: H04R1/02 ,  H04R31/00

    CPC classification number: H04R1/2888 ,  H04R1/2834 ,  H04R2201/029 ,  H04R2499/11

    Abstract: An enclosure for an electronic device is enclosed. The enclosure includes rib structures configured to improve structural support to prevent damage and to dissipate vibration throughout the enclosure. The rib structure can receive a speaker module and a cap member. The rib structure and the speaker module can combine to form a three-dimensional volume allowing the speaker module in which the speaker module may project sound, thereby enhancing acoustic performance. Also, the cap member may be adhesively attached to the rib structure to provide additional structural support against vibration and abuse caused by load forces associated with a drop event.

    Abstract translation: 封闭电子设备外壳。 外壳包括构造成改善结构支撑以防止损坏并消散整个外壳的振动的肋结构。 肋结构可以接收扬声器模块和盖构件。 肋结构和扬声器模块可以组合形成三维体积，从而允许扬声器模块可以投影声音的扬声器模块，从而增强声学性能。 此外，盖构件可以粘合地附接到肋结构，以提供抵抗由与落下事件相关联的负载力引起的振动和滥用的附加结构支撑。

    Co-molded ceramic and polymer structure
    7.
    发明授权
    Co-molded ceramic and polymer structure 有权

    公开(公告)号：US10463125B2

    公开(公告)日：2019-11-05

    申请号：US15694948

    申请日：2017-09-04

    Applicant: Apple Inc.

    Inventor： David I. Nazzaro ,  Joseph C. Poole ,  Kevin M. Kenney ,  Naoto Matsuyuki

    IPC: B65D41/28 ,  A45C11/00 ,  B29C45/14 ,  B29K709/02 ,  B29K101/12 ,  B29L31/34 ,  B29K101/10

    Abstract: A method of manufacturing a co-molded housing component for an electronic device is disclosed. A component formed from a ceramic material is placed in a mold. The mold comprises a first section defining a first cavity configured to receive the first component, and a second section defining a second cavity that is in communication with the first cavity when the mold is closed. The second cavity is in the shape of a feature that is to be joined to the ceramic material. A polymer material is injected into the second cavity, thereby forming the feature from the polymer material and bonding the feature to the ceramic material. The polymer material is cured. The first component and the feature together form the housing component for an electronic device.

    Electronic device with composite display housing
    8.
    发明授权
    Electronic device with composite display housing 有权

    公开(公告)号：US10437282B2

    公开(公告)日：2019-10-08

    申请号：US15028847

    申请日：2013-10-23

    Applicant: Apple Inc.

    Inventor： Kevin M. Kenney ,  Nicholas A. Rundle ,  Adam T. Garelli ,  Sarah J. Montplaisir ,  Matthew W. Crowley ,  Dinesh C. Mathew

    IPC: G06F1/16 ,  G06F1/20 ,  H04N5/64

    Abstract: An electronic device may be provided with a display. The display may be mounted in a display housing having multiple display housing layers. The display housing layers may include metal layers and fiber composite layers. A fiber composite display housing layer may have an array of dimples. The fiber composite display housing layer may be attached to a planar metal layer using adhesive. An array of openings may be formed in the metal layer to lighten the display housing. A foam layer or other core may be sandwiched between display housing layers. Components may be embedded in the foam. Edge members may run along peripheral edges of the display housing layers. Electrical components may be mounted on printed circuits and housed within cavities in the display housing. The electrical components may include light-emitting diodes for a display. Heat from the electrical components may be dissipated in the metal layer.

    Uni-directional fiber composite structure
    9.
    发明授权
    Uni-directional fiber composite structure 有权
    单向纤维复合结构

    公开(公告)号：US08790758B2

    公开(公告)日：2014-07-29

    申请号：US13725891

    申请日：2012-12-21

    Applicant: Apple Inc.

    Inventor： Kevin M. Kenney ,  Robert Michael Merritt ,  Andrew D. Lauder ,  Santhana K. Balaji ,  Jared A. Sartee

    IPC: A47G19/22 ,  B29D22/00

    CPC classification number: H04B1/3888 ,  A45C11/00 ,  A45C2011/003 ,  B29C65/02 ,  B29C65/18 ,  B29C65/7802 ,  B32B5/12 ,  B32B37/12 ,  B32B2305/22 ,  B32B2457/00 ,  B65D25/00 ,  G06F1/16 ,  G06F1/1628 ,  G06F2200/1633 ,  Y10T29/49801 ,  Y10T428/1314 ,  Y10T428/1362

    Abstract: An accessory unit includes a front flap and a rear cover. The rear cover includes a recessed portion that defines a chamber and a frame that extends about an opening of the chamber. The chamber is configured to receive a consumer electronic device, and the frame is configured to hold the consumer electronic device therein. For example, the frame may define a multi-sided cross-section with an inner edge thereof configured to engage a chamfered edge of the consumer electronic device. The front flap may include segments formed from panels with folding regions therebetween, which allow the front flap to fold. Further, an end region of the front flap hingedly couples the front flap to the rear cover, such that the front flap may be moved between open and closed configurations.

    Abstract translation: 附件单元包括前挡板和后盖。 后盖包括限定腔室的凹部和围绕腔室的开口延伸的框架。 腔室被配置为接收消费者电子设备，并且框架被配置为将消费者电子设备保持在其中。 例如，框架可以限定多边形横截面，其内边缘被配置为接合消费电子设备的倒角边缘。 前挡板可以包括由其间具有折叠区域的面板形成的段，其允许前挡板折叠。 此外，前翼片的端部区域将前翼板铰接地联接到后盖，使得前翼片可以在打开和关闭构造之间移动。

    ELECTRONIC DEVICE WITH AN INCREASED FLEXURAL RIGIDITY
    10.
    发明申请
    ELECTRONIC DEVICE WITH AN INCREASED FLEXURAL RIGIDITY 审中-公开
    具有增加的弯曲刚度的电子设备

    公开(公告)号：US20130148288A1

    公开(公告)日：2013-06-13

    申请号：US13764721

    申请日：2013-02-11

    Applicant: Apple, Inc.

    Inventor： Kevin M. Kenney

    IPC: H05K5/02 ,  G06F1/16

    CPC classification number: H05K5/0217 ,  G06F1/16 ,  G06F1/1656 ,  Y10T29/49 ,  Y10T428/13 ,  Y10T428/1352

    Abstract: An electronic device including at least one electronic component, such as a processor and a housing enclosing the at least one electronic component. The housing including a top skin forming an outer surface of the housing, a bottom skin forming an inner surface of the housing and facing the at least one electronic component, and a core sandwiched by the top skin and the bottom skin. The core is made from a first material having a first modulus of elasticity and the top skin and the bottom skin are made from a second material having a second modulus of elasticity, the second modulus greater than the first. The inner surface of the housing is positioned above the at least one electronic component such that a clearance level is defined between the inner surface of the housing and the at least one electronic component.

    Abstract translation: 一种电子设备，包括至少一个电子部件，例如处理器和封装至少一个电子部件的壳体。 所述壳体包括形成所述壳体的外表面的顶部皮肤，形成所述壳体的内表面并面向所述至少一个电子部件的底部皮肤以及被所述顶部皮肤和所述底部皮肤夹持的芯部。 芯由具有第一弹性模量的第一材料制成，并且顶部皮肤和底部皮肤由具有第二弹性模量的第二材料制成，第二模量大于第一弹性模量。 壳体的内表面定位在至少一个电子部件上方，使得在壳体的内表面和至少一个电子部件之间限定间隙高度。

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